公开(公告)号：US20030162442A1

公开(公告)日：2003-08-28

申请号：US10375940

申请日：2003-02-25

Inventor： Augusto P. Panella

IPC: H01R013/648

CPC classification number: H05K1/0262 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: A substrate carries a voltage regulator module and a connector. By co-locating a voltage regulator to a processor or other circuit requiring a regulated power supply, distributed inductance associated with conventional circuit traces is reduced, thereby lessening demands on a voltage regulator and improving regulated voltage. A connector on the substrate can include internal filter capacitors to stabilize the output voltage from a voltage regulator. When the substrate is mounted to a circuit board, addition capacitors can be provided above and/or below the circuit board to which the substrate can be connected attached.

Abstract translation: 基板承载电压调节器模块和连接器。 通过将电压调节器与需要调节电源的处理器或其他电路共同定位，减小了与常规电路迹线相关联的分布式电感，从而减少对电压调节器的需求并改善调节电压。 衬底上的连接器可以包括用于稳定来自稳压器的输出电压的内部滤波电容器。 当基板安装到电路板上时，可以在连接基板的电路板的上方和/或下方设置附加电容器。

公开(公告)号：US20020176229A1

公开(公告)日：2002-11-28

申请号：US10132586

申请日：2002-04-25

Applicant: INCEP Technologies, Inc.

Inventor： Edward J. Derian ,  Joseph Ted DiBene II ,  David H. Hartke

IPC: H05K007/20 ,  H01L023/48

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.

Abstract translation: 一种用于从第一电路板向第二电路板提供电力的连接器。 该装置包括第一导电构件，其包括第一导电构件第一端和远离第一端的第一导电构件第二端; 设置在所述第一导电构件内的第二导电构件，所述第二导电构件包括第二导体构件第一端和远离所述第二导体构件第一端的第二导体构件第二端; 以及用于与第一电路板和第二电路板的电耦合的一个或多个第一电路板永久附接特征，以及用于将连接器与第二电路板电耦合的一个或多个可断开的导电特征。

公开(公告)号：US06483041B1

公开(公告)日：2002-11-19

申请号：US09438245

申请日：1999-11-12

Applicant: Stuart D. Downes

Inventor： Stuart D. Downes

IPC: H05K116

CPC classification number: H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

Abstract: The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

Abstract translation: 本发明涉及使用具有通道的销形成焊接连接​​的技术。 该通道使引脚与通孔形成牢固的连接（例如，通过在焊接期间促进气体渗透出通孔，以改善焊料流动，通过在引脚插入和焊接之前保持焊料，或通过促进精确的引脚弯曲来保持 焊接或插针插入，然后插入和焊接），以提高连接系统的可靠性并提高制造产量。 在一种布置中，销具有表面，其包括（i）第一表面区域，（ii）基本上平行于第一表面区域的第二表面区域，以及（iii）限定扩展的通道的通道表面区域 从第一表面区域朝向第二表面区域。 为了形成焊接连接​​，销在与通孔的中心轴平行的方向插入到由连接构件（例如电路板）的通孔限定的空腔中。 然后将引脚焊接到通孔，以在引脚和通孔之间建立电路径。 根据具体的布置，通道通常有助于将焊料引入到通孔的空腔中。 因此，通孔的腔体尺寸可以小于常规回流焊接方法的通孔所需的腔体尺寸（即，对于传统的回流焊接方法，其小于最大引脚横截面的100％）。 因此，本发明适用于高密度，微焊接的连接装置（例如，在通孔比常规回流焊接方法更靠近的情况下）。

公开(公告)号：US06469908B2

公开(公告)日：2002-10-22

申请号：US10076893

申请日：2002-02-14

Applicant: P. R. Patel ,  Yuan-Liang Li ,  David G. Figueroa ,  Shamala Chickamenahalli ,  Huong T. Do

Inventor： P. R. Patel ,  Yuan-Liang Li ,  David G. Figueroa ,  Shamala Chickamenahalli ,  Huong T. Do

