Abstract:
Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface.
Abstract:
A system, method and machine-readable medium are provided to configure a non-volatile memory (NVM) including a plurality of NVM modules, in a system having a hard disk drive (HDD) and an operating system (O/S). In response to a user selection of a hybrid drive mode for the NVM, the plurality of NVM modules are ranked according to speed performance. Boot portions of the O/S are copied to a highly ranked NVM module, or a plurality of highly ranked NVM modules, and the HDD and the highly ranked NVM modules are assigned as a logical hybrid drive of the computer system. Ranking each of the plurality of NVM modules can include carrying out a speed performance test. This approach can provide hybrid disk performance using conventional hardware, or enhance performance of an existing hybrid drive, while taking into account relative performance of available NVM modules.
Abstract translation:在具有硬盘驱动器(HDD)和操作系统(O / S)的系统中,提供了一种系统,方法和机器可读介质来配置包括多个NVM模块的非易失性存储器(NVM)。 响应于用户选择NVM的混合驱动模式,根据速度性能对多个NVM模块进行排序。 O / S的引导部分被复制到高排名的NVM模块或多个高排名的NVM模块,并且HDD和高排名的NVM模块被分配为计算机系统的逻辑混合驱动器。 对多个NVM模块中的每一个进行排序可以包括进行速度性能测试。 这种方法可以使用常规硬件提供混合磁盘性能,或提高现有混合驱动器的性能,同时考虑可用的NVM模块的相对性能。
Abstract:
An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface the reduction of multiple strobe signal to a single strobe signal. In addition, a packet header transmitted on the data bus followed by a payload, includes an encoded indication of the type of the payload. Aspects of the present application relate to providing a traditional memory device with external logic devices, where the logic devices handle the single strobe and the packet header, thereby permitting single strobe operation.
Abstract:
A storage system sized to fit within a standard magnetic hard disk drive (HDD) form factor. The storage system includes a solid state disk (SSD) and a cooling means thermally coupled to the body of the SSD. The components of the SSD occupy a smaller volume of space than magnetic HDD's. In particular, while the SSD has width and length dimensions matching those of the HDD form factor, the SSD has a height dimension that is less than the HDD form factor. Accordingly, the volume of space between the HDD form factor height and the SSD height is beneficially occupied by the cooling means. The storage system can be then be used as a direct replacement for HDD as it can fit within HDD bays configured for the standardized HDD form factor.
Abstract:
A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device.
Abstract:
A NAND flash memory bank having a plurality of bitlines of a memory array connected to a page buffer, where NAND cell strings connected to the same bitline are formed in at least two well sectors. At least one well sector can be selectively coupled to an erase voltage during an erase operation, such that unselected well sectors are inhibited from receiving the erase voltage. When the area of the well sectors decrease, a corresponding decrease in the capacitance of each well sector results. Accordingly, higher speed erasing of the NAND flash memory cells relative to a single well memory bank is obtained when the charge pump circuit drive capacity remains unchanged. Alternately, a constant erase speed corresponding to a single well memory bank is obtained by matching a well segment having a specific area to a charge pump with reduced drive capacity. A reduced drive capacity charge pump will occupy less semiconductor chip area, thereby reducing cost.
Abstract:
A semiconductor device includes a Dynamic Random Access Memory (DRAM) memory array. The DRAM memory array includes a plurality of DRAM memory cells. Each of the DRAM memory cells includes a capacitor. Switching circuitry within the semiconductor device is configured to be switched to a state in which the switching circuitry connects capacitors of at least two of the DRAM memory cells together to provide a bulk capacitance between a first node and a second node.
Abstract:
A method and system for extending the life span of a flash memory device. The flash memory device is dynamically configurable to store data in the single bit per cell (SBC) storage mode or the multiple bit per cell (MBC) mode. In the MBC storage mode, the cell can have one of multiple possible states, where each state is defined by respective threshold voltage ranges. In the SBC mode, the cell can have states with threshold voltages corresponding to states of the MBC storage mode which are non-adjacent to each other to improve reliability characteristics of the cell.
Abstract:
A frequency multiplier circuit comprising a delay line receiving at one end thereof a reference clock for generating clock tap outputs from respective ones of a plurality of period matched delay elements; a clock combining circuit responsive to pairs of tap outputs for generating a rising and falling edge of an output clock pulse from respective ones of the pairs whereby the output clock period is less than the input clock period.
Abstract:
A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair.