公开(公告)号：US6080932A

公开(公告)日：2000-06-27

申请号：US59662

申请日：1998-04-14

申请人： John W. Smith ,  Christopher M. Pickett

发明人： John W. Smith ,  Christopher M. Pickett

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor chip package includes a semiconductor chip having surfaces and contacts, a layer of a moisture-permeable material bonded to one surface of the chip and a moisture-impermeable encapsulant overlying the moisture-permeable material and at least partially surrounding the chip. The package has exposed exterior surfaces and terminals on at least one of the exposed exterior surfaces which are electrically connected to the contacts. The moisture-permeable material extends to at least one of the exposed exterior surfaces so that moisture may be vented through the moisture-permeable material and out of the package. In certain embodiments, the moisture-permeable material includes a compliant layer having silicone and the moisture-impermeable material includes an epoxy.

摘要翻译： 半导体芯片封装包括具有表面和触点的半导体芯片，结合到芯片的一个表面的透湿材料层和覆盖透湿材料并且至少部分地围绕芯片的不透水密封剂。 该封装在暴露的外表面中的至少一个电连接到触点的外表面和端子上。 透湿材料延伸到暴露的外表面中的至少一个，使得水分可以通过透湿材料排出并且脱离包装。 在某些实施例中，透湿材料包括具有硅树脂的柔顺层，并且不透水材料包括环氧树脂。

公开(公告)号：US5913109A

公开(公告)日：1999-06-15

申请号：US690532

申请日：1996-07-31

申请人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

发明人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.

摘要翻译： 在用于安装用于制造微电子部件的片状多层元件的方法中，首先将片状元件接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 然后将组件冷却，并将膨胀环切掉。 在另一个实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的端子焊盘的方法。 首先将微电子元件放置在刚性板上，将已经结合到框架环的片状元件放置在微电子元件上。 然后将盘放置在片状元件上，并且将力施加到盘上，使得片状元件上的接合焊盘与微电子元件上的端子焊盘接触。 然后施加热量，形成粘结。

公开(公告)号：US5486702A

公开(公告)日：1996-01-23

申请号：US125117

申请日：1993-09-21

申请人： John P. O'Connor ,  John W. Smith

发明人： John P. O'Connor ,  John W. Smith

IPC分类号： C23C14/48 ,  H01J37/317 ,  H01L21/265

CPC分类号： H01J37/3171

摘要： During ion implantation, beam heating of the substrates must be reduced to eliminate self-annealing of the wafers during implant and to eliminate damager to masking materials, principally photoresist, that is mounted on the surface of the wafers. In this work, we describe a technique which may be used with both single-wafer and batch ion implantation systems to reduce transient wafer temperatures during implant.

摘要翻译： 在离子注入期间，必须减少衬底的光束加热，以消除在植入期间晶片的自退火，并且消除掩蔽材料（主要是光致抗蚀剂），该材料安装在晶片的表面上。 在这项工作中，我们描述了可以与单晶片和批次离子注入系统一起使用的技术，以减少植入期间的晶片临时温度。

公开(公告)号：US5143558A

公开(公告)日：1992-09-01

申请号：US667464

申请日：1991-03-11

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： C21D9/00

CPC分类号： C21D9/0037 ,  C21D9/0018 ,  C21D9/0062

摘要： An integrated continuous/batch furnace system for heat treating metal parts combines a continuous furnace system and a batch furnace system. The continuous furnace system includes a preheat furnace, a rotary carburizing furnace, an equalize/diffusion furnace, an oil quench, a press quench chamber and a slow cooling chamber. The batch furnace system includes a temper furnace, a carburize/quench/slow cool furnace, and a washer. A parts tray system for holding parts to be heat treated includes a parts tray for transporting parts through the continuous furnace system, and a parts tray assembly for transporting parts through the batch furnace system. The parts tray assembly includes two parts trays detachably coupled together with rigid U-shaped alloy chips.A method for heat treating trays of parts in an integrated continuous/batch furnace system includes determining whether to heat treat the parts with the continuous furnace system or the batch furnace system. Trays of parts to be treated by the continuous furnace system are individually loaded into the continuous furnace system. Trays of parts to be treated with the batch furnace system are connected together with clips and delivered into the batch furnace system.A method for heat treating trays of parts in an integrated continuous/batch furnace system including treating the parts in a continuous furnace system, and washing and tempering the parts in a batch furnace system. Two parts trays are clipped together prior to washing and tempering the parts.

摘要翻译： 用于热处理金属部件的集成连续/间歇炉系统结合了连续炉系统和间歇炉系统。 连续炉系统包括预热炉，旋转渗碳炉，均质/扩散炉，油淬火，压力骤冷室和缓慢冷却室。 分批炉系统包括回火炉，渗碳/淬火/缓慢冷却炉和洗衣机。 用于保持要热处理的部件的部件托盘系统包括用于通过连续炉系统输送部件的部件托盘和用于通过间歇炉系统输送部件的部件托盘组件。 零件托盘组件包括可拆卸地与刚性U形合金芯片耦合在一起的两个托盘。 在一体化连续/间歇炉系统中热处理部件的托盘的方法包括确定是否用连续炉系统或间歇炉系统热处理部件。 由连续炉系统处理的部件托盘分别装载到连续炉系统中。 用批量炉系统处理的部件的托盘与夹子连接在一起并输送到间歇炉系统中。 一种用于热处理一体化连续/间歇炉系统中的部件的托盘的方法，包括在连续炉系统中处理部件，以及在间歇炉系统中洗涤和回火部件。 在清洗和回火零件之前，将两部分托盘夹在一起。

公开(公告)号：US5066838A

公开(公告)日：1991-11-19

申请号：US472723

申请日：1990-01-31

申请人： John W. Smith ,  Benjamin F. Chestnut

发明人： John W. Smith ,  Benjamin F. Chestnut

IPC分类号： H01H3/16

CPC分类号： H01H3/166

摘要： An automobile brake switch assembly including a mounting clip and two brake switches, each brake switch including a threaded, cylindrical plunger housing. The mounting clip includes two hollow, cylindrical sleeves, each having an inner diameter slightly larger than the outer diameter of the threads on one of the brake switches. The sleeves are integrally molded, together with a plate that joins them, out of acetal plastic. Each sleeve includes a thread-like tooth molded about the inner circumference and located approximately centrally in the cylinder. Four slots are formed in each sleeve parallel to and spaced about the cylindrical axis, the slots cutting the tooth to form four teeth. The slots permit expansion of the teeth when the threaded plunger housing of the corresponding brake switch is pressed into the sleeve so that the threads may ratchet on the teeth. The teeth and inner surface of the sleeve mate with the threads to firmly hold the brake switch without pressing into the walls of the brake switch plunger housing. A pair of ears integrally formed with each sleeve are adapted to fit into notches in an automobile brake pedal bracket for attaching the assembly to the bracket.

摘要翻译： 一种包括安装夹和两个制动开关的汽车制动开关组件，每个制动开关包括带螺纹的柱形柱塞壳体。 安装夹包括两个中空的圆柱形套筒，每个套筒的内径略大于其中一个制动开关上的螺纹的外径。 套管与连接它们的板一起成型，从缩醛塑料中成型。 每个套筒包括围绕内圆周模制并且大致位于气缸中心的线状齿。 在每个套管中形成有平行于并且围绕圆柱轴线间隔开的四个槽，所述槽切割牙齿以形成四个齿。 当相应的制动开关的螺纹柱塞壳体被压入套筒中时，这些槽允许齿的膨胀，使得螺纹可以在齿上棘轮。 套筒的齿和内表面与螺纹配合，以牢固地固定制动开关，而不会压入制动开关柱塞壳体的壁中。 与每个套筒一体形成的一对耳朵适于装配在汽车制动踏板支架中的凹口中，用于将组件附接到支架。

公开(公告)号：US4920193A

公开(公告)日：1990-04-24

申请号：US221434

申请日：1988-07-19

申请人： Richard A. Hann ,  David R. Holmes ,  John W. Smith

发明人： Richard A. Hann ,  David R. Holmes ,  John W. Smith

IPC分类号： C08J5/18 ,  B01D65/10 ,  B01D67/00 ,  B01D71/68 ,  B01D71/82 ,  C08G65/48 ,  C08J3/09

CPC分类号： C08J3/095 ,  B01D67/0011 ,  B01D69/02 ,  B01D71/68 ,  C08G65/48 ,  B01D2323/08 ,  B01D2323/12 ,  B01D2323/30 ,  C08J2381/06

摘要： An asymmetric membrane formed from a sulphonated polyarylethersulphone has a salt rejection of at least 99%. Alternatively, a membrane has a good salt rejection and an acceptable water flux such that the ratio ##EQU1## has the value of at least 0.7. The membranes can be obtained using barium salts of the sulphonated polyarylethersulphone, with the proportion of barium being controlled to be at least 85%, preferably at least 86%, and not more than 91%, preferably not more than 90% of the barium required to react with the sulphonic acid groups on the sulphonated polymer.

摘要翻译： 由磺化聚芳砜砜形成的非对称膜具有至少99％的耐盐析。 或者，膜具有良好的拒盐性和可接受的水通量，使得比值具有至少0.7的值。 可以使用磺化的聚芳基砜砜的钡盐来获得膜，钡的比例控制在所要求的钡的至少85％，优选至少86％，不超过91％，优选不超过90％ 与磺化聚合物上的磺酸基反应。

公开(公告)号：US4820419A

公开(公告)日：1989-04-11

申请号：US125144

申请日：1987-11-18

申请人： Brian N. Hendy ,  John W. Smith

发明人： Brian N. Hendy ,  John W. Smith

IPC分类号： C08L71/00 ,  B01D67/00 ,  B01D71/52 ,  B01D71/82 ,  C08J3/09 ,  B01D13/00

CPC分类号： C08J3/091 ,  B01D67/0011 ,  B01D67/0016 ,  B01D69/02 ,  B01D71/52 ,  B01D2325/022 ,  C08J2371/00

摘要： Solutions of sulphonated polyaryletherketones in a solvent mixture of at least three liquids or low melting solids which are non-solvents or poor solvents for the polymer, can be used to produce asymmetric semi-permeable membranes. The polymer may be a polymer of--Ph.sup.1 --O--Ph.sup.2 --O--Ph.sup.1 --CO--and optionally--Ph.sup.1 --O--Ph.sup.1 --CO--and--Ph.sup.1 --O--Ph.sup.1 --O--Ph.sup.1 13 COp13 p0wherein Ph.sup.1 and Ph.sup.2 are respectively unsulphonated and sulphonated phenylene residues. The components of the solvent mixture have specified solubility parameters. A suitable solvent mixture is one formed from water, 1,4-dioxane and acetonitrile.

公开(公告)号：US4592779A

公开(公告)日：1986-06-03

申请号：US588093

申请日：1984-03-09

申请人： James J. Russ ,  John W. Smith

发明人： James J. Russ ,  John W. Smith

IPC分类号： C22B7/00 ,  C22B11/00 ,  C22B11/08 ,  C22B11/10 ,  C22B3/00 ,  C22B11/04

CPC分类号： C22B11/04 ,  C22B11/08 ,  C22B11/10 ,  C22B7/008 ,  Y02P10/234

摘要： A method for recovering precious metals such as gold and silver from precious metal-bearing materials that include other solids comprises treating the precious metal-bearing materials with an aqueous, basic solution having a pH in the range of about 12 to about 14 for a time sufficient to suspend the precious metals in substantially free form in the solution, followed by recovery of precious metals from solids and from the solution by known methods.

摘要翻译： 从包含其他固体的贵重含金属材料中回收贵金属如金和银的方法包括用约12至约14范围内pH值的水性碱性溶液处理含贵金属的材料一段时间 足以使溶液中基本上游离形式的贵金属悬浮，然后通过已知方法从固体和溶液中回收贵金属。

公开(公告)号：USD808380S1

公开(公告)日：2018-01-23

申请号：US29560814

申请日：2016-04-11

申请人： John Dillon ,  Jim Ransco, II ,  John W. Smith

设计人： John Dillon ,  Jim Ransco, II ,  John W. Smith

公开(公告)号：US08633340B2

公开(公告)日：2014-01-21

申请号：US12736443

申请日：2009-04-09

申请人： John W. Smith ,  Claire McGuiness ,  Andrew P. Sharratt

发明人： John W. Smith ,  Claire McGuiness ,  Andrew P. Sharratt

IPC分类号： C07C19/08

CPC分类号： C07C17/204 ,  C07C17/04 ,  C07C17/206 ,  C07C17/25 ,  C07C17/275 ,  C07C19/08 ,  C07C19/10 ,  C07C21/18 ,  C07C21/04 ,  C07C19/01

摘要： The invention provides a process for preparing 1,1,1-trifluoro-2,3-dichloropropane (243db), which process comprises contacting 3,3,3-trifluoropropene (1243zf) with chlorine in the presence of a catalyst, wherein the catalyst comprises activated carbon, alumina and/or an oxide of a transition metal.

摘要翻译： 本发明提供了制备1,1,1-三氟-2,3-二氯丙烷（243db）的方法，该方法包括在催化剂存在下使3,3,3-三氟丙烯（1243zf）与氯接触，其中催化剂 包括活性炭，氧化铝和/或过渡金属的氧化物。