IPC: H05K710

CPC classification number: H05K1/141 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0262 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2224/0401

Abstract: An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer. The second set of pins provide inputs and outputs to an integrated circuit mounted on the interposer. One or more conductive traces in or on the interposer electrically connect an output of the SDC to an input of the integrated circuit, thus supplying regulated power to the integrated circuit through the interposer. The SDC and integrated circuit can be directly mounted on the interposer, or either or both can be mounted on packages that connect to the interposer. The SDC and integrated circuit can be flip chips or can be connected to the interposer or package using wirebonds. The packages can be pinned or connectable by solder bumps.

Abstract translation: 插入器包括两组独立的引脚，并插入到印刷电路板上的两个插槽中。 一组引脚为安装在插入器上的降压转换器（SDC）供电。 第二组引脚为安装在插入器上的集成电路提供输入和输出。 插入器中或之上的一个或多个导电迹线将SDC的输出电连接到集成电路的输入，从而通过插入器向集成电路提供稳压电力。 SDC和集成电路可以直接安装在插入器上，或者两者都可以安装在连接到插入器的封装上。 SDC和集成电路可以是倒装芯片，也可以使用引线连接到插入器或封装。 封装可以通过焊料凸块固定或连接。

公开(公告)号：US06421783B1

公开(公告)日：2002-07-16

申请号：US09321109

申请日：1999-05-27

Applicant: Chih-Wen Liu ,  Chih-Chuan Chang ,  Yue-Jen Yang ,  Pao Chang Lin ,  Chih-Chung Cheng

Inventor： Chih-Wen Liu ,  Chih-Chuan Chang ,  Yue-Jen Yang ,  Pao Chang Lin ,  Chih-Chung Cheng

IPC: G06F1300

CPC classification number: H05K1/141 ,  H05K1/0262 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K2201/10704

Abstract: A microprocessor and main board mounting arrangement, which includes a computer main board, at least one socket respectively mounted on the computer main board, at least one microprocessor adapter respectively mounted on the at least one socket, said at least one microprocessor adapter each holding a respective microprocessor, for example, a Desktop Celeron CPU, a Mobile Celeron or Mobile Pentium II CPU, for enabling the respective microprocessor to be electrically connected to the computer main board, each microprocessor adapter having a voltage converter for converting output power supply of the computer main board into the necessary working voltage for the microprocessor.

Abstract translation: 一种微处理器和主板安装装置，其包括计算机主板，分别安装在所述计算机主板上的至少一个插槽，分别安装在所述至少一个插槽上的至少一个微处理器适配器，所述至少一个微处理器适配器各自容纳 相应的微处理器，例如台式赛扬CPU，移动赛扬或移动奔腾II CPU，用于使相应的微处理器电连接到计算机主板，每个微处理器适配器具有用于转换计算机的输出电源的电压转换器 主板进入微处理器的必要工作电压。

公开(公告)号：US20020070838A1

公开(公告)日：2002-06-13

申请号：US10013952

申请日：2001-12-13

Inventor： Gerald R. Behling ,  James B. Intrater

IPC: H01T004/02 ,  H01T004/06

CPC classification number: H01T4/08 ,  H01L23/60 ,  H01L23/62 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K1/0259 ,  H05K1/026 ,  H05K1/111 ,  H05K1/116 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: Over voltage protection is provided for electronic circuits by disposing one or more ground bars for diverting harmful currents away from the sensitive electronic circuit elements. The ground bars are each associated with a row of contact portions of the electronic circuit. Microgaps between each contact portion and the corresponding ground bar are designed to provide an electrical conduit from the contact portion to the ground bar when normal operating voltages are exceeded, thereby channeling excess current harmlessly to ground. Under normal operating conditions, however, the microgaps act as electrical barriers, insulating the contact portions from ground. The microgaps may be filled with any combination of air, vacuum, or known variable voltage material.

