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    Method for verifying a test substrate in a prober under defined thermal conditions
    11.
    发明授权
    Method for verifying a test substrate in a prober under defined thermal conditions 有权

    公开(公告)号：US09632108B2

    公开(公告)日：2017-04-25

    申请号：US14243640

    申请日：2014-04-02

    Applicant: CASCADE MICROTECH, INC.

    Inventor： Michael Teich ,  Stojan Kanev ,  Hans-Jurgen Fleischer

    IPC: G01R31/28 ,  G01R1/04

    CPC classification number: G01R1/0408 ,  G01R31/2855 ,  G01R31/2874 ,  G01R31/2875 ,  G01R31/2886

    Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

    Systems and methods for handling substrates at below dew point temperatures
    13.
    发明授权
    Systems and methods for handling substrates at below dew point temperatures 有权
    在低于露点温度下处理基材的系统和方法

    公开(公告)号：US09377423B2

    公开(公告)日：2016-06-28

    申请号：US14141781

    申请日：2013-12-27

    Applicant: Cascade Microtech, Inc.

    Inventor： Botho Hirschfeld ,  Axel Becker

    IPC: G01N25/66 ,  G01R31/00 ,  G01R31/28

    CPC classification number: G01N25/66 ,  G01R31/00 ,  G01R31/2862

    Abstract: Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.

    Abstract translation: 选择用于使用探针系统测试被测设备（DUT）的公开的系统和方法，以在低于探针系统周围环境环境露点的温度下测试DUT。 探测系统包括被配置为隔离冷却干燥测试环境的测量室和被配置为选择性地隔离测量室的内部体积的测量室门。 当在低温下测试被包括在基底上的DUT时，选择系统和方法以将至少部分与测量室隔离的干燥环境中的衬底加热至至少高于 露点和/或周围环境的霜点。

    SYSTEMS AND METHODS FOR ROTATIONAL ALIGNMENT OF A DEVICE UNDER TEST
    14.
    发明申请
    SYSTEMS AND METHODS FOR ROTATIONAL ALIGNMENT OF A DEVICE UNDER TEST 审中-公开
    用于测试装置的旋转对准的系统和方法

    公开(公告)号：US20140184003A1

    公开(公告)日：2014-07-03

    申请号：US14141749

    申请日：2013-12-27

    Applicant: CASCADE MICROTECH, INC.

    Inventor： Jorg Kiesewetter ,  Karsten Stoll

    IPC: H02K7/08 ,  G01R1/067

    CPC classification number: G01R1/067 ,  G01R31/2887

    Abstract: Systems and methods for rotational alignment of a device under test are disclosed herein. These systems include a chuck that includes a rotational positioning assembly that includes a lower section and an upper section that is configured to selectively rotate relative to the lower section about a rotational axis. The rotational positioning assembly further includes a first bearing that is configured to support a radial load between the upper section and the lower section and a second bearing that is configured to support a thrust load between the upper section and the lower section. The methods include providing a fluid stream to the second bearing to permit rotation of the upper section relative to the lower section, rotating the upper section relative to the lower section, and ceasing the providing the fluid stream to the second bearing to restrict rotation of the upper section relative to the lower section.

    Abstract translation: 本文公开了用于被测设备的旋转对准的系统和方法。 这些系统包括卡盘，其包括旋转定位组件，该旋转定位组件包括下部部分和被配置为围绕旋转轴线相对于下部部分选择性地旋转的上部部件。 旋转定位组件还包括第一轴承，其构造成支撑在上部段和下部分之间的径向载荷;以及第二轴承，其构造成支撑上部和下部之间的推力载荷。 所述方法包括向第二轴承提供流体流以允许上部相对于下部旋转，使上部相对于下部旋转，并停止向第二轴承提供流体流以限制第二轴承的旋转 上部相对于下部。

    Probe systems and methods for automatically maintaining alignment between a probe and a device under test during a temperature change
    16.
    发明授权
    Probe systems and methods for automatically maintaining alignment between a probe and a device under test during a temperature change 有权

    公开(公告)号：US10365323B2

    公开(公告)日：2019-07-30

    申请号：US15339419

    申请日：2016-10-31

    Applicant: Cascade Microtech, Inc.

    Inventor： Peter Douglas Andrews ,  David Michael Newton ,  David Randle Hess

    IPC: G01R31/28

    Abstract: Probe systems and methods for automatically maintaining alignment between a probe and a device under test (DUT) during a temperature change. The methods include collecting an initial image of a planar offset fiducial and determining an initial height reference of a height offset fiducial. The methods further include changing a temperature of the DUT, automatically maintaining a planar alignment between a probe and the DUT during the changing, and automatically maintaining a height alignment between the probe and the BUT during the changing. The probe systems include a chuck, which defines a support surface configured to support a substrate that includes the DUT, and a probe head assembly, which includes a probe configured to contact a corresponding contact pad of the DUT. The probe systems further include a substrate thermal module, which is configured to regulate a temperature of the DUT, and a controller programmed to execute the methods.

    Systems and methods for on-wafer dynamic testing of electronic devices
    17.
    发明授权
    Systems and methods for on-wafer dynamic testing of electronic devices 有权

    公开(公告)号：US10281518B2

    公开(公告)日：2019-05-07

    申请号：US14625385

    申请日：2015-02-18

    Applicant: Cascade Microtech, Inc.

    Inventor： Kazuki Negishi ,  Eric Hill

    IPC: G01R1/04 ,  G01R31/26 ,  G01R31/28

    Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.

    Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
    18.
    发明授权
    Probe head assemblies, components thereof, test systems including the same, and methods of operating the same 有权

    公开(公告)号：US09989558B2

    公开(公告)日：2018-06-05

    申请号：US14972705

    申请日：2015-12-17

    Applicant: Cascade Microtech, Inc.

    Inventor： Koby Duckworth ,  Eric Hill

    IPC: G01R1/067 ,  G01R1/073 ,  G01R31/28

    CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

    Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

    CONTACT ENGINES, PROBE HEAD ASSEMBLIES, PROBE SYSTEMS, AND ASSOCIATED METHODS FOR ON-WAFER TESTING OF THE WIRELESS OPERATION OF A DEVICE UNDER TEST
    19.
    发明申请
    CONTACT ENGINES, PROBE HEAD ASSEMBLIES, PROBE SYSTEMS, AND ASSOCIATED METHODS FOR ON-WAFER TESTING OF THE WIRELESS OPERATION OF A DEVICE UNDER TEST 审中-公开

    公开(公告)号：US20180149674A1

    公开(公告)日：2018-05-31

    申请号：US15821101

    申请日：2017-11-22

    Applicant: Cascade Microtech, Inc.

    Inventor： Daniel Mark Bock ,  Tim Cleary

    IPC: G01R1/073 ,  G01R31/302

    Abstract: Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test (DUT). A contact engine includes a flexible dielectric membrane having a first surface and a second surface and a plurality of probes supported by the flexible dielectric membrane. The plurality of probes are oriented to contact a plurality of contact locations on the DUT. Each probe in the plurality of probes includes a corresponding probe tip that projects from the second surface of the flexible dielectric membrane and is configured to electrically and physically contact a corresponding contact location of the plurality of contact locations. The contact engine further includes at least one membrane antenna supported by the flexible dielectric membrane. A probe head assembly includes the contact engine. A probe system includes the probe head assembly. Associated methods include methods of utilizing the contact engine.

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