公开(公告)号：US5486702A

公开(公告)日：1996-01-23

申请号：US125117

申请日：1993-09-21

申请人： John P. O'Connor ,  John W. Smith

发明人： John P. O'Connor ,  John W. Smith

IPC分类号： C23C14/48 ,  H01J37/317 ,  H01L21/265

CPC分类号： H01J37/3171

摘要： During ion implantation, beam heating of the substrates must be reduced to eliminate self-annealing of the wafers during implant and to eliminate damager to masking materials, principally photoresist, that is mounted on the surface of the wafers. In this work, we describe a technique which may be used with both single-wafer and batch ion implantation systems to reduce transient wafer temperatures during implant.

摘要翻译： 在离子注入期间，必须减少衬底的光束加热，以消除在植入期间晶片的自退火，并且消除掩蔽材料（主要是光致抗蚀剂），该材料安装在晶片的表面上。 在这项工作中，我们描述了可以与单晶片和批次离子注入系统一起使用的技术，以减少植入期间的晶片临时温度。

公开(公告)号：US08866056B2

公开(公告)日：2014-10-21

申请号：US12040641

申请日：2008-02-29

申请人： Catherine M. Shapiro ,  Corey L. Berends ,  Brian M. Degner ,  Jess C. Sweley ,  Stephanie L. Bills ,  Christopher M. Branda ,  Kim M. Folta ,  Robert Kim ,  Sue Lai ,  Pamela A. Poulis ,  Jesse Jay Spungin ,  Katie M. Bartholomew ,  Lynda A. Deakin ,  Todd T. S. Holscher ,  Grace J. Hwang ,  Mark M. Kavanagh ,  Michelle S. K. Lee ,  Adam M. Mack ,  Eleanor D. Morgan ,  John W. Smith ,  David C. Thomsen ,  Gabriel M. Trionfi ,  Ana T. Yuan Chang

发明人： Catherine M. Shapiro ,  Corey L. Berends ,  Brian M. Degner ,  Jess C. Sweley ,  Stephanie L. Bills ,  Christopher M. Branda ,  Kim M. Folta ,  Robert Kim ,  Sue Lai ,  Pamela A. Poulis ,  Jesse Jay Spungin ,  Katie M. Bartholomew ,  Lynda A. Deakin ,  Todd T. S. Holscher ,  Grace J. Hwang ,  Mark M. Kavanagh ,  Michelle S. K. Lee ,  Adam M. Mack ,  Eleanor D. Morgan ,  John W. Smith ,  David C. Thomsen ,  Gabriel M. Trionfi ,  Ana T. Yuan Chang

IPC分类号： H05B6/80 ,  B65D81/34 ,  B65D6/02 ,  B65D51/16 ,  B65D43/02 ,  B65D81/32 ,  B65D1/36 ,  B65D1/34

CPC分类号： B65D81/3205 ,  B65D1/34 ,  B65D1/36 ,  B65D43/0212 ,  B65D81/3453 ,  B65D2205/02 ,  B65D2231/025 ,  B65D2543/00046 ,  B65D2543/00074 ,  B65D2543/00296 ,  B65D2543/0037 ,  B65D2543/00537 ,  B65D2543/00611 ,  B65D2543/00685 ,  B65D2543/00731 ,  B65D2543/00796 ,  B65D2565/388

摘要： A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures.

摘要翻译： 多部件包装系统包括下部容纳组件，上部容纳组件和盖子。 下容纳组件限定适于接纳第一食物部件的内部空腔。 上容纳组件限定适于接收第二食物部件的内部。 上容纳组件适于与下容纳组件接合。 盖与至少一个下部容纳组件和上部容纳组件接合。 盖包括限定多个孔的通道部分。

公开(公告)号：US08552228B2

公开(公告)日：2013-10-08

申请号：US12736445

申请日：2009-04-09

申请人： John W. Smith ,  Claire McGuiness ,  Andrew P. Sharratt

发明人： John W. Smith ,  Claire McGuiness ,  Andrew P. Sharratt

IPC分类号： C07C19/08

CPC分类号： C07C17/087 ,  C07C17/04 ,  C07C17/204 ,  C07C17/206 ,  C07C17/25 ,  C07C17/275 ,  C07C21/18 ,  C07C19/10 ,  C07C19/08 ,  C07C21/04 ,  C07C19/01

摘要： The invention provides a process for the preparation of 2,3,3,3-tetrafluoropropene (1234yf) comprising (a) contacting 1,1,1-trifluoro-2,3-difluoropropane (243db) with hydrogen fluoride (HF) in the presence of a zinc/chromia catalyst to produce a compound having the formula CF3CHFCH2X, wherein X is Cl or F, and (b) dehydrohalogenating the compound of formula CF3CHFCH2X to produce 1234yf.

