公开(公告)号：US07724539B2

公开(公告)日：2010-05-25

申请号：US11504653

申请日：2006-08-16

Applicant: Hideaki Konno

Inventor： Hideaki Konno

IPC: H05K5/02

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10083 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: According to the present invention, there is provided a holder having a pressure flange not to be easily disengaged from a small-sized electronic part in pressing and accommodating the holder having the small-sized electronic part in a mounting recess. A holder includes a projecting portion protruding from a pressing flange toward a cylinder axis of a holding portion, formed in a portion having a predetermined length of an inner edge of the pressing flange. With this construction, when the holder accommodating a small-sized electronic part is mounted to a casing of an apparatus, even if the pressing flange is rolled up and about to be disengaged from the small-sized electronic part, the projecting portion engages with the small-sized electronic part, thereby preventing the pressing flange from being rolled up.

Abstract translation: 根据本发明，提供了一种保持器，其具有在将具有小型电子部件的保持器按压并容纳在安装凹部中的情况下，不会容易地从小型电子部件脱离的压力凸缘。 保持器包括从按压凸缘朝向保持部的气缸轴线突出的突出部分，形成在具有预定长度的按压凸缘的内边缘的部分中。 利用这种结构，当将容纳小型电子部件的保持器安装到装置的壳体上时，即使按压凸缘卷起并且要从小型电子部件脱离，突出部分与 小型电子部件，从而防止按压凸缘卷起。

公开(公告)号：US07612294B2

公开(公告)日：2009-11-03

申请号：US10433133

申请日：2001-09-05

Applicant: Jurgen Boy ,  Klaus Rund ,  Frank Bothe

Inventor： Jurgen Boy ,  Klaus Rund ,  Frank Bothe

IPC: H05K1/16

CPC classification number: H05K3/303 ,  H01L2924/0002 ,  H01T4/06 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electrical component includes a base object made of two insulating objects with curved external surfaces, and external electrodes. Each of the external electrodes is disposed adjacent to one of the two insulating objects. A central electrode is disposed inside of the base object. The central electrode includes a flat mounting surface on an exterior of the component.

Abstract translation: 电气部件包括由具有弯曲外表面的两个绝缘物体和外部电极制成的基座物体。 每个外部电极设置成与两个绝缘物体中的一个相邻。 中心电极设置在基体内。 中心电极在组件的外部包括平坦的安装表面。

公开(公告)号：US20080291653A1

公开(公告)日：2008-11-27

申请号：US11805603

申请日：2007-05-24

Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

IPC: H05K7/02

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Abstract translation: 一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。 载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。 脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。 用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。

公开(公告)号：US20080025006A1

公开(公告)日：2008-01-31

申请号：US11826851

申请日：2007-07-19

Applicant: Akira Kawabata ,  Yuichiro Fukaya

Inventor： Akira Kawabata ,  Yuichiro Fukaya

IPC: H05K5/00

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: An electronic apparatus include a housing, a circuit board held in the housing, and large electronic components held in the housing and electrically coupled to the circuit board. The housing has a mounting surface, and the electronic apparatus is mounted to an object at the mounting surface. The large electronic components are arranged in a three-dimensional manner with respect to the mounting surface in such a manner that at least one of the large electronic components overlaps at least one of the large electronic components in a direction toward the mounting surface.

Abstract translation: 电子设备包括壳体，保持在壳体中的电路板以及保持在壳体中并电耦合到电路板的大型电子部件。 壳体具有安装面，电子设备安装在安装面上的物体上。 大型电子部件以相对于安装面的三维方式配置，使得大电子部件中的至少一个与朝向安装面的方向重叠至少一个大型电子部件。

公开(公告)号：US20060214259A1

公开(公告)日：2006-09-28

申请号：US11091665

申请日：2005-03-28

Applicant: Vernon Spaunhorst

Inventor： Vernon Spaunhorst

IPC: H01L29/00

CPC classification number: H01H85/0411 ,  H01H69/022 ,  H01H85/046 ,  H01H85/143 ,  H01H2069/025 ,  H01H2085/0412 ,  H01H2085/266 ,  H01L24/01 ,  H05K3/3426 ,  H05K2201/10181 ,  H05K2201/10583 ,  H05K2201/10651 ,  Y02P70/613

Abstract: A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

公开(公告)号：US20030079335A1

公开(公告)日：2003-05-01

申请号：US09983828

申请日：2001-10-26

Applicant: CHU JHI ELECTRONICS CO., LTD.

Inventor： Yao-Tsung Chi

IPC: H01C017/00 ,  H05K003/02 ,  G05F001/00

CPC classification number: H01C17/006 ,  H01C7/001 ,  H05K3/3442 ,  H05K2201/10583 ,  H05K2201/10916 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49156

Abstract: A manufacturing method for legless electronic parts used in a surface mounting type printing circuit board is disclosed. The legless electronic parts are made from leg type electronic elements. The method comprises the steps of: manufacturing a leg type electronic part and painting; cutting legs of a leg type parts to become legless electronic parts; pressing metal caps into two ends of the legless parts for replacing the legs; testing the resistance of a legless parts for determining the resistance, error and fault ratio; removing unqualified parts; and packing the tested parts.

Abstract translation: 公开了一种用于表面安装型印刷电路板中的无腿电子部件的制造方法。 无腿电子部件由腿型电子元件制成。 该方法包括以下步骤：制造腿型电子部件和喷漆; 切割腿部腿部成为无腿电子部件; 将金属盖压入无腿部分的两端，以更换腿部; 测试无腿部件的电阻，以确定电阻，误差和故障率; 清除不合格的零件; 并包装测试部件。

公开(公告)号：US20020100612A1

公开(公告)日：2002-08-01

申请号：US10054542

申请日：2002-01-22

Inventor： Timothy Wayne Crockett ,  Harry Thomas Minikel

IPC: H05K001/11

CPC classification number: H05K1/0231 ,  H05K1/0298 ,  H05K1/145 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/53187

Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Abstract translation: 一种用于减小参考路径内的阻抗和/或节省印刷电路板内的空间的印刷电路板和方法。 在本发明的一个实施例中，印刷电路板包括多个导电层。 印刷电路板还包括用于互连两个或更多个导电层的两个或更多个通孔。 印刷电路板还包括嵌入在两个导电层之间的特定通孔中的电气部件，以减小参考路径内的阻抗和/或节省印刷电路板内的空间。

公开(公告)号：US6087920A

公开(公告)日：2000-07-11

申请号：US798636

申请日：1997-02-11

Applicant: Igor Abramov

Inventor： Igor Abramov

IPC: H01F17/04 ,  H01F17/00 ,  H01F27/29 ,  H05K1/02 ,  H05K3/34 ,  H01F27/30

CPC classification number: H01F27/292 ,  H01F17/0033 ,  H05K3/3442 ,  H05K1/0233 ,  H05K2201/0792 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4902

Abstract: A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).

Abstract translation: 单片电感器（10）包括具有相对的远端（14）和（16）的细长衬底，每个端部具有从相对端延伸的端盖，以与PC板隔开的关系支撑衬底（12），端部 盖子形成有非安装区域和用于防止基板搁置在非安装区域上的偏转区域，在非安装区域处在端盖（14）的基板侧上的基本上陡峭的侧壁（16） 以及一个倾斜的斜坡，其基本上与所述非安装区域相对地延伸到所述端盖的顶部的顶部;导电焊接带（30），其部分地围绕每个端盖延伸，每个焊带具有间隙（34） 所述非安装区域由此减小所述带（30）中的寄生传导，以及形成在所述基板上的螺旋形路径中的导电层，所述导电层在所述相对端之间延伸并在所述斜面处与所述导电焊带（30）电接触 （120）。

公开(公告)号：US6031318A

公开(公告)日：2000-02-29

申请号：US47854

申请日：1998-03-25

Applicant: Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

Inventor： Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/19 ,  H05K3/30 ,  H01L41/04

CPC classification number: H03H9/0504 ,  H05K3/303 ,  H05K2201/09781 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K3/301 ,  Y02P70/613

Abstract: A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.

Abstract translation: 一种晶体振荡装置包括具有纵向轴线的外壳体，腔体，沿着纵向轴线延伸的一对第一表面，沿着大致横向于纵向轴线的方向延伸的一对第二表面， 用于提供进入空腔的第一表面，在第二表面之一中的第二开口部分和另一个第二表面中的凹槽。 晶体振荡器设置在外壳的空腔中，并且具有延伸穿过外壳的第二开口部分的引线端子，用于将晶体振荡器电连接到电路板。 接合材料设置在外壳的空腔中，用于将晶体振荡器接合到外壳。 连接构件设置在外壳的槽中，用于将外壳连接到电路板。

公开(公告)号：US5999412A

公开(公告)日：1999-12-07

申请号：US815114

申请日：1997-03-11

Applicant: Ralf-Dieter Busse ,  Carsten Storbeck ,  Thomas Lade

Inventor： Ralf-Dieter Busse ,  Carsten Storbeck ,  Thomas Lade

IPC: H01T4/06 ,  H05K20060101 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K5/00 ,  H05K5/02 ,  H05K7/02

CPC classification number: H05K3/3442 ,  H05K1/183 ,  H05K5/0091 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09427 ,  H05K2201/10583 ,  H05K2201/10727 ,  Y02P70/613

Abstract: A printed-circuit board and a method for the precise assembly of electronic components on a surface of the printed-circuit board, the electronic components being electrically and conductively attached to printed-circuit board by a reflow soldering technique. For this purpose, a printed-circuit board is used that has sections for receiving electronic components on its surface. The sections being at least partially adapted to the outside contour of respective electronic components. The sections are configured as slotted contours or grooves and shaped to secure that the electronic components mounted after the application of solder paste are held in their desired positions prior to the actual soldering process. In addition, the assembled printed-circuit board can be connected to a housing composed of dome-type extensions of an at least partly deformable material. The extensions engage in cutouts provided in the printed-circuit board and pass through the latter. A positive-linkage and/or frictional housing/printed-circuit board connection is established by deformation of the extensions. Further, an overvoltage protection plug for terminal blocks of the telecommunication technique with a voltage surge arrester can be mounted that combines the two functions "earthing contact" and "fail-safe contact" in one part.

Abstract translation: 一种印刷电路板和用于在印刷电路板的表面上精确地组装电子部件的方法，电子部件通过回流焊接技术电导电地附接到印刷电路板。 为此，使用具有用于在其表面上接收电子部件的部分的印刷电路板。 这些部分至少部分地适应于各个电子部件的外部轮廓。 这些部分被配置为开槽轮廓或凹槽，并成形为确保在焊膏施加之后安装的电子部件在实际焊接过程之前保持在其所需位置。 此外，组装的印刷电路板可以连接到由至少部分可变形材料的圆顶型延伸部构成的壳体。 延伸部分配合在印刷电路板上设置的切口并穿过印刷电路板。 通过延伸部的变形来建立正向连接和/或摩擦的壳体/印刷电路板连接。 此外，可以安装具有电压避雷器的电信技术端子块的过电压保护插头，其中将两个功能“接地触点”和“故障安全触点”组合在一个部分中。