公开(公告)号：US20130120993A1

公开(公告)日：2013-05-16

申请号：US13600352

申请日：2012-08-31

Applicant: Hua-Chen Fan ,  Te-Hen Lo ,  Cheng-Wei Chang

Inventor： Hua-Chen Fan ,  Te-Hen Lo ,  Cheng-Wei Chang

IPC: H05K7/06 ,  F21S4/00

CPC classification number: H05K1/0296 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09772 ,  H05K2201/10106

Abstract: A circuit board circuit apparatus and a light source apparatus including a substrate, a circuit layer, and at least one electronic component are disclosed. The circuit layer is formed on a surface of the substrate. The circuit layer includes a first circuit and a second circuit which are coplanar-disposed. The at least one electronic component is disposed on the circuit layer and connected with the circuit layer. Each electronic component has a first contact and a second contact. At least a part of the second circuit is disposed between the at least one electronic component and the first circuit. The at least one electronic component crosses over the second circuit, so that the second circuit penetrates through the bottom of the electronic component between the first contact and the second contact.

Abstract translation: 公开了一种电路板电路装置和包括基板，电路层和至少一个电子部件的光源装置。 电路层形成在基板的表面上。 电路层包括共面布置的第一电路和第二电路。 至少一个电子部件设置在电路层上并与电路层连接。 每个电子部件具有第一接触和第二接触。 第二电路的至少一部分设置在至少一个电子部件和第一电路之间。 所述至少一个电子部件跨越所述第二电路，使得所述第二电路在所述第一触点和所述第二触点之间穿过所述电子部件的底部。

公开(公告)号：US20120262885A1

公开(公告)日：2012-10-18

申请号：US13358540

申请日：2012-01-26

Applicant: Yasuhiro IKEDA ,  Yutaka Uematsu ,  Satoshi Muraoka

Inventor： Yasuhiro IKEDA ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC: H05K1/18

CPC classification number: H05K1/0243 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/09227 ,  H05K2201/09772 ,  H05K2201/10545 ,  H05K2201/10689

Abstract: Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.

Abstract translation: 提供了一种使用具有高包装密度的低成本电路板的信号传输电路，但是能够减少信号线之间的串扰噪声并且还减少由于短截线引起的反射噪声。 本发明的信号传输电路被配置为使得电子部件和通孔过孔的引线端子分别通过表面布线彼此连接，以便不允许从通孔过孔的中间分支。 此外，连接第一电子部件的第一布线分别布置在连接第二电子部件的相应的一对第二布线之间，并且信号通过交错传输通过第一布线和第二布线传输。

公开(公告)号：US07649499B2

公开(公告)日：2010-01-19

申请号：US12109521

申请日：2008-04-25

Applicant: Kunihiro Watanabe

Inventor： Kunihiro Watanabe

IPC: H01Q1/38 ,  H01Q1/52

CPC classification number: H01Q1/526 ,  H01L24/48 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01Q9/0485 ,  H01Q23/00 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09772 ,  H05K2201/10242 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.

Abstract translation: 在高频模块中，天线装置设置在第二基板的第一主表面上，第一基板的第一主表面和第二基板的第二主表面彼此面对并且通过导电 连接构件，包括IC芯片的电子部件安装在第一基板的第一主表面上，接地电极设置在第一和第二基板上，导电连接构件连接到接地电位，因此IC芯片被包围 通过第一和第二基板的接地电极和导电连接构件。

公开(公告)号：US20090229871A1

公开(公告)日：2009-09-17

申请号：US12362986

申请日：2009-01-30

Applicant: Masaaki TOGASHI

Inventor： Masaaki TOGASHI

IPC: H05K1/18 ,  H01G4/35

CPC classification number: H01G4/35 ,  H01G4/228 ,  H05K1/0231 ,  H05K2201/09772 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A feedthrough capacitor has: a capacitor element body of a substantially rectangular parallelepiped shape in which a plurality of insulator layers are laminated together; a signal internal electrode arranged in the capacitor element body; a ground internal electrode arranged in the capacitor element body and opposed to the signal internal electrode; signal terminal electrodes connected to the signal internal electrode; and a ground terminal electrode connected to the ground internal electrode. The signal terminal electrodes are provided on first and second end faces, respectively, in a longitudinal direction of the capacitor element body. The ground terminal electrode is provided on at least one side face out of first to fourth side faces extending along the longitudinal direction of the capacitor element body. Furthermore, the ground terminal electrode is located nearer at least one end face out of the first end face and the second end face.

