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公开(公告)号：US20040259479A1
公开(公告)日：2004-12-23
申请号：US10601601
申请日：2003-06-23
发明人： Roland K. Sevilla
IPC分类号： B24B001/00
CPC分类号： B24B37/26 , B23H5/08 , B24B37/046
摘要： The invention provides a polishing pad comprising a body having a top surface comprising a first set of grooves with a first depth and first width and a bottom surface comprising a second set of grooves with a second depth and second width, wherein the first set of grooves and second set of grooves are interconnected and are oriented such that they are not aligned.
摘要翻译： 本发明提供了一种抛光垫，其包括具有顶表面的主体，该顶表面包括具有第一深度和第一宽度的第一组凹槽，以及包括具有第二深度和第二宽度的第二组凹槽的底表面，其中第一组凹槽 并且第二组凹槽互连并且被定向成使得它们不对齐。
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162.发明申请Dielectric-in-dielectric damascene process for manufacturing planar waveguides 审中-公开用于制造平面波导的介质介质镶嵌工艺公开(公告)号：US20040188379A1
公开(公告)日：2004-09-30
申请号：US10810257
申请日：2004-03-26
发明人： David G. Mikolas
IPC分类号： B29D011/00
CPC分类号： G02B6/125 , G02B6/132 , G02B6/136 , G02B2006/12085 , G02B2006/121 , G02B2006/12109 , G02B2006/12116 , G02B2006/12119 , G02B2006/12121 , G02B2006/12126
摘要： Photonic light circuits including one or more optical waveguides and one or more waveguide features and methods for manufacturing photonic light circuits including one or more optical waveguides.
摘要翻译： 包括一个或多个光波导的光子电路和一个或多个波导特征以及用于制造包括一个或多个光波导的光子光电路的方法。
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公开(公告)号：US20040150322A1
公开(公告)日：2004-08-05
申请号：US10763552
申请日：2004-01-23
发明人： Heinz H. Busta
IPC分类号： H01J009/00 , H01J009/24 , H01J001/62
CPC分类号： H01J1/3042 , H01J1/3046 , H01J9/025 , H01J35/065 , H01J2201/30403 , H01J2201/30423
摘要： A method of operating and process for fabricating an electron source. A conductive rod is covered by an insulating layer, by dipping the rod in an insulation solution, for example. The rod is then covered by a field emitter material to form a layered conductive rod. The rod may also be covered by a second insulating material. Next, the materials are removed from the end of the rod and the insulating layers are recessed with respect to the field emitter layer so that a gap is present between the field emitter layer and the rod. The layered rod may be operated as an electron source within a vacuum tube by applying a positive bias to the rod with respect to the field emitter material and applying a higher positive bias to an anode opposite the rod in the tube. Electrons will accelerate to the charged anode and generate soft X-rays.
摘要翻译： 一种用于制造电子源的操作和处理方法。 导电棒被绝缘层覆盖，例如通过将棒浸入绝缘溶液中。 然后将杆用场发射体材料覆盖以形成层状导电棒。 杆也可以被第二绝缘材料覆盖。 接下来，从杆的端部去除材料，并且绝缘层相对于场发射极层凹陷，使得在场发射极层和杆之间存在间隙。 层叠的杆可以通过相对于场致发射体材料向杆施加正偏压并且向与管中的杆相对的阳极施加更高的正偏压而在真空管内作为电子源来操作。 电子将加速到带电阳极并产生软X射线。
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公开(公告)号：US20040082276A1
公开(公告)日：2004-04-29
申请号：US10282489
申请日：2002-10-28
发明人： Abaneshwar Prasad
IPC分类号： B24B001/00
CPC分类号： B24B37/24
摘要： The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
摘要翻译： 本发明涉及包含平均孔径为约0.01微米至约1微米的多孔材料的化学机械抛光垫基材。 抛光垫基板在约200nm至约35,000nm的至少一个波长处具有约10％以上的透光率。 本发明还涉及包括抛光垫基板的抛光垫，包括使用抛光垫基板的抛光方法以及包括抛光垫基板的化学机械装置。
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公开(公告)号：US20030153184A1
公开(公告)日：2003-08-14
申请号：US10353512
申请日：2003-01-29
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： H01L21/3212 , C09G1/02
摘要： The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, wherein the stopping compound is a cationically charged nitrogen containing compound selected from compounds comprising amines, imines, amides, imides, and mixtures thereof, and (v) a polishing pad and/or an abrasive. The invention also provides a method of polishing a substrate comprising contacting a surface of a substrate with the system and polishing at least a portion of the substrate therewith. Moreover, the invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (a) contacting the first metal layer with the system, and (b) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate. Moreover, the present invention provides a composition for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, wherein the stopping compound is a cationically charged nitrogen containing compound selected from compounds comprising amines, imines, amides, imides, and mixtures thereof, to be used with (v) a polishing pad and/or an abrasive.