摘要翻译： 本发明提供了一种制备2,3,3,3-四氟丙烯（1234yf）的方法，包括（a）将1,1,1-三氟-2,3-二氟丙烷（243db）与氟化氢（HF）接触 存在锌/氧化铬催化剂以产生具有式CF 3 CHFCH 2 X的化合物，其中X为Cl或F，和（b）将式CF 3 CHFCH 2 X的化合物脱卤化氢以产生1234yf。

公开(公告)号：US20090012886A1

公开(公告)日：2009-01-08

申请号：US12112754

申请日：2008-04-30

申请人： Patrick J. Allin ,  Charles C. Cherry ,  William H. Eichhorn ,  John W. Smith

发明人： Patrick J. Allin ,  Charles C. Cherry ,  William H. Eichhorn ,  John W. Smith

IPC分类号： G06Q30/00

CPC分类号： G06Q30/04 ,  G06Q10/06 ,  G06Q40/02

摘要： Systems and methods for managing payments. One construction of the system includes a software enabled user interface accessible by a first party and a second party, at least one computer readable memory, and a processor. The processor is configured to selectively operate in a specified billing mode in response to an input received from the first party. The processor is configured to receiving invoice details from the first party when operating in the specified billing mode and from the second party when not operating in the specified billing mode. The processor is further configured to generate an invoice based on the invoice details, display the invoice to the first party and the second party, and request an approval or a rejection of the invoice from the first party or the second party.

摘要翻译： 用于管理付款的系统和方法。 系统的一个结构包括可由第一方和第二方访问的启用软件的用户界面，至少一个计算机可读存储器和处理器。 处理器被配置为响应于从第一方接收到的输入，以指定的计费模式选择性地操作。 处理器被配置为在以指定的计费模式操作时从第一方接收发票详细信息，并且在不以指定的计费模式操作时从第二方接收发票详细信息。 处理器还被配置为基于发票详细信息生成发票，将发票显示给第一方和第二方，并且要求来自第一方或第二方的发票的批准或拒绝。

公开(公告)号：US07368818B2

公开(公告)日：2008-05-06

申请号：US11259398

申请日：2005-10-26

申请人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

公开(公告)号：US06849953B2

公开(公告)日：2005-02-01

申请号：US09942363

申请日：2001-08-29

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L21/56 ,  H01L23/498 ,  H05K1/14 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/05599

摘要： A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect microelectronic elements. At the normal operating temperature of the assembly, the low-melting conductive material melts, allowing the cores and microelectronic elements to move relative to one another and relieve thermally-induced stress.

摘要翻译： 微电子组件包括复合导电元件，每个都包含芯和低熔点导电材料的涂层。 复合导电元件互连微电子元件。 在组件的正常工作温度下，低熔点导电材料熔化，允许芯和微电子元件相对于彼此移动并减轻热致应力。

公开(公告)号：US06846700B2

公开(公告)日：2005-01-25

申请号：US10146353

申请日：2002-05-15

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L21/56 ,  H01L23/055 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L21/48 ,  B23K31/02

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/055 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/13099 ,  H01L2924/00

摘要： A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

摘要翻译： 包括诸如半导体芯片和衬底的元件的微电子组件在包含可熔导电金属块的元件之间具有电连接。 易熔物质被柔性材料如弹性体或凝胶包裹并容纳。 在装置的操作或加工期间，易熔材料可能会熔化，以减轻电连接中的热循环应力。

公开(公告)号：US06774306B2

公开(公告)日：2004-08-10

申请号：US10371324

申请日：2003-02-21

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H05K506

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/055 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/13099 ,  H01L2924/00

摘要： A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

摘要翻译： 包括诸如半导体芯片和衬底的元件的微电子组件在包含可熔导电金属块的元件之间具有电连接。 易熔物质被柔性材料如弹性体或凝胶包裹并容纳。 在装置的操作或加工期间，易熔材料可能会熔化，以减轻电连接中的热循环应力。

公开(公告)号：US06675469B1

公开(公告)日：2004-01-13

申请号：US09636790

申请日：2000-08-11

申请人： Belgacem Haba ,  John W. Smith

发明人： Belgacem Haba ,  John W. Smith

IPC分类号： H05K336

CPC分类号： H05K3/4076 ,  H01L21/486 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

摘要翻译： 通过在保持孔处于基本上密封的状态下蒸发导电材料（例如在孔内具有高蒸气压的金属），在布置在电介质层的相对侧上的一对元件之间形成电连接。 该过程可以同时执行以在微电子单元内形成多个连接，例如在多层电路板内。