Abstract translation: 旁路电容器具有：大致长方体形状的电容器元件体，其中多个绝缘体层层叠在一起; 布置在所述电容器元件主体中的信号内部电极; 布置在电容器元件主体中并与信号内部电极相对的接地内部电极; 信号端子电极连接到信号内部电极; 以及连接到接地内部电极的接地端子电极。 信号端子电极分别设置在电容器元件主体的纵向上的第一和第二端面上。 接地端子电极设置在沿着电容器元件主体的纵向方向延伸的第一至第四侧面中的至少一个侧面上。 此外，接地端子电极位于比第一端面和第二端面更靠近的至少一个端面。

公开(公告)号：US20090218121A1

公开(公告)日：2009-09-03

申请号：US12393642

申请日：2009-02-26

Applicant: Norihiro ISHII

Inventor： Norihiro ISHII

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K3/305 ,  H01L2224/32225 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/09772 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads; coating surfaces of the plurality of electrode pads and surfaces of the through holes on an one side of the printed wiring board with a bonding material; mounting a semiconductor package on the printed wiring board such that a plurality of bumps on a surface of the semiconductor package corresponds to the plurality of electrode pads; bonding the bumps to the electrode pads by heating the printed wiring board on which the semiconductor package is mounted; and filling a space between the semiconductor package and the printed wiring board with a filler material.

Abstract translation: 一种印刷电路板的制造方法。 该方法包括：制备印刷线路板，印刷线路板包括通孔和多个电极焊盘; 在印刷电路板的一侧用接合材料涂覆多个电极焊盘的表面和通孔的表面; 将半导体封装安装在所述印刷电路板上，使得所述半导体封装的表面上的多个凸块对应于所述多个电极焊盘; 通过加热其上安装有半导体封装的印刷线路板将凸块接合到电极焊盘; 以及用填充材料填充半导体封装和印刷线路板之间的空间。

公开(公告)号：US20080156521A1

公开(公告)日：2008-07-03

申请号：US11960979

申请日：2007-12-20

Applicant: Jun Karasawa ,  Syuji Hiramoto

Inventor： Jun Karasawa ,  Syuji Hiramoto

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/82385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: According to one embodiment, a printed wiring board includes a plurality of pads to which bumps are to be bonded respectively. The pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of the bumps, and the plurality of conductors define a gap therebetween, the gap being capable of receiving part of the one of the bumps.

Abstract translation: 根据一个实施例，印刷布线板包括分别焊接凸块的多个焊盘。 焊盘各自形成有多个导体，导体彼此分离并对应于凸块之一，并且多个导体在其间限定间隙，该间隙能够容纳一个凸块中的一个。

公开(公告)号：US20080047738A1

公开(公告)日：2008-02-28

申请号：US11878787

申请日：2007-07-26

Applicant: Tomoya Kanehira

Inventor： Tomoya Kanehira

IPC: H05K1/03

CPC classification number: H05K1/18 ,  H05K2201/09363 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1003

Abstract: A printed wiring board is used as a printed circuit board of various kinds of electronic devices, and has a part on which a coil is mounted. A metallic pattern area such as a copper foil is formed in a coil vicinity area including the part on which said at least coil is mounted, on the printed wiring board. The metallic pattern area is divided into plural areas in a direction of a coil current flowing in the coil. Thereby, a loop current is not generated in the same direction as that of the coil current in the metallic pattern area.

