公开(公告)号：US20040005813A1

公开(公告)日：2004-01-08

申请号：US10190466

申请日：2002-07-05

Inventor： David Donaldson ,  Alexis Neal ,  Paul Scott Nessman ,  Steven John Vargo

IPC: H01R009/05

CPC classification number: H05K3/306 ,  H01R13/5202 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/0761 ,  H05K2201/10166 ,  H05K2201/10424 ,  H05K2201/2036

Abstract: An apparatus for effecting an improved electrical connection structure between a first component and a second component in an installed orientation is advantageously employed where at least one of the components presents at least one electrical connection lead for establishing the electrical connection. The apparatus includes a mass of compressible dielectric material substantially fixedly situated between the first component and the second component in the installed orientation in substantially surrounding relation about the at least one electrical connection lead.

Abstract translation: 有利地采用一种用于在安装方向上实现第一部件和第二部件之间的改进的电连接结构的装置，其中至少一个部件呈现至少一个用于建立电连接的电连接引线。 该装置包括大体上固定地位于第一部件和第二部件之间的可压缩电介质材料，所述绝缘材料以所述至少一个电连接引线为基本环绕的方式安装在所述安装方向上。

公开(公告)号：US20020139576A1

公开(公告)日：2002-10-03

申请号：US09824506

申请日：2001-04-02

Inventor： Andrew Michael Cherniski ,  James Kristian Koch

IPC: H05K001/16

CPC classification number: H01L23/48 ,  H01L23/49562 ,  H01L23/49586 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/0761 ,  H05K2201/10166 ,  H05K2201/10424 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53183 ,  H01L2924/00

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract translation: 一种用于消除组装的衬底的导电污染可靠性问题的方法和装置，例如功率半导体引线中的电弧。 本发明的一个实施例涉及一种用于组装具有导体的电气部件的方法，所述导线在具有导电触点的基板上，其中弹性体部件封装电气部件的引线。 本发明的第二实施例涉及将具有导线的电气部件组装到具有导电触点的基板上，其中由冲压模切割的弹性体形状封装电气部件的引线。 本发明的第三实施例涉及包括具有引线的电气部件的组装的基板和围绕引线的弹性体以封装引线。

公开(公告)号：US06296897B1

公开(公告)日：2001-10-02

申请号：US09133029

申请日：1998-08-12

Applicant: John Joseph Konrad ,  Konstantinos I. Papathomas ,  Timothy Leroy Wells ,  James Warren Wilson

Inventor： John Joseph Konrad ,  Konstantinos I. Papathomas ,  Timothy Leroy Wells ,  James Warren Wilson

IPC: B05D512

CPC classification number: C23C18/1651 ,  C23C18/1844 ,  H05K3/184 ,  H05K3/244 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10T428/24917

Abstract: Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.

Abstract translation: 印刷电路板，卡片和芯片载体通过用溶胀剂处理已经电路化的基底，然后用含有碱性高锰酸盐，铬酸盐和/或亚氯酸盐的组合物处理电路化基底，然后施加金属层以涂覆电路化 部分基板。

公开(公告)号：US5207867A

公开(公告)日：1993-05-04

申请号：US852791

申请日：1992-03-17

Applicant: John L. Cordani

Inventor： John L. Cordani

IPC: H05K3/06 ,  H05K3/10 ,  H05K3/26

CPC classification number: H05K3/26 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K3/06 ,  H05K3/108

Abstract: After the stripping or etching away of metal to expose surface areas of insulating resin material in a printed circuit process based upon metal-clad insulating substrate material, the exposed surface areas of insulating material are contacted with a liquid treatment composition, comprised of an aqueous acidic solution containing fluoride ion, effective to remove from the surface areas residual metal species otherwise associated therewith, such that the surface insulation resistance afforded by the insulating surface areas of the printed circuit is improved.

Abstract translation: 在基于金属包覆的绝缘衬底材料的印刷电路工艺中剥离或蚀刻掉金属以露出绝缘树脂材料的表面区域之后，绝缘材料的暴露的表面积与液体处理组合物接触，所述液体处理组合物由酸性水溶液 含有氟离子的溶液，有效地从表面区域除去与其相关的残留金属物质，从而提高了印刷电路的绝缘表面积所提供的表面绝缘电阻。

公开(公告)号：US4874635A

公开(公告)日：1989-10-17

申请号：US177254

申请日：1988-04-04

Applicant: Bradley R. Karas ,  Donald F. Foust ,  William V. Dumas

Inventor： Bradley R. Karas ,  Donald F. Foust ,  William V. Dumas

IPC: C23C18/18 ,  H05K3/10 ,  H05K3/18 ,  H05K3/26

CPC classification number: H05K3/26 ,  C23C18/208 ,  C23C18/28 ,  C23C18/30 ,  H05K2201/0761 ,  H05K2203/0796 ,  H05K2203/1407 ,  H05K3/108 ,  H05K3/184

Abstract: A method for removing residual precious metal catalyst from a plastic, metal-plated surface is disclosed. The method involves the oxidation of the precious metal without degrading the plated metal or the plastic, followed by washing away the oxidized precious metal. This invention further includes methods for the plating of metal directly on the surface of a plastic substrate.

