摘要:
A sheet transport device and an image forming apparatus using the sheet transport device are disclosed. The sheet transport device includes a transport belt rotating around rollers that transports a sheet by attaching the sheet to the transport belt by an electrostatic force, and a charging unit that is unitized by including a charging member for charging the transport belt. The charging unit includes a unit case containing springs for pushing the charging member onto the transport belt. An Ac bias voltage is applied to the transport belt via the charging member.
摘要:
An image forming apparatus is disclosed. The image forming apparatus includes a transport belt rotating around rollers that transports a sheet by attaching the sheet thereto by an electrostatic force, an image forming unit which forms an image on the sheet transported by the transport belt by ejecting ink droplets from a recording head onto the sheet, and an duplex print unit which reverses the sheet, the first side of which has been printed, so as to form an image on the second side of the sheet. The apparatus stops the transportation of the sheet to the image forming unit after the image is formed on the first side of the sheet and before the image is formed on the second side of the sheet until at least the tip of the second side of the sheet is not apart from the transport belt.
摘要:
A semiconductor device includes a first power supply terminal, a second power supply terminal, a comparison circuit coupled to the first power supply terminal and the second power supply terminal to produce at an output node thereof a signal responsive to a difference between a potential of the first power supply terminal and a potential of the second power supply terminal, and a core circuit coupled to the output node of the comparison circuit to perform a test operation in response to the signal.
摘要:
According to the invention, an ultrasonic apparatus for therapeutical use suitable for remedy by the irradiation of an ultrasonic wave low in the degree of convergence using medicine that stays in a disease region, reduces the threshold of cavitation caused by an ultrasonic wave and secondarily generates active oxygen by the acoustic cavitation caused by the ultrasonic wave is provided. The ultrasonic apparatus for therapeutical use is provided with a belt wearable in a position (on the abdomen of a patient) that surrounds a diseased part and unit ultrasonic radiators can be mounted in an arbitrary position of the belt.
摘要:
A multilayer substrate according to the present invention includes a plurality of laminated insulating layers and conductive patterns formed between the respective insulating layers. The conductive patterns include a first conductive pattern having a predetermined thickness and a second conductive pattern thicker than the first conductive pattern. The first and second conductive patterns are located in the same layer. The first conductive pattern is formed by pattern-etching a conductive layer having a uniform thickness by the subtractive method. The second conductive pattern is formed by forming a pattern-forming groove and then filling the inside of the pattern-forming groove with a conductive material simultaneously with forming a via hole. The first conductive pattern is suitable for an LC pattern for a high-frequency circuit requiring small variations in the width and the thickness of the pattern as well as accuracy in the thickness relative to an insulating pattern, and for a normal conductive pattern requiring impedance matching. The second conductive pattern is suitable for an L pattern for a choke coil.
摘要:
A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
摘要:
A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 μm or smaller, particularly of around 60 μm.