公开(公告)号：US20230311172A1

公开(公告)日：2023-10-05

申请号：US18094344

申请日：2023-01-06

Applicant: SEMES CO., LTD.

Inventor： Sung Hun EOM ,  Tae Won YUN

IPC: B08B3/12 ,  B08B3/08

CPC classification number: B08B3/123 ,  B08B3/08

Abstract: A substrate processing apparatus includes a substrate support unit, supporting a substrate, and an ultrasonic cleaning module disposed in a location lower than an upper surface of the substrate support unit. The ultrasonic cleaning module may include a receiving portion receiving a chemical, an opening portion in which at least a portion of an upper surface of the receiving portion is opened, and an ultrasonic vibration unit disposed to be directed toward the opening portion from the receiving portion, and may be configured in such a manner that a liquid surface of the chemical, rising by the ultrasonic vibration unit, touches the substrate through the opening portion.

公开(公告)号：US11774960B2

公开(公告)日：2023-10-03

申请号：US17404937

申请日：2021-08-17

Applicant: SEMES CO., LTD.

Inventor： Seung Hyen Kim

IPC: G05D1/00 ,  G05D1/02 ,  H04W24/04 ,  H04W4/40

CPC classification number: G05D1/0022 ,  G05D1/0212 ,  G05D1/0276 ,  H04W4/40 ,  H04W24/04 ,  G05D2201/0216

Abstract: A method of operating a vehicle control device for an article transport system in a production factory include identifying a first access point that is disabled from communicating with the vehicle control device among access points for performing wireless communication with respective vehicles in the production factory, identifying a first vehicle positioned in a disabled communication region corresponding to a coverage of the first access point, and transmitting a first message, which is intended to be transmitted to the first vehicle, to a second vehicle connected to a second access point and transmitting a second message for instructing the second vehicle to move to the disabled communication region.

公开(公告)号：US20230292404A1

公开(公告)日：2023-09-14

申请号：US18162229

申请日：2023-01-31

Applicant: SEMES CO., LTD.

Inventor： Jong Seok SEO

IPC: H05B3/00 ,  H01L21/67 ,  B23K26/351 ,  H01C17/22 ,  H01C17/06 ,  C25D7/00

CPC classification number: H05B3/0014 ,  H01L21/67103 ,  B23K26/351 ,  H01C17/22 ,  H01C17/06 ,  C25D7/00 ,  H05B2203/017

Abstract: An apparatus for treating a substrate is provided. The apparatus includes: a support member provided in a process chamber and configured to support the substrate; and a heater heating element provided in the support member and configured to heat the substrate, wherein at least a part of the heater heating element comprises a first region to which a laser trimming process is applied, at least another part of the heater heating element comprises a second region on which a resistance adjusting material layer is implemented by an electrolytic plating process, and the amount of heat generated in the first region that is at least a part of the heater heating element is increased by performing the laser trimming process and the amount of heat generated in the second region that is at least another part of the heater heating element is decreased by forming the resistance adjusting material layer.

公开(公告)号：US20230288811A1

公开(公告)日：2023-09-14

申请号：US18310704

申请日：2023-05-02

Applicant: SEMES CO, LTD.

Inventor： Moon Hyung BAE ,  Hye Bin BAEK ,  Youngseo AN ,  Euntark LEE ,  Min Jung PARK ,  Seunghan LEE ,  Jung-Hyun LEE

IPC: G03F7/16 ,  H01L21/687 ,  H01L21/67

CPC classification number: G03F7/167 ,  H01L21/68742 ,  H01L21/67017 ,  H01L21/67103

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

公开(公告)号：US20230286713A1

公开(公告)日：2023-09-14

申请号：US17693807

申请日：2022-03-14

Applicant: SEMES CO., LTD.

Inventor： Hyun YOON ,  Ho Jong HWANG ,  Young Jin KIM

IPC: B65D65/38 ,  B08B3/02 ,  B08B13/00

CPC classification number: B65D65/38 ,  B08B3/022 ,  B08B13/00

Abstract: The present invention relates to a bowl including a collection container having an inner surface, and an outer surface disposed opposite to the inner surface, in which a pattern is formed on the inner surface.