Abstract translation: 公开了一种从塑料，金属镀覆表面除去残留的贵金属催化剂的方法。 该方法涉及贵金属的氧化而不会使镀金属或塑料降解，随后将氧化的贵金属冲洗掉。 本发明还包括直接在塑料基板的表面上镀金属的方法。

公开(公告)号：US4654116A

公开(公告)日：1987-03-31

申请号：US669920

申请日：1984-11-09

Applicant: Edward T. Spacer

Inventor： Edward T. Spacer

IPC: C23F1/02 ,  H05K1/03 ,  H05K3/06 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  B44C1/22

CPC classification number: H05K3/067 ,  C23F1/02 ,  H05K3/26 ,  H05K1/034 ,  H05K2201/0761 ,  H05K2203/0723 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K3/244 ,  H05K3/386

Abstract: A method for producing high resolution etched circuit patterns from a metal clad laminate of a conductive species on a nonconductive substrate is provided. The laminate is etched with an etchant solution for the conductive species to form a circuit pattern. The etched laminate is contacted with an oxidizing agent and aqueous acid to remove redeposited conductive species from the exposed substrate adjacent the circuit pattern. The side walls of the resulting circuit pattern are substantially vertical and free of "halo".

Abstract translation: 提供了一种从非导电基底上的导电物质的金属覆层层压板制造高分辨率蚀刻电路图案的方法。 用导电物质的蚀刻剂溶液蚀刻层压体以形成电路图案。 将蚀刻的层压体与氧化剂和酸水接触以从邻近电路图案的暴露的基板去除再沉积的导电物质。 所得电路图案的侧壁基本垂直并且没有“晕”。

公开(公告)号：US20180084641A1

公开(公告)日：2018-03-22

申请号：US15704222

申请日：2017-09-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyasu NOTO ,  Yoshinori TAKENAKA

IPC: H05K1/03 ,  H01F27/245 ,  H05K3/46 ,  H01F27/28

CPC classification number: H05K1/0306 ,  H01F27/245 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0373 ,  H05K3/46 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0761 ,  H05K2201/0769

Abstract: A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that distance (T) between the first and second conductor layers is in the range of 4.5 μm to 10.5 μm. The resin insulating layer includes inorganic particles having average particle diameter (D1) such that ratio (D1/S) of the diameter (D1) to distance (S) of the space is less than 0.25 and that ratio (D1/T) of the diameter (D1) to the distance (T) is less than 0.25, where the distance (S) of the space between the first and second conductor circuits is in the range of 4.5 μm to 10.5.

公开(公告)号：US09601850B2

公开(公告)日：2017-03-21

申请号：US14388594

申请日：2013-03-22

Applicant: PHOENIX CONTACT GMBH & CO. KG

Inventor： Frank Best ,  Marco Seelig

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01R12/71 ,  H05K1/02 ,  H05K5/02 ,  H05K7/14 ,  H05K1/03 ,  H05K3/00 ,  H01R9/26

CPC classification number: H01R12/71 ,  H01R9/26 ,  H05K1/0256 ,  H05K1/0306 ,  H05K3/0011 ,  H05K5/0247 ,  H05K7/1469 ,  H05K2201/0761 ,  H05K2201/09063 ,  H05K2201/10189 ,  Y10T29/49124

Abstract: The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising the printed circuit board (2) and an insulation barrier (3), wherein the printed circuit board (2) has an opening (7) between the electric potentials, and the insulation barrier (3) is disposed on the printed circuit board (2) so as to be displaceble through the opening (7) and is designed such that the isolating distance between the two electric potentials can be enlarged by displacing the insulation barrier (3) relative to the printed circuit board (2). The arrangement makes it possible obtain a high packing density on the printed circuit board (2).

公开(公告)号：US20170039984A1

公开(公告)日：2017-02-09

申请号：US15185279

申请日：2016-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Yong JOO ,  Jin Hyung LEE

IPC: G09G5/00 ,  H02M1/42 ,  H02M3/335

CPC classification number: G09G5/00 ,  G06F3/147 ,  G09G2330/02 ,  G09G2330/04 ,  H02M1/4225 ,  H02M3/33553 ,  H02M2001/007 ,  H05K1/0256 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/0761 ,  H05K2201/09909 ,  Y02B70/126

Abstract: A power supply device of an electronic apparatus includes: a power input portion configured to receive alternating current (AC) power; a rectifier-smoother configured to rectify and smooth the received AC power and output the AC power; a power converter configured to convert a level of a voltage output from the rectifier-smoother to supply operating power to the electronic apparatus; a board on which the power input portion, the rectifier-smoother, and the power converter are provided; and a waterproof coating layer formed in an area on the board corresponding to a position of the power converter to prevent infiltration of moisture from an outside.

Abstract translation: 电子设备的电源装置包括：电力输入部，被配置为接收交流电（AC）电力; 整流器平滑器，被配置为整流和平滑所接收的AC电力并输出AC电力; 电力转换器，被配置为将从整流器平滑器输出的电压的电平转换为向电子设备提供工作电力; 设置有电力输入部，整流器平滑器和功率转换器的电路板; 以及防水涂层，其形成在与所述功率转换器的位置对应的板上的区域中，以防止水分从外部渗入。

公开(公告)号：US20160050749A1

公开(公告)日：2016-02-18

申请号：US14777043

申请日：2014-03-12

Applicant: G-SMATT CO., LTD.

Inventor： Ho Joon LEE ,  Hak Ryul SHIN ,  Sang Eun LEE

IPC: H05K1/02 ,  H05K3/06

CPC classification number: H05K1/0272 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/06 ,  H05K3/321 ,  H05K2201/0761 ,  H05K2201/09363 ,  Y02P70/611 ,  H01L2924/00

Abstract: Disclosed herein is a pattern safety device for preventing interference between patterns. In detail, a separately partitioned space is defined in an adhesion portion, which is formed on a plurality of patterns on the surface of a substrate so that a circuit element is placed on the adhesion portion, thus preventing interference between the patterns.

Abstract translation: 这里公开了用于防止图案之间的干扰的图案安全装置。 具体地说，在基板表面上的多个图案上形成的粘合部分中限定了分隔开的空间，从而将电路元件放置在粘合部分上，从而防止图案之间的干涉。