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公开(公告)号:US11749717B2
公开(公告)日:2023-09-05
申请号:US17738179
申请日:2022-05-06
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Uzma Rana , Anthony K. Stamper , Johnatan A. Kantarovsky , Steven M. Shank , Siva P. Adusumilli
IPC: H01L29/06 , H01L21/762 , H01L29/78 , H01L29/66 , H01L21/8234 , H01L21/763 , H01L29/10
CPC classification number: H01L29/0653 , H01L21/763 , H01L21/76264 , H01L21/76283 , H01L21/823481 , H01L29/1095 , H01L29/66681 , H01L29/7816 , H01L29/7841
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a transistor with an embedded isolation layer in a bulk substrate and methods of manufacture. The structure includes: a bulk substrate; an isolation layer embedded within the bulk substrate and below a top surface of the bulk substrate; a deep trench isolation structure extending through the bulk substrate and contacting the embedded isolation layer; and a gate structure over the top surface of the bulk substrate and vertically spaced away from the embedded isolation layer, the deep trench isolation structure and the embedded isolation layer defining an active area of the gate structure in the bulk substrate.
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公开(公告)号:US11740418B2
公开(公告)日:2023-08-29
申请号:US17209416
申请日:2021-03-23
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Nicholas A. Polomoff , John J. Ellis-Monaghan , Frank G. Kuechenmeister , Jae Kyu Cho , Michal Rakowski
CPC classification number: G02B6/4248 , G02B6/30 , H01L23/562 , G02B2006/12119
Abstract: Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.
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公开(公告)号:US20230268335A1
公开(公告)日:2023-08-24
申请号:US17679655
申请日:2022-02-24
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Juhan KIM , Sangmoon J. KIM , Mahbub RASHED , Navneet K. JAIN
IPC: H01L27/02
CPC classification number: H01L27/0207
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to cell layouts in semiconductor structures and methods of manufacture. A structure includes: a plurality of abutting cells each of which include transistors with gate structures having diffusion regions; a contact spanning across abutting cells of the plurality of abutting cells and contacting to the diffusion regions of separate cells of the abutting cells; and a continuous active region spanning across the plurality of abutting cells, wherein the continuous active region includes a drain-source abutment with L-shape construct, a source-source abutment with U-shape construct, and a drain-drain abutment with a filler cell located between a drain-drain abutment.
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公开(公告)号:US20230261062A1
公开(公告)日:2023-08-17
申请号:US17671879
申请日:2022-02-15
Applicant: GlobalFoundries U.S. Inc.
Inventor: Uppili Raghunathan , Vibhor Jain , Sebastian Ventrone , Johnatan Kantarovsky , Yves Ngu
IPC: H01L29/40 , H01L29/735 , H01L29/06 , H01L29/423
CPC classification number: H01L29/407 , H01L29/735 , H01L29/0646 , H01L29/423 , H01L29/401
Abstract: Structures with an isolation region and fabrication methods for a structure having an isolation region. The structure includes a semiconductor substrate, a first isolation region surrounding a portion of the semiconductor substrate, a device in the portion of the semiconductor substrate, and a second isolation region surrounding the first isolation region and the portion of the semiconductor substrate.
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公开(公告)号:US20230260561A1
公开(公告)日:2023-08-17
申请号:US17671652
申请日:2022-02-15
Applicant: GlobalFoundries U.S. Inc.
Inventor: Venkatesh P. Gopinath , Pirooz Parvarandeh
IPC: G11C11/22
CPC classification number: G11C11/223 , G11C11/2273 , G11C11/2275
Abstract: Disclosed is threshold voltage (VT)-programmable field effect transistor (FET)-based memory cell including a first transistor and a second transistor (which has an electric-field based programmable VT) connected in series between two voltage source lines. The gates of the transistors are connected to different wordlines and a sense node is at the junction between the two transistors. In preferred embodiments, the first transistor is a PFET and the second transistor is an NFET. Different operating modes (e.g., write 0 or 1 and read) are achieved using specific combinations of voltage pulses on the wordlines and voltage source lines. The memory cell is non-volatile, exhibits relatively low leakage, and has a relatively small footprint as compared to a conventional memory cell. Also disclosed are a look-up table (LUT) incorporating multiple threshold voltage (VT)-programmable field effect transistor (FET)-based memory cells and associated methods.
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公开(公告)号:US11721728B2
公开(公告)日:2023-08-08
申请号:US16777531
申请日:2020-01-30
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Sipeng Gu , Jiehui Shu , Halting Wang , Yanping Shen
IPC: H01L29/417 , H01L29/78
CPC classification number: H01L29/41775 , H01L29/41791 , H01L29/7851
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to self-aligned contacts and methods of manufacture. The structure includes: adjacent diffusion regions located within a substrate material; sidewall structures above an upper surface of the substrate material, aligned on sides of the adjacent diffusion regions; and a contact between the sidewall structures and extending to within the substrate material between and in electrical contact with the adjacent diffusion regions.
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公开(公告)号:US11719895B1
公开(公告)日:2023-08-08
申请号:US17679188
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Nicholas Polomoff , Keith Donegan , Qizhi Liu , Steven M. Shank
IPC: G02B6/42 , H01S5/02251 , G02B1/00
CPC classification number: G02B6/4212 , G02B6/421 , G02B6/4245 , H01S5/02251 , G02B1/002
Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.
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公开(公告)号:US20230244033A1
公开(公告)日:2023-08-03
申请号:US17588440
申请日:2022-01-31
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Yusheng Bian , Judson Holt
IPC: G02B6/136
CPC classification number: G02B6/136 , G02B2006/12061
Abstract: Waveguide structures and methods of fabricating a waveguide structure. The structure includes a first waveguide core, a second waveguide core, and a third waveguide core adjacent to the first waveguide core and the second waveguide core. The third waveguide core is laterally separated from the first waveguide core by a first slot, and the third waveguide core is laterally separated from the second waveguide core by a second slot. The first waveguide core and the second waveguide core comprise a first material, and the third waveguide core comprises a second material that is different in composition from the first material.
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公开(公告)号:US20230229028A1
公开(公告)日:2023-07-20
申请号:US18125165
申请日:2023-03-23
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Kevin K. Dezfulian
Abstract: Structures including an electro-optical phase shifter and methods of fabricating a structure including an electro-optical phase shifter. The structure includes a waveguide core on a semiconductor substrate, and an interconnect structure over the waveguide core and the semiconductor substrate. The waveguide core includes a phase shifter, and the interconnect structure includes a slotted shield and a transmission line coupled to the phase shifter. The slotted shield includes segments that are separated by slots. The slotted shield is positioned between the transmission line and the substrate.
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公开(公告)号:US20230223462A1
公开(公告)日:2023-07-13
申请号:US17657154
申请日:2022-03-30
Applicant: GlobalFoundries U.S. Inc.
Inventor: Hong Yu , Alexander M. Derrickson , Judson R. Holt
CPC classification number: H01L29/73 , H01L29/66234 , H01L29/0804 , H01L29/0821 , H01L29/1095 , H01L29/0653
Abstract: Embodiments of the disclosure provide a bipolar transistor structure including a semiconductor fin on a substrate. The semiconductor fin has a first doping type, a length in a first direction, and a width in a second direction perpendicular to the first direction. A first emitter/collector (E/C) material is adjacent a first sidewall of the semiconductor fin along the width of the semiconductor fin. The first E/C material has a second doping type opposite the first doping type. A second E/C material is adjacent a second sidewall of the semiconductor fin along the width of the semiconductor fin. The second E/C material has the second doping type. A width of the first E/C material is different from a width of the second E/C material.
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