公开(公告)号：US5394609A

公开(公告)日：1995-03-07

申请号：US142997

申请日：1993-10-26

Applicant: Mark E. Ferguson ,  Kenneth J. Guskie ,  Leon S. Nguyen ,  Joseph D. Poole ,  Stuart L. Young ,  Simon Yu

Inventor： Mark E. Ferguson ,  Kenneth J. Guskie ,  Leon S. Nguyen ,  Joseph D. Poole ,  Stuart L. Young ,  Simon Yu

IPC: H01R43/20 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

CPC classification number: H01R43/205 ,  H05K3/34 ,  B23K2201/36 ,  H05K1/182 ,  H05K2203/0165 ,  H05K2203/1572 ,  H05K3/0097 ,  H05K3/341 ,  Y10T29/49144

Abstract: Disclosed is a method of populating printed circuit boards with surface mount technology devices in a multi-board work board holder. The method includes the steps placing the printed circuit boards into a multi-board work board holder having a plurality of apertures corresponding to the individual printed circuit boards. The multi-board work board holder is placed onto a surface mount technology production line, and solder paste is selectively applied onto contact pads on surfaces of the printed circuit boards. Integrated circuit chips are next placed onto the solder paste bearing surface of the printed circuit boards, with the contact leads of the integrated circuit chips bearing on deposited solder paste. The printed circuit boards and the work board holder are heated to the reflow temperature of the solder. The x-y plane and z axis coefficients of thermal expansion of the multi-board work board holder are matched to the x-y plane and z-axis coefficients of thermal expansion of the printed circuit boards to avoid warpage and misalignment of the printed circuit boards.

Abstract translation: 公开了一种在多板工作板固定器中用表面贴装技术装置填充印刷电路板的方法。 该方法包括将印刷电路板放置到具有对应于各个印刷电路板的多个孔的多板工作板保持器中的步骤。 将多板工作板固定器放置在表面安装技术生产线上，并且将焊膏选择性地施加到印刷电路板表面上的接触焊盘上。 集成电路芯片接下来放置在印刷电路板的焊膏支撑表面上，集成电路芯片的接触引线承载沉积的焊膏。 印刷电路板和工作板支架被加热到焊料的回流温度。 多板工作板支架的x-y平面和z轴热膨胀系数与印刷电路板的x-y平面和z轴热膨胀系数匹配，以避免印刷电路板的翘曲和不对准。

公开(公告)号：US5372296A

公开(公告)日：1994-12-13

申请号：US142029

申请日：1993-10-28

Applicant: Sheila J. Konecke ,  Frederick G. Weindelmayer

Inventor： Sheila J. Konecke ,  Frederick G. Weindelmayer

IPC: B23K1/00 ,  H01L21/50 ,  H01L23/10 ,  B32B3/00

CPC classification number: B23K1/0016 ,  H01L21/50 ,  H01L23/10 ,  B23K2201/36 ,  H01L2924/0002 ,  H01L2924/01079

Abstract: In manufacturing packaged modules for computer systems, many modules require sealing a lid to a lower substrate by using solder around the outer edges of the lower substrate. When the solder is heated, it often flows inward towards the chips on the substrates (solder intrusions) and may cause shorts. This invention solves the problem of solder intrusions by using a graphite lid seal fixture during lid seal. The fixture is comprised of lower and upper parts. The substrate, which has a sealband area, rests on and is held in place by the lower part of the fixture. The upper part of the fixture rests on the lower part. The lid, which has solder on its lower surface which is slightly smaller but otherwise generally matches the sealband area of the substrate, fits in a hole in the upper part and rests on the substrate. Thus, graphite substantially surrounds the edges where the lid and substrate meet and the fixture evenly distributes the heat around the sealband during reflow so that the solder can flow out towards the edge of the sealband. By this means, areas where solder flows back into the interior of the module are reduced and hermeticity yields are improved.

Abstract translation: 在制造用于计算机系统的封装模块中，许多模块需要通过在下基板的外边缘周围使用焊料将盖子封闭到下基板。 当焊料加热时，它通常向内流向基板上的芯片（焊料入侵），并可能导致短路。 本发明通过在盖密封期间使用石墨盖密封夹具来解决焊料侵入的问题。 夹具由下部和上部组成。 具有密封带区域的基板由固定装置的下部支撑并固定在适当位置。 夹具的上部位于下部。 其下表面上具有焊料的盖子稍微较小，但通常与基板的密封带区域匹配，该盖子装配在上部的孔中并且搁置在基板上。 因此，石墨基本上围绕盖和基板相遇的边缘，并且固定装置在回流期间将热量均匀地分布在密封带周围，使得焊料可以朝向密封带的边缘流出。 通过这种方式，焊料流回到模块内部的区域减少，气密产率提高。

公开(公告)号：US5342460A

公开(公告)日：1994-08-30

申请号：US152063

申请日：1993-11-12

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: B23K37/047 ,  H01L21/00 ,  B32B31/00

CPC classification number: H01L21/67138 ,  B23K37/047 ,  B32B38/1841 ,  B23K2201/36 ,  Y10T156/17 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

Abstract: An outer lead bonding apparatus which includes a device supply section on which devices are arranged at predetermined positions, a transfer head assembly for picking up the devices from the device supply section, means for driving the transfer head assembly in a predetermined direction, a first monitoring camera for checking the devices picked up by the transfer head assembly for its positional exactness, a substrate driving means for moving the substrate in a predetermined direction, and a second monitoring camera for checking the electrodes of the substrate for their positional exactness.