Abstract translation: 印刷电路板用作各种电子设备的印刷电路板，并且具有安装有线圈的部分。 在包括安装有至少线圈的部分的线圈附近区域中，在印刷线路板上形成诸如铜箔的金属图案区域。 金属图案区域沿着在线圈中流动的线圈电流的方向分成多个区域。 由此，在与金属图案区域的线圈电流相同的方向上不产生回路电流。

公开(公告)号：US20070075432A1

公开(公告)日：2007-04-05

申请号：US11309266

申请日：2006-07-21

Applicant: Sheng-Yun Shu

Inventor： Sheng-Yun Shu

IPC: H01L23/48

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K1/114 ,  H05K2201/09236 ,  H05K2201/09772 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board (PCB) with a differential pair arrangement includes a mounting area for receiving a chip, a plurality of first pads located near one edge of the mounting area, a plurality of second pads located near an opposite edge of the mounting area, the first pads and the second pads are arranged for receiving pins of the chip. A pair of vias is used for connecting layers of the PCB. The second pads are located between the vias and the mounting area. A differential pair includes two signal traces, one of the signal traces is connected to one of the first pads and routed to one of the vias through the mounting area, the other of the signal traces is routed through the mounting area and connected to one of the second pads and then routed to the other one of the vias.

Abstract translation: 具有差分对布置的印刷电路板（PCB）包括用于接收芯片的安装区域，位于安装区域的一个边缘附近的多个第一焊盘，位于安装区域的相对边缘附近的多个第二焊盘， 第一焊盘和第二焊盘被布置成用于接收芯片的引脚。 一对通孔用于连接PCB的层。 第二焊盘位于通孔和安装区域之间。 差分对包括两个信号迹线，其中一个信号迹线连接到第一个焊盘中的一个，并通过安装区域路由到通孔中的一个，另一条信号迹线通过安装区域连接到 第二个垫，然后路由到另一个通孔。

公开(公告)号：US20060284698A1

公开(公告)日：2006-12-21

申请号：US11154934

申请日：2005-06-15

Applicant: Risto Vaisanen

Inventor： Risto Vaisanen

IPC: H01P5/10

CPC classification number: H01P5/10 ,  H01P3/088 ,  H03F3/26 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09772 ,  H05K2201/10674

Abstract: A signal carrying microstrip (510) is an integral part of the passive part (502) or the active part (501) of an RF-IC (integrated circuit carrying radio frequency signals). The ground plane (511) is an integral part of the base plate (503) of an RF-IC. The distance (h) between the microstrip (510) and the ground plane (511) is determined by the geometrical properties of the passive or the active part, of the base plate, and of the elements that act as spacers between the passive or active part and the base plate. The inventive microstrip structure allows the use of microstrips with different widths in an RF-IC without compromising the other important electrical characteristics like impedance level and inductive coupling. This opens the door for constructing a balun integrated into an RF-IC being able to e.g. make an impedance matching between different impedance levels.

Abstract translation: 携带信号的微带线（510）是RF-IC（承载射频信号的集成电路）的无源部分（502）或有源部分（501）的组成部分。 接地平面（511）是RF-IC的基板（503）的组成部分。 微带线（510）和接地平面（511）之间的距离（h）由基板的被动或有源部分和作为被动或有源的间隔物的元件的几何特性决定 部分和底板。 本发明的微带结构允许在RF-IC中使用具有不同宽度的微带，而不会损害诸如阻抗水平和电感耦合的其他重要电气特性。 这打开了构建一个集成到RF-IC中的平衡 - 不平衡变换器的门， 在不同阻抗水平之间进行阻抗匹配。

公开(公告)号：US07019970B2

公开(公告)日：2006-03-28

申请号：US11120979

申请日：2005-05-04

Applicant: Atsuko Tanaka ,  Masuo Ohnishi

Inventor： Atsuko Tanaka ,  Masuo Ohnishi

IPC: H05K7/20

CPC classification number: H05K1/0272 ,  G06F1/203 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/09772 ,  H05K2201/09781 ,  H01L2924/00

Abstract: A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.