公开(公告)号：US10395929B2

公开(公告)日：2019-08-27

申请号：US15859608

申请日：2017-12-31

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/498

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10381255B2

公开(公告)日：2019-08-13

申请号：US16214422

申请日：2018-12-10

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/57 ,  B32B43/00 ,  H01L21/683 ,  H01L21/78 ,  H01L21/67 ,  H01L23/544

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

公开(公告)号：US10330701B2

公开(公告)日：2019-06-25

申请号：US14962331

申请日：2015-12-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Yu Luo ,  John Knickerbocker ,  Yang Liu ,  Steven L. Wright

IPC: G01R1/073 ,  G01R31/28 ,  B23K35/00 ,  H01L23/00 ,  B81C1/00

Abstract: A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 μm). The subarray probe tips may be on a pitch at or less than fifty microns (50 μm). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing.

公开(公告)号：US10319893B2

公开(公告)日：2019-06-11

申请号：US15969402

申请日：2018-05-02

Applicant: International Business Machines Corporation

Inventor： Stephen W. Bedell ,  Bing Dang ,  Ning Li ,  Frank R. Libsch ,  Devendra K. Sadana

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/48

Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.

公开(公告)号：US10224219B2

公开(公告)日：2019-03-05

申请号：US14983674

申请日：2015-12-30

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Jeffrey Donald Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Tsang Yang

IPC: H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：US20180375067A1

公开(公告)日：2018-12-27

申请号：US15633301

申请日：2017-06-26

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Qianwen Chen ,  Yang Liu ,  Li-Wen Hung

IPC: H01M2/04 ,  H01M10/04

Abstract: A pre-cut glass body is employed as a separator between an anode current collector and a cathode current collector of a micro-battery. The use of a pre-cut glass body in micro-battery applications provides excellent insulation for the micro-battery and can also result in enhanced battery reliability and lifetime.

公开(公告)号：US10062622B2

公开(公告)日：2018-08-28

申请号：US15440032

申请日：2017-02-23

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Yu Luo

IPC: H01L23/02 ,  H01L23/10 ,  H01L31/0203 ,  H01L21/48 ,  B81B7/00 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81B7/0058 ,  B81C1/00269 ,  B81C2203/038 ,  H01L21/4817 ,  H01L21/50 ,  H01L31/0203

Abstract: A semiconductor device includes a first bonding surface disposed on a first component of the semiconductor device. A bond material is disposed on the first bonding surface, and a second bonding surface is disposed on a second component of the semiconductor device. The bond material is disposed on the second bonding surface. A first electroplated bond connects the bond material and the first bonding surface, and a second electroplated bond connects the bond material and the second bonding surface.

公开(公告)号：US10038232B2

公开(公告)日：2018-07-31

申请号：US15222119

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/02 ,  H01P3/12 ,  H01P3/08 ,  H01P5/08 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01P3/16 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01L23/538 ,  H01L23/00 ,  H05K1/02

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US09947570B2

公开(公告)日：2018-04-17

申请号：US15083665

申请日：2016-03-29

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Jeffrey Donald Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Tsang Yang

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：US20180098433A1

公开(公告)日：2018-04-05

申请号：US15821446

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30 ,  H05K1/03

CPC classification number: H05K1/189 ,  G01R31/2818 ,  G01R31/309 ,  G01R31/44 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/0052 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.