Abstract:
A method for forming a barrier layer upon a copper containing conductor layer employs a hydrogen containing plasma treatment of the copper containing conductor layer followed by an argon plasma treatment of the copper containing conductor layer. The barrier layer may be formed employing a chemical vapor deposition method, such as an atomic layer deposition method. When the deposition method employs a metal and carbon containing source material, the two-step plasma pretreatment provides the barrier layer with enhanced electrical properties.
Abstract:
A method of forming a via in a low-k dielectric material and without the attendant via poisoning problem, or a dual damascene structure formed in the same dielectric and without the same problem are disclosed. The vertical walls of the via opening are first lined with a low-k protection layer and then covered with a barrier layer in order to prevent outgassing from the low-k dielectric material when copper is deposited into the via opening. In the case of a dual damascene structure, it is sufficient that the hole opening underlying the trench opening is first lined with the low-k protection layer. The resulting via or dual damascene structure is free of poisoned metal and, therefore, more reliable.
Abstract:
The present invention provides an apparatus for stimulating an animal cell and recording its physiological signal and methods of making and using thereof. The purpose of the present invention is to provide an apparatus for stimulating an animal cell and recording its physiological signal that is efficient, convenient, and accurate. The apparatus for stimulating an animal cell and recording its physiological signal of the present invention comprises a poor conductive substrate, wherein on at least one surface of the substrate is provided at least one unit conductive polymer layer and at least one good conductive microelectrode.
Abstract:
It is a general object of the present invention to provide an improved method of fabrication in the formation of an improved copper metal diffusion barrier layer having the structure, W/WSiN/WN, in single and dual damascene interconnect trench/contact via processing with 0.10 micron nodes for MOSFET and CMOS applications. The diffusion barrier is formed by depositing a tungsten nitride bottom layer, followed by an in situ SiH4/NH3 or SiH4/H2 soak forming a WSiN layer, and depositing a final top layer of tungsten. This invention is used to manufacture reliable metal interconnects and contact vias in the fabrication of MOSFET and CMOS devices for both logic and memory applications and the copper diffusion barrier formed, W/WSiN/WN, passes a stringent barrier thermal reliability test at 400° C. Pure single barrier layers, i.e., single layer WN, exhibit copper punch through or copper spiking during the stringent barrier thermal reliability test at 400° C.
Abstract:
Within a damascene method for forming a patterned conductor layer within an aperture defined by a patterned dielectric layer within a microelectronic fabrication, at least one of: (1) the patterned dielectric layer is thermally annealed at a temperature of from about 300 to about 450 degrees centigrade prior to forming within the aperture the patterned conductor layer; and (2) the aperture is etched with a plasma employing an etchant gas composition comprising hydrogen to form a laterally enlarged aperture prior to forming within the laterally enlarged aperture the patterned conductor layer. In accord with the method, the microelectronic fabrication is formed with decreased contact resistance and enhanced structural integrity.
Abstract:
The present invention concerns a high throughput electrorotation chip having an array of electrorotation units and methods of use thereof. To make the high throughput electrorotation chip, a plurality of electrorotation units (EU) are fabricated on a substrate or support and each EU is capable of producing a rotating electric field upon the application of an appropriate electrical signal. Exemplary embodiments include a row-column configuration of EUs having four electrode elements realized through two conductive-layers. The electrode elements may be linear, concave, or convex. Thin plates having one or multiple holes are bound to high-throughput electrorotation chips to form assay chambers having one or multiple wells. Particles can be introduced to the wells and electrorotation measurements can be performed on the particles. The high throughput electrorotation chip and chamber may be used for cell-based screening for leading drug candidate molecules from a compound library, for high-throughput characterizing particle electric properties, and for high-throughput assaying molecular compositions of unknown solutions.
Abstract:
The present invention proposes a crystallization method of the poly-Si thin film in a thin film transistor. A substrate having an insulator layer is provided. An amorphous silicon layer or a micro-crystalline silicon layer having two thickness is first formed on the insulator layer. The region of thinner is defined as the channel region of the TFT, while the region of thicker can be defined as the source/drain regions of the TFT. Next, an excimer laser is used for crystallization. During the excimer laser irradiation, the amorphous silicon layer of thinner is completely melted, and the amorphous silicon layer of thicker is partially melted. The partially melted amorphous silicon layer is used as crystallization seeds. Through formation of the temperature gradient between the completely melted amorphous silicon layer and the partially melted amorphous silicon layer, longitudinal growth of silicon grains in the completely melted region will be performed to grow a poly-Si layer having good homogeneity and large grains.
Abstract:
An infrared proximity and remote control wall switch positioned between a fixture and a voltage source for allowing a fixture to operate in one of a manual and automatic mode. The infrared proximity and remote control wall switch includes a three position switch operable between a first on position connecting the fixture directly to the voltage source, a second off position for disconnecting the fixture from the voltage source and a third auto position for allowing automatic operation of the fixture. An infrared emitter generates an infrared signal and an infrared receiver is connected to receive one of the infrared signal generated by the infrared emitter and reflected by an object and an infrared signal generated by a conventional television, video cassette recorder or hi-fi remote control unit. A device is connected to the infrared receiver for filtering the signal received by said infrared receiver and eliminate noise signals therefrom. Connected to the filtering device acts to connect the fixture to the voltage source upon receipt of a filtered signal from the filtering device. This device is able to eliminate noise signals from affecting the operation of the fixture when the switch is in the auto position and is able to activate the fixture to turn on at a plurality of different intensities. A timer may also be included for turning the fixture off after a predetermined period of time has passed since activation.
Abstract:
A process for isolating polynucleotides from aqueous mixtures containing both polynucleotides and polysaccharides is described. The process uses polymer gels containing --B(OH).sub.2 groups, and is useful in purifying deoxyribonucleic acid extracted from plants.
Abstract:
An catalyst composition for preparing high-syndiotacticity polystyrene polymers which comprises: (a) a titanium complex represented by the following formula of TiR'.sub.1 R'.sub.2 R'.sub.3 R'.sub.4 or TiR'.sub.1 R'.sub.2 R'.sub.3, wherein R'.sub.1, R'.sub.2, R'.sub.3, and R'.sub.4 are, independently, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an amino group, a hydrogen atom, or a halogen atom; (b) a cyclopentadienyl complex of silicon (Si), germanium (Ge), or tin (Sn) represented by the following formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 can be, independently, alkyl group, aryl group, silyl group, germanyl group, stannyl group, hydrogen atom, or halogen atom; R is an alkyl group, aryl group, hydrogen atom, or halogen atom; and X can be one of the Group IVA elements of silicon (Si), germanium (Ge), or tin (Sn); and (c) an activated transitional metal co-catalyst, which can be methyl aluminoxane, or a mixture containing a non-coordinated Lewis acid (a Lewis acid is an electron-pair donor) and a trialkyl aluminum, such as triethyl aluminum or tetraisobutyl aluminum. R.sub.1 and R.sub.2 and R.sub.3 and R.sub.4, respectively, can also be part of a benzene ring.