公开(公告)号：US06362438B1

公开(公告)日：2002-03-26

申请号：US09461901

申请日：1999-12-15

Applicant: Tee Onn Chong ,  Chris Baldwin ,  Chee-Yee Chung

Inventor： Tee Onn Chong ,  Chris Baldwin ,  Chee-Yee Chung

IPC: H05K111

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10704 ,  H05K2201/10734 ,  H01L2924/00

Abstract: The present invention provides a circuit board with a plated-through hole, wherein a first end of the plated-through hole is electrically attached to a cap formed of conductive material. One or more surface pads terminate on a surface layer of the printed circuit board, and are connected to the cap by one or more vias extending from the cap to the one or more surface pads. In some embodiments, the circuit board is a substrate for mounting an integrated circuit, such as a ball-grid array integrated circuit. The invention includes methods for making the novel circuit board, as well as integrated circuit assemblies comprising the novel circuit board with an integrated circuit mounted thereto.

Abstract translation: 本发明提供一种具有电镀通孔的电路板，其中电镀通孔的第一端电连接到由导电材料形成的盖上。 一个或多个表面焊盘终止在印刷电路板的表面层上，并且通过从盖延伸到一个或多个表面焊盘的一个或多个通孔连接到盖。 在一些实施例中，电路板是用于安装诸如球栅阵列集成电路的集成电路的基板。 本发明包括制造新型电路板的方法，以及包括具有安装在其上的集成电路的新颖电路板的集成电路组件。

公开(公告)号：US20020030979A1

公开(公告)日：2002-03-14

申请号：US09945016

申请日：2001-08-30

Inventor： Nai-Shung Chang

IPC: H05K007/02

CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/112 ,  H05K2201/10545 ,  H05K2201/10704 ,  H01L2924/00

Abstract: An integrated circuit pin layout for packaging a chip is provided. A layout for the pins in an integrated circuit package is provided to optimize most of the relative reference voltages or relative reference grounds. The power pins are put together after a definite number is exceeded and neighboring power pins are positioned perpendicular to the edge of the substrate board inside the integrated circuit package. Ultimately, the connection channels of the relative reference voltage layer or the relative power circuit layer (also called the relative reference ground layer) are widened. Consequently, high-frequency impedance of the substrate board is lowered, number of through holes is reduced, number of voltage-stabilizing capacitors is increased and power source is stabilized.

Abstract translation: 提供了用于封装芯片的集成电路引脚布局。 提供集成电路封装中引脚的布局，以优化大部分相对参考电压或相对参考电压。 电源引脚在超过一定数量后放在一起，相邻的电源引脚垂直于集成电路封装内的基板的边缘定位。 最终，相对参考电压层或相对功率电路层（也称为相对参考接地层）的连接通道被加宽。 因此，衬底板的高频阻抗降低，通孔数量减少，稳压电容器的数量增加，电源稳定。

公开(公告)号：US20010036066A1

公开(公告)日：2001-11-01

申请号：US09801437

申请日：2001-03-08

Inventor： Joseph T. Dibene II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

IPC: H05K001/00

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

Abstract translation: 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。

公开(公告)号：US20010033476A1

公开(公告)日：2001-10-25

申请号：US09798541

申请日：2001-03-02

Inventor： Joseph T. Dibene II ,  David H. Hartke ,  Wendell C. Johnson ,  Edward J. Derian

IPC: H05K007/20

CPC classification number: H05K7/20454 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.

Abstract translation: 公开了一种用于传递热量的方法，设备和制品。 该装置包括第一导热板; 第二导热板; 以及设置在热连通的第一导热板和第二导热板之间并且与热连通的角形波状部件。 所述角瓦状构件具有连续的周期性重复的横截面，所述横截面包括第一横截面段，所述第一横截面段基本上平行于第一导热板并与第一导热板热连通;第二横截面段，一次性基本上平行于并与之热连通 第二导热板和与第一表面和第二表面通信地连接的第三横截面段，其中第三横截面段与第一导热板形成一角度。