利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

336 条记录 (耗时 0.028 秒)

    CIRCUIT MODULE
    152.
    发明申请
    CIRCUIT MODULE 有权
    电路模块

    公开(公告)号：US20110061920A1

    公开(公告)日：2011-03-17

    申请号：US12876438

    申请日：2010-09-07

    申请人： Yasuhiro TAKAHASHI

    发明人： Yasuhiro TAKAHASHI

    IPC分类号： H05K1/18

    CPC分类号： H05K3/3431 ,  H05K3/303 ,  H05K2201/083 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/2036 ,  Y02P70/613

    摘要： An electronic component includes a component body including a mounting surface facing a circuit substrate, and a plurality of first external electrodes arranged on the mounting surface so as to extend between a first side and a second side of the mounting surface substantially parallel with each other and so as to be within a first region having a width that is substantially equal to half a length of the first side in a direction in which the first side extends. A circuit substrate includes a substrate body, a plurality of second external electrodes, arranged on a main surface of the substrate body, respectively connected to the plurality of the first external electrodes, and support units arranged to protrude from the main surface of the substrate body and such that the electronic component overlaps the support units outside the first region.

    摘要翻译： 一种电子部件，包括具有与电路基板相对的安装面的部件主体和配置在该安装面上的多个第一外部电极，从而在安装面的第一面和第二面之间大致平行地延伸， 以便在第一侧延伸的方向上具有基本上等于第一侧的一半长度的宽度的第一区域内。 电路基板包括：基板主体，多个第二外部电极，配置在分别连接到多个第一外部电极的基板主体的主表面上;以及支撑单元，布置成从基板主体的主表面突出 并且使得电子部件与第一区域外的支撑单元重叠。

    SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF FORMING SAME
    153.
    发明申请
    SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF FORMING SAME 有权
    具有磁性层的表面安装部件及其形成方法

    公开(公告)号：US20110056733A1

    公开(公告)日：2011-03-10

    申请号：US12839091

    申请日：2010-07-19

    申请人： Haixiao Sun

    发明人： Haixiao Sun

    IPC分类号： H05K1/09

    CPC分类号： H01G13/00 ,  H01G2/02 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/083 ,  H05K2201/10909 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T428/24826 ,  H01L2924/00

    摘要： A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.

    摘要翻译： 微电子组件，表面安装部件和提供表面安装部件的方法。 组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力 在焊接之前和期间将表面安装部件保持在基板上。

    STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY
    154.
    发明申请
    STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY 有权
    连接打印线的结构，连接打印线的方法和具有各向异性电导率的粘合

    公开(公告)号：US20100230141A1

    公开(公告)日：2010-09-16

    申请号：US12722810

    申请日：2010-03-12

    申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

    发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

    IPC分类号： H05K1/03 ,  H05K3/36 ,  H05K1/02

    CPC分类号： H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

    摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

    摘要翻译： 本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。 连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接 第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。 通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a， 粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

    Surface mount component having magnetic layer thereon and method of forming same
    155.
    发明授权
    Surface mount component having magnetic layer thereon and method of forming same 有权
    具有磁性层的表面安装部件及其形成方法

    公开(公告)号：US07791895B2

    公开(公告)日：2010-09-07

    申请号：US10561064

    申请日：2005-08-19

    申请人： Haixiao Sun

    发明人： Haixiao Sun

    IPC分类号： H05K7/00

    CPC分类号： H01G13/00 ,  H01G2/02 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/083 ,  H05K2201/10909 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T428/24826 ,  H01L2924/00

    摘要： A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.

    摘要翻译： 微电子组件，表面安装部件和提供表面安装部件的方法。 组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力 在焊接之前和期间将表面安装部件保持在基板上。

    LAYERED INDUCTOR
    156.
    发明申请
    LAYERED INDUCTOR 有权
    层状电感器

    公开(公告)号：US20100194513A1

    公开(公告)日：2010-08-05

    申请号：US12691950

    申请日：2010-01-22

    申请人： Shuichi Ozawa ,  Natsumi Shimogawa ,  Katsuyuki Takeuchi ,  Yukio Aisaka

    发明人： Shuichi Ozawa ,  Natsumi Shimogawa ,  Katsuyuki Takeuchi ,  Yukio Aisaka

    IPC分类号： H01F5/00

    CPC分类号： H01F17/0013 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/165 ,  H05K3/4629 ,  H05K2201/083 ,  H05K2201/09672 ,  H05K2201/098

    摘要： A layered inductor 10 is manufactured by layering “silver-based conductive layers” and “ferrite-based magnetic layers” and simultaneously firing these layers. The conductive layers are via-connected to form a helical coil 30. A shape of a cross sectional surface of the conductive layer, cut by a plane perpendicular to a longitudinal direction of each of the conductive layers is a substantial trapezoid shape, having an upper base and a lower base. A base angle θ of the trapezoid shape at both ends of the lower base is equal to or greater than 50° and is smaller than or equal to 80°.

    摘要翻译： 通过层叠“银基导电层”和“铁氧体基磁性层”并同时烧制这些层来制造层状电感器10。 导电层通孔连接以形成螺旋线圈30.导电层的横截面形状由垂直于每个导电层的纵向的平面切割，呈大致梯形，具有上部 基地和较低的基地。 底角角度; 在下底座两端的梯形形状等于或大于50°并且小于或等于80°。

    Magnetic component connector, circuit boards for use therewith, and kits for building and designing circuits
    160.
    发明授权
    Magnetic component connector, circuit boards for use therewith, and kits for building and designing circuits 有权
    磁性部件连接器，与其一起使用的电路板以及用于构建和设计电路的套件

    公开(公告)号：US07611357B2

    公开(公告)日：2009-11-03

    申请号：US11788369

    申请日：2007-04-18

    申请人： In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

    发明人： In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

    IPC分类号： G09B19/00 ,  H01R11/00

    CPC分类号： H01R11/30 ,  H01R13/6205 ,  H05K1/0286 ,  H05K1/09 ,  H05K1/141 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/09963 ,  H05K2201/10325

    摘要： Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

    摘要翻译： 印刷电路板和面包板装置具有接触焊盘和磁性部件连接器，其中接触焊盘和磁性部件连接器之间的连接由磁力制成。 接触焊盘或磁性部件连接器都将是磁性的，另一个将由将被吸收的磁体的材料制成。 例如，通常具有铜迹线的印刷电路板包括由吸收磁体的材料制成的接触垫。 电路部件连接到具有磁性腿的磁性部件连接器，然后将这些部件连接到电路板或面包板装置的接触垫上。 这使得组件与印刷电路板或面包板设备的连接快速简单，并且可以方便地拆卸和更换部件。 磁性部件连接器也可以被配置为彼此磁性地连接。