公开(公告)号：US11740186B2

公开(公告)日：2023-08-29

申请号：US17406784

申请日：2021-08-19

Applicant: SEMES CO., LTD.

Inventor： Myoung Hoon Woo

IPC: G01N21/95 ,  G01N21/956 ,  G06T7/00 ,  G01N21/88 ,  G06T7/11

CPC classification number: G01N21/95607 ,  G01N21/8806 ,  G01N21/9501 ,  G06T7/001 ,  G06T7/11 ,  G01N2021/8887 ,  G06T2207/30148

Abstract: An image acquiring method, an image acquiring apparatus and a wafer inspection apparatus are disclosed. A line scan camera is disposed above a transfer path of a wafer to continuously acquire partial images having a predetermined size by imaging a scan area including a portion of the transfer path, and the partial images are stored in an image storage unit. A partial image including a predetermined feature point among the partial images is detected by an image analysis unit, and an image merging unit merges a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer. An image inspection unit analyzes the entire image of the wafer to detect defects in the wafer.

公开(公告)号：US20230215750A1

公开(公告)日：2023-07-06

申请号：US17970041

申请日：2022-10-20

Applicant: SEMES CO., LTD.

Inventor： Sunggun CHAE

IPC: H01L21/677 ,  G05B19/402 ,  G01B5/14 ,  G05D3/20

CPC classification number: H01L21/67736 ,  H01L21/67733 ,  H01L21/67724 ,  H01L21/6773 ,  H01L21/67706 ,  G05B19/402 ,  G01B5/14 ,  G05D3/20 ,  G05B2219/49113

Abstract: Provided are an alignment jig, a side track buffer system including the same, and an alignment method using the same. The alignment jig includes a horizontal jig fixed to a bottom plate of a side track buffer to extend in a horizontal direction to a lower portion of the transfer rail, and a vertical jig fixed to the transfer rail to extend downward in a vertical direction so as to be adjacent to a top surface in the horizontal direction. A separation distance between an intersection point of the vertical jig and the horizontal jig and a central portion of the bottom plate is detected as a buffer separation distance, and a buffer frame is horizontally moved automatically or manually to allow the buffer separation distance to match a reference separation distance, so that the side track buffer is installed in an accurate position.

公开(公告)号：US20230215745A1

公开(公告)日：2023-07-06

申请号：US17990819

申请日：2022-11-21

Applicant: SEMES CO., LTD.

Inventor： Woo Sin JUNG ,  Young CHOI ,  Dae Sung KIM ,  Hae Kyung KIM ,  Dongwoon PARK

IPC: H01L21/67

CPC classification number: H01L21/6715

Abstract: A liquid trap tank and a liquid supply unit for the liquid trap tank are provided. The liquid trap tank includes a tank body which has an accommodating space formed therein to accommodate a liquid and has an inlet portion formed on one side and an outlet portion formed on an opposite side; and a liquid supply unit coupled to the inlet of the tank body to supply the liquid from the outside of the tank body to the accommodating space, wherein the liquid supply unit comprises an inlet pipe portion coupled to the inlet portion to introduce the liquid into the accommodating space and a flow directing portion connected to the inlet pipe portion and configured to induce a flow of the liquid to suppress generation of air bubbles due to a drop of the liquid passing through the inlet pipe portion.

公开(公告)号：US20230213867A1

公开(公告)日：2023-07-06

申请号：US18147469

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Tae Hee KIM ,  Ji Hoon JEONG ,  Tae Shin KIM ,  Young Dae CHUNG ,  Young Eun JEON

IPC: G03F7/20

CPC classification number: G03F7/70191 ,  G03F7/70025

Abstract: The inventive concept provides a mask treatment apparatus. The mask treatment may include a support unit that supports the mask, and a light irradiation unit that irradiate the mask with a light to adjust a critical dimension of a pattern formed in the mask, wherein the light irradiation unit includes a light source that generates the light, and a light modulation element that modulates the light generated by the light source and forms an irradiation pattern.

公开(公告)号：US20230213852A1

公开(公告)日：2023-07-06

申请号：US18148051

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Young Dae Chung ,  Hyun Yoon

IPC: G03F1/78 ,  G03F1/70

CPC classification number: G03F1/78 ,  G03F1/70

Abstract: Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.