公开(公告)号：US6080603A

公开(公告)日：2000-06-27

申请号：US268286

申请日：1999-03-15

申请人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

发明人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： In a method for mounting a sheet-like microelectronic element, the sheet-like element comprises a dielectric layer having a top surface and a bottom surface and is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. A plurality of leads are formed on the bottom surface of the sheet-like element, the leads including bonding pads. In other embodiments, a method is provided for bonding bond pads on a sheet-like microelectronic element to contacts on a microelectronic component.

摘要翻译： 在安装片状微电子元件的方法中，片状元件包括具有顶表面和底表面的电介质层，并且首先接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 多个引线形成在片状元件的底表面上，引线包括接合焊盘。 在其他实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的接触的方法。

公开(公告)号：US5913109A

公开(公告)日：1999-06-15

申请号：US690532

申请日：1996-07-31

申请人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

发明人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.

摘要翻译： 在用于安装用于制造微电子部件的片状多层元件的方法中，首先将片状元件接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 然后将组件冷却，并将膨胀环切掉。 在另一个实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的端子焊盘的方法。 首先将微电子元件放置在刚性板上，将已经结合到框架环的片状元件放置在微电子元件上。 然后将盘放置在片状元件上，并且将力施加到盘上，使得片状元件上的接合焊盘与微电子元件上的端子焊盘接触。 然后施加热量，形成粘结。

公开(公告)号：US06525429B1

公开(公告)日：2003-02-25

申请号：US09517852

申请日：2000-03-02

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

公开(公告)号：US20060040522A1

公开(公告)日：2006-02-23

申请号：US11211810

申请日：2005-08-25

申请人： Thomas Distefano ,  Joseph Fjelstad

发明人： Thomas Distefano ,  Joseph Fjelstad

IPC分类号： H05K1/00

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

摘要翻译： 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。

公开(公告)号：US06870272B2

公开(公告)日：2005-03-22

申请号：US10123547

申请日：2002-04-16

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

公开(公告)号：US20060225272A1

公开(公告)日：2006-10-12

申请号：US11450537

申请日：2006-06-09

申请人： Thomas Distefano

发明人： Thomas Distefano

IPC分类号： H05K3/30

CPC分类号： H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/50 ,  H01L24/83 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01009 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49821 ,  H01L2224/83 ,  H01L2224/05599

摘要： A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

公开(公告)号：US06723584B2

公开(公告)日：2004-04-20

申请号：US10255297

申请日：2002-09-26

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L2148

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.

摘要翻译： 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将 将第一支撑结构拉伸成环结构。 提供与第一支撑结构的第二表面接合的压板。 第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。 第一可固化液体可以至少部分固化。

公开(公告)号：US06474152B1

公开(公告)日：2002-11-05

申请号：US09704630

申请日：2000-11-02

申请人： Oliver C. Mullins ,  Andrew Kurkjian ,  Robin McGowan ,  Thomas Distefano ,  Ian Traboulay

发明人： Oliver C. Mullins ,  Andrew Kurkjian ,  Robin McGowan ,  Thomas Distefano ,  Ian Traboulay

IPC分类号： E21B4700

CPC分类号： G01N21/359 ,  G01N21/3504 ,  G01N21/3577 ,  G01N2021/3536

摘要： The compressibility of a formation hydrocarbon sample is determined downhole by using a borehole tool to obtain the sample downhole, and, at two different pressures, subjecting the sample to near infrared illumination and conducting spectral absorption measurement of peaks at and/or around about 6,000 cm−1 and/or at and/or about 5,800 cm−1 (the absorption peaks of methane and crude oil respectively). The compressibility of the sample is determined from the change in the peak areas, the change in pressure, and the measured peak area itself. According to a preferred embodiment of the invention, the pressure is changed at least 2000 pounds per square inch (psi), and preferably 4000 or more psi between measurements.

摘要翻译： 通过使用钻孔工具在井下获得地层烃样品的压缩性，在井下获得样品，并且在两个不同的压力下，对样品进行近红外照明并进行和/或约约6000cm处的峰的光谱吸收测量 -1和/或在和/或约5,800cm -1（分别为甲烷和原油的吸收峰）。 样品的压缩性由峰面积的变化，压力的变化和测量的峰面积本身确定。 根据本发明的优选实施例，在测量之间，压力改变为至少2000磅/平方英寸（psi），并且优选地改变为4000或更大的psi。

公开(公告)号：US20060244135A1

公开(公告)日：2006-11-02

申请号：US11441976

申请日：2006-05-26

申请人： Igor Khandros ,  Thomas Distefano

发明人： Igor Khandros ,  Thomas Distefano

IPC分类号： H01L23/48

CPC分类号： H01L22/32 ,  H01L21/6836 ,  H01L21/822 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2224/8547 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

摘要翻译： 公开了一种微电子部件，其包括具有开口的介电层和延伸穿过开口的引线。 导线具有偏移部分。 制造微电子组件的方法包括将每个引线连接到微电子元件上的触点。 半导体芯片组件具有具有开口的微电子部件，并且穿过开口延伸引线。 引线连接到半导体芯片上的触点，并具有至少一个扭绞部分。

公开(公告)号：US20050139986A1

公开(公告)日：2005-06-30

申请号：US11064630

申请日：2005-02-24

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/04 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。