公开(公告)号：US20060094162A1

公开(公告)日：2006-05-04

申请号：US11253575

申请日：2005-10-20

申请人： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

发明人： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

IPC分类号： H01L21/50

CPC分类号： G01R1/0735 ,  Y10T29/49156

摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

摘要翻译： 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

公开(公告)号：US06624575B2

公开(公告)日：2003-09-23

申请号：US10061160

申请日：2002-02-04

申请人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

发明人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

IPC分类号： H01J1749

CPC分类号： H01J9/241 ,  H01J9/02

摘要： A gas discharge display device having a first substrate, a plurality of first electrodes having a substantially rectangular form being arranged on the first substrate, a plurality of second electrodes, respective ones of the plurality of second electrodes being formed on respective ones of the plurality of first electrodes, and each of the plurality of second electrodes having an extension extending beyond an end of a respective one of the plurality of first electrodes on which respective ones of the plurality of second electrodes are formed and in an oblique direction therefrom. The extension of the plurality of second electrodes extend beyond opposite ends of alternate ones of the plurality of first electrodes.

公开(公告)号：US06343967B1

公开(公告)日：2002-02-05

申请号：US09851989

申请日：2001-05-10

申请人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

发明人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Tomohiro Murase

IPC分类号： H01J900

CPC分类号： H01J9/241 ,  H01J9/02

摘要： A method of making a gas discharge display panel including the steps of providing a first substrate having a plurality of first electrodes and a plurality of second electrodes, laser processing said first electrodes into a rectangular form, forming the second electrodes on the first electrodes and providing a second substrate having a plurality of third electrodes and being opposed to the first substrate.

摘要翻译： 一种制造气体放电显示面板的方法，包括以下步骤：提供具有多个第一电极和多个第二电极的第一基板，将所述第一电极激光加工成矩形，在第一电极上形成第二电极，并提供 第二基板，具有多个第三电极并与第一基板相对。

公开(公告)号：US4806725A

公开(公告)日：1989-02-21

申请号：US71325

申请日：1987-07-09

申请人： Yasunori Narizuka ,  Keiji Mori ,  Akira Yabushita ,  Tsuneaki Kamei ,  Mamoru Morita

发明人： Yasunori Narizuka ,  Keiji Mori ,  Akira Yabushita ,  Tsuneaki Kamei ,  Mamoru Morita

IPC分类号： H05K3/34 ,  B41J2/335 ,  H05K3/24 ,  H05B1/00

CPC分类号： H05K3/244 ,  B41J2/3351 ,  B41J2/3352 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/33575 ,  H01L2224/81455 ,  H01L2224/81471 ,  H01L2924/01327

摘要： A circuit substrate, such as a thermal printing head, having electrodes made of a material suitable for soldering. The electrode to be soldered, at least in part, is composed of an alloy of Ni and Cu, whose composition ranges from 65 mol % Ni - 35 mol % Cu to 75 mol % Ni - 25 mol % Cu.

摘要翻译： 电路基板，例如热敏打印头，具有由适于焊接的材料制成的电极。 待焊接的电极至少部分由Ni和Cu的合金组成，其组成范围为65mol％Ni-35mol％Cu至75mol％Ni-25mol％Cu。

公开(公告)号：US07901958B2

公开(公告)日：2011-03-08

申请号：US12853360

申请日：2010-08-10

申请人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

发明人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

IPC分类号： G01R31/26 ,  H01L21/66

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

摘要翻译： 为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。 在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。 通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

公开(公告)号：US07219422B2

公开(公告)日：2007-05-22

申请号：US10765917

申请日：2004-01-29

申请人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

发明人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC分类号： H05K3/00 ,  H01R9/00

CPC分类号： G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

摘要： The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

摘要翻译： 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

公开(公告)号：US06652342B1

公开(公告)日：2003-11-25

申请号：US09299559

申请日：1999-04-27

申请人： Masashi Nishiki ,  Michifumi Kawai ,  Ryohei Satoh ,  Shigeaki Suzuki ,  Akira Yabushita ,  Masahito Ijuin

发明人： Masashi Nishiki ,  Michifumi Kawai ,  Ryohei Satoh ,  Shigeaki Suzuki ,  Akira Yabushita ,  Masahito Ijuin

IPC分类号： H01J902

CPC分类号： H01J11/22 ,  G03F7/0047 ,  H01J9/02 ,  H01J11/12 ,  H05K1/092 ,  H05K3/02

摘要： A gas discharge type display apparatus includes a front substrate having a plurality of first electrodes and a back substrate having a plurality of second electrodes and at least ones of the first and second electrodes are made of the photosensitive material containing silver exposed by using the laser thereby, making a mask unnecessary.