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公开(公告)号：US20030139116A1
公开(公告)日：2003-07-24
申请号：US10051241
申请日：2002-01-18
IPC分类号： B24B007/22
CPC分类号： C09G1/02
摘要： The invention provides a chemical-mechanical polishing system and method comprising a liquid carrier, a polishing pad and/or an abrasive, and at least one amine-containing polymer, wherein the amine-containing polymer has about 5 or more sequential atoms separating the nitrogen atoms of the amino functional groups or is a block copolymer with at least one polymer block comprising one or more amine functional groups and at least one polymer block not comprising any amine functional groups.
摘要翻译： 本发明提供了一种化学机械抛光系统和方法，其包括液体载体，抛光垫和/或研磨剂和至少一种含胺聚合物，其中含胺聚合物具有约5个或更多个顺序的原子分离氮 是具有至少一个包含一个或多个胺官能团的聚合物嵌段和至少一个不包含任何胺官能团的聚合物嵌段的嵌段共聚物。
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公开(公告)号：US20020125461A1
公开(公告)日：2002-09-12
申请号：US10043534
申请日：2002-01-10
发明人： Homer Chou , Joseph D. Hawkins , Renjie Zhou
IPC分类号： C09K013/02
CPC分类号： H01L21/3212 , B24B37/044 , C09G1/02 , C09K3/1463 , C09K3/1472
摘要： The invention provides a polishing system and method for polishing or planarizing a substrate. The polishing system comprises (i) a liquid carrier, (ii) ammonium oxalate, (iii) a hydroxy coupling agent, and (iv) a polishing pad and/or an abrasive. The polishing method comprises contacting at least a portion of a substrate with the polishing system and polishing the portion of the substrate therewith.
摘要翻译： 本发明提供了用于抛光或平面化基板的抛光系统和方法。 抛光系统包括（i）液体载体，（ii）草酸铵，（iii）羟基偶联剂，和（iv）抛光垫和/或研磨剂。 抛光方法包括使基底的至少一部分与抛光系统接触，并用其抛光衬底的该部分。
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公开(公告)号：US11597854B2
公开(公告)日：2023-03-07
申请号：US16513404
申请日：2019-07-16
发明人： William J. Ward , Matthew E. Carnes , Ji Cui , Helin Huang
IPC分类号： C09G1/02 , C08K3/22 , C09K13/00 , C23F1/26 , H01L21/306 , C23F3/06 , C08L39/00 , C08K9/00 , C08K3/36 , C08K3/28 , H01L21/321
摘要： The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.
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公开(公告)号：US11440158B2
公开(公告)日：2022-09-13
申请号：US15875773
申请日：2018-01-19
发明人： Diane Scott , Paul Andre Lefevre
摘要： Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.
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公开(公告)号：US20210384553A1
公开(公告)日：2021-12-09
申请号：US16895769
申请日：2020-06-08
IPC分类号： H01M10/0565 , H01M10/0525 , H01M10/058
摘要： A secondary battery cell includes a cathode of a first electrode material, an anode of a second electrode material, and a solid polymer electrolyte layer disposed between the cathode and anode. The solid polymer electrolyte includes a first surface in contact with the cathode and a second surface in contact with the anode. The solid polymer electrolyte layer includes a cellulosic polymer matrix. The cellulosic polymer matrix includes a network of the cellulosic polymer. Lithium ions are dispersed in the cellulosic polymer matrix. Ceramic particles are dispersed in the cellulosic polymer matrix. The ceramic particles include a metal oxide. One or more plasticizers are dispersed in the cellulosic polymer matrix. One or more polymer networks are in contact with the cellulosic polymer matrix. The one or more polymer networks include an acrylate-containing polymer.
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