Abstract translation: 一种外引线接合装置，包括设置在预定位置的装置供给部，用于从装置供给部拾取装置的转印头组件，用于沿预定方向驱动转印头组件的装置，第一监视 相机，用于检查由转印头组件拾取的装置的位置精确度，基板驱动装置，用于沿预定方向移动基板;以及第二监视照相机，用于检查基板的电极的位置精度。

公开(公告)号：US5292057A

公开(公告)日：1994-03-08

申请号：US16265

申请日：1993-02-11

Applicant: Joseph A. Lomastro

Inventor： Joseph A. Lomastro

IPC: B23K1/00 ,  H01R4/64 ,  B23K23/00

CPC classification number: B23K1/0008 ,  B23K2201/36 ,  H01R4/646

Abstract: A fixture for welding a grounding connector to a structural steel member is disclosed. Such fixture is formed of a magnetic material so that the fixture is attracted to, and retained upon, the steel member. A chamber is defined within the rectangular body of the fixture, and an inlet passage in the front of the fixture receives one end of the grounding connector. Thermite powder is introduced into the chamber, and an igniter cap delivers a spark to the powder, to ignite same, thereby producing a molten mass of metal. The metal flows the fixture and bonds the grounding connector and the fixture to the structural steel member. The method of utilizing such single-use fixture is also disclosed.

Abstract translation: 公开了一种用于将接地连接器焊接到结构钢构件的固定装置。 这种夹具由磁性材料形成，使得固定件被吸引并保持在钢构件上。 腔室被限定在固定装置的矩形体内，并且固定装置前部的入口通道接收接地连接器的一端。 将热石粉引入到室中，并且点火器帽向粉末递送火花点燃，从而产生熔融金属块。 金属流动固定装置并将接地连接器和固定装置结合到结构钢构件上。 还公开了使用这种一次性夹具的方法。

公开(公告)号：US5178965A

公开(公告)日：1993-01-12

申请号：US837297

申请日：1992-02-14

Applicant: D. Morgan Tench ,  Dennis P. Anderson

Inventor： D. Morgan Tench ,  Dennis P. Anderson

IPC: B23K1/00 ,  B23K1/20 ,  C23F1/18 ,  C25D5/34 ,  H05K1/11 ,  H05K3/24 ,  H05K3/34 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/3473 ,  B23K1/0008 ,  B23K1/20 ,  C23F1/18 ,  H05K3/383 ,  B23K2201/36 ,  B23K2203/12 ,  H05K1/111 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/043 ,  H05K2203/0723 ,  H05K2203/125 ,  Y10T428/12472 ,  Y10T428/12715

Abstract: A roughened surface of a conductive substrate, such as copper, provides uniform Sn-Pb solder coatings and improved solder retention at printed wiring board (PWB) plated through-hole rims (knees) and surface pads during solder dipping or reflow. A high density of copper surface features of moderate average roughness provides the most favorable solder coating thickness distribution. Various chemical or electrochemical etching processes may be used to produce the desired copper surface topography. Reflowed solder thickness distribution in a PWB knee region attained with a ferric chloride copper etching process peaks at 4 .mu.m, which provides a good margin of safety for preventing exposure/oxidation of the underlying Cu-Sn intermetallics. The ferric chloride copper etching process yields only 1% of solder thickness measurements in the undesirable 0-1.5 .mu.m range for plated through-hole rims. Copper surface roughening is expected to greatly reduce solderability loss in mass produced PWBs. In addition, solder bearing on PWB surface pads is avoided with copper surface roughening so that alignment of surface mount component leads prior to soldering is greatly facilitated.

Abstract translation: 诸如铜的导电基底的粗糙表面在焊料浸渍或回流期间提供均匀的Sn-Pb焊料涂层和改进的印刷线路板（PWB）电镀通孔边缘（膝盖）和表面焊盘处的焊料保持性。 中等平均粗糙度的高密度铜表面特征提供了最有利的焊料涂层厚度分布。 可以使用各种化学或电化学蚀刻工艺来产生所需的铜表面形貌。 用氯化铜铜蚀刻工艺获得的PWB膝部区域中的回流焊料厚度分布达到4μm，这为防止下面的Cu-Sn金属间化合物的暴露/氧化提供了良好的安全余地。 氯化铁铜蚀刻工艺在镀层通孔边缘的不合需要的0-1.5微米范围内仅产生1％的焊料厚度测量。 铜表面粗糙度预计将大大降低批量生产的PWBs的可焊性损失。 此外，通过铜表面粗糙化避免了PWB表面焊盘上的焊料轴承，从而大大方便了焊接前的表面安装部件引线的对准。