摘要翻译： 气体放电型显示装置包括具有多个第一电极的前基板和具有多个第二电极的后基板，并且第一和第二电极中的至少一个由包含通过使用激光曝光的银的感光材料制成， ，使面具不必要。

公开(公告)号：US5476726A

公开(公告)日：1995-12-19

申请号：US5353

申请日：1993-01-19

申请人： Masahide Harada ,  Akihiro Ando ,  Ryohei Satoh ,  Akira Yabushita ,  Naoya Kanda ,  Kazuhiko Horikoshi

发明人： Masahide Harada ,  Akihiro Ando ,  Ryohei Satoh ,  Akira Yabushita ,  Naoya Kanda ,  Kazuhiko Horikoshi

IPC分类号： B23K35/00 ,  H01L23/498 ,  H05K1/09 ,  H05K3/24 ,  B32B15/04 ,  H01L23/488

CPC分类号： H05K3/244 ,  B23K35/001 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2203/0723 ,  H05K2203/176 ,  Y10S428/901 ,  Y10T428/12687 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12882 ,  Y10T428/24917

摘要： A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.

摘要翻译： 形成在电路板上的焊料接合金属层包括金属层，该金属层具有容易形成合金或金属间化合物的金属容易润湿的第一金属和容易形成合金或金属间化合物的第一金属和不容易形成的第二金属的混合物 以上焊料不熔化。 在这种情况下，可以在金属层中形成接合面上的第一金属的浓度高的浓度梯度。 具有焊接接合金属层的电路板，即使在多次维修之后也能够保持良好的接合并提高可靠性。

公开(公告)号：US5235313A

公开(公告)日：1993-08-10

申请号：US723608

申请日：1991-07-01

申请人： Yasunori Narizuka ,  Syoozi Ikeda ,  Akira Yabushita ,  Masakazu Ishino ,  Juichi Kishida

发明人： Yasunori Narizuka ,  Syoozi Ikeda ,  Akira Yabushita ,  Masakazu Ishino ,  Juichi Kishida

IPC分类号： B41J2/335 ,  H01C7/00 ,  H05B3/12 ,  H05B3/14

CPC分类号： B41J2/33515 ,  B41J2/3355 ,  B41J2/3356 ,  B41J2/33565 ,  B41J2/3357 ,  B41J2/3359 ,  H01C7/006

摘要： A thin film resistor having a characteristic that an increase phenomenon of a resistance controlled at a high temperature is generated. The resistor is obtained by controlling its composition and manufacturing method so as to suppress an increase in the resistance of a Cr-Si resistor thin film due to deposition of chromium silicide at a high temperature. A sputtering target, which is used as a raw material for forming the thin film, is made from chromium silicide and silicon so that some chromium silicide is already formed immediately after deposition, and chromium oxide and silicon oxide are contained in the thin film so as to suppress the speed whereat chromium and silicon, which do not form silicide, form silicide by heating after deposition and to allow the above silicide formation to advance slowly.

摘要翻译： 具有产生在高温下控制的电阻增加现象的特性的薄膜电阻器。 通过控制其组成和制造方法来获得电阻器，以便抑制由于在高温下沉积硅化铬导致的Cr-Si电阻器薄膜的电阻增加。 用作形成薄膜的原料的溅射靶由硅化铬和硅制成，使得沉积后立即形成一些硅化铬，并且氧化铬和氧化硅被包含在薄膜中，以便 抑制不形成硅化物的铬和硅在沉积后通过加热形成硅化物，并允许上述硅化物形成缓慢进行。

公开(公告)号：US20110014727A1

公开(公告)日：2011-01-20

申请号：US12883982

申请日：2010-09-16

申请人： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

发明人： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

IPC分类号： H01L21/66 ,  H05K3/02

CPC分类号： G01R1/0735 ,  Y10T29/49156

摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

摘要翻译： 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。