公开(公告)号：US4942843A

公开(公告)日：1990-07-24

申请号：US253295

申请日：1988-10-05

Applicant: Mark J. Shireman ,  Florence G. Benson

Inventor： Mark J. Shireman ,  Florence G. Benson

IPC: B23K1/08 ,  B23K1/20 ,  B23K3/06

CPC classification number: B23K3/0692 ,  B23K1/085 ,  B23K1/20 ,  B23K2201/36

Abstract: Apparatus for automatically tinning leads of components mounted on tapes to carry the components through solder wave stations have adjustments incorporated to permit tinning components of different sizes. Foam generators with independent foam rate adjustments are also provided to permit the adjusting foam height separately for each component lead. Guards are used with the foam generators to select specific segments of each lead for fluxing. A vacuum port with a vertical heated connection leading to a vertically oriented heated collector insures that excess solder will not clog the collection systrem. A shield between the vacuum port and the solder wave prevents solder being ingested by the port.

Abstract translation: 用于自动镀锡安装在带上的部件的导线的装置用于通过焊波波台传送部件，其中包括调整以允许不同尺寸的镀锡部件。 还提供具有独立泡沫率调节的泡沫发生器，以便为每个部件导线分别调整泡沫高度。 护罩与泡沫发生器一起使用，以选择每个引线的特定部分进行焊接。 具有垂直加热连接的真空端口通向垂直取向的加热收集器确保多余的焊料不会堵塞收集系统。 真空口和焊波之间的屏蔽阻止焊料被端口吸收。

公开(公告)号：US3764422A

公开(公告)日：1973-10-09

申请号：US3764422D

申请日：1970-10-02

Applicant: SIEMENS AG

Inventor： KORITKE H ,  HAFT R

IPC: H01C17/06 ,  B23K1/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K5/00 ,  C23F1/02

CPC classification number: H05K5/0091 ,  B23K1/00 ,  B23K2201/36 ,  H05K1/16 ,  H05K1/167 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/105 ,  H05K2201/10568 ,  H05K2203/0165 ,  H05K2203/166 ,  H05K2203/167

Abstract: COVERS AN IMPROVED THIN LAYER ELECTRONIC CIRCUIT ASSEMBLY FOR RECEIVING ELECTRICAL COMPONENTS WHICH INCLUDES A NON-CONDUCTIVE FLEXIBLE PLASTIC FOIL SUPPORT HAVING A THINLAYER CIRCUIT ADHERENT TO SAID SUPPORT, WHICH CIRCUIT INCLUDES CONDUCTOR TRACKS FOR RECEIVING SAID ELECTRICAL COMPONENTS AND CONTACT SURFACES FOR CONNECTION WITH OTHER

CIRCUITS. IT ALSO COVERS A METHOD OF PREPARING A PLURALITY OF SAID ASSEMBLIES IN A CONTINUOUS MANNER BY PREPARING A TAPE OF SAID SUPPORT AND FIXING THEREON A PLURALTIY OF SAID THIN LAYER CIRCUITS IN A CONTINUOUS MANNER. THE TAPE THEN IS TRIMMED TO PROVIDE THE DESIRED GROUP OF CIRCUITS.

公开(公告)号：US3657789A

公开(公告)日：1972-04-25

申请号：US3657789D

申请日：1970-06-16

Applicant: FRANCIS ANGLADE

Inventor： ANGLADE FRANCIS

IPC: B23K1/20 ,  B23K3/047 ,  H01R12/00 ,  H05K3/34 ,  H01R43/04

CPC classification number: B23K1/20 ,  B23K3/047 ,  B23K2201/36 ,  H05K3/3426 ,  H05K3/3478 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/5177 ,  Y10T29/5327

Abstract: Apparatus for preparing the conductors projecting from a flatpack for soldering comprises an anvil supporting the conductors and a soldering wire transversely of the conductors, a reciprocable plunger mounted above the anvil for exerting a predetermined pressure against a soldering wire placed transversely over the conductors, and cooperating side walls of the plunger and the anvil forming a scissors for severing the soldering wire upon downward movement of the plunger.

Abstract translation: 用于制备从用于焊接的扁平组件突出的导体的装置包括支撑导体的砧和横向于导体的焊丝;安置在砧座上方的可往复运动的柱塞，用于对横向放置在导体上的导线施加预定的压力， 并且柱塞和砧座的配合侧壁形成剪刀，用于在柱塞向下运动时切断焊丝。

公开(公告)号：US3245021A

公开(公告)日：1966-04-05

申请号：US38587664

申请日：1964-07-29

Applicant: GEN ELECTRIC

Inventor： KERNANDER WARREN N ,  BENNEKOM CARL F VAN

IPC: B23K1/00 ,  G01R1/20

CPC classification number: G01R1/203 ,  B23K1/0018 ,  B23K2201/36

公开(公告)号：US3172705A

公开(公告)日：1965-03-09

申请号：US25894062

申请日：1962-12-31

Applicant: SPRAGUE ELECTRIC CO

Inventor： BURKE EARL J

IPC: B23K3/08 ,  H05K13/02

CPC classification number: H05K13/02 ,  B23K3/08 ,  B23K2201/36