公开(公告)号：US08564212B2

公开(公告)日：2013-10-22

申请号：US13180431

申请日：2011-07-11

Applicant: Guan-Chyun Hsieh ,  Cheng-Chih Chu

Inventor： Guan-Chyun Hsieh ,  Cheng-Chih Chu

IPC: H05B37/02

CPC classification number: H05B33/0827

Abstract: Method for managing power of a display and apparatus thereof are provided. The proposed method includes the following steps: calculating a most appropriating voltage value and a most appropriating current value form a plurality of LEDs; and obtaining a first optimal working point according to the most appropriating voltage value and the most appropriating current value, wherein the first optimal working point is used for arranging the plurality of LEDs.

Abstract translation: 提供了用于管理显示器的电源的方法及其装置。 所提出的方法包括以下步骤：由多个LED计算最适当的电压值和最适当的电流值; 并且根据最适当的电压值和最适当的电流值获得第一最佳工作点，其中第一最佳工作点用于布置多个LED。

公开(公告)号：US20120049338A1

公开(公告)日：2012-03-01

申请号：US13290819

申请日：2011-11-07

Applicant: Kuang-Hsiung Chen ,  Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Hui-Shan Chang ,  Pei-Yu Hsu ,  Fa-Hao Wu ,  Chen-Yu Chia ,  Chi-Chih Chu ,  Cheng-Yi Weng ,  Ya-Wen Hsu

Inventor： Kuang-Hsiung Chen ,  Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Hui-Shan Chang ,  Pei-Yu Hsu ,  Fa-Hao Wu ,  Chen-Yu Chia ,  Chi-Chih Chu ,  Cheng-Yi Weng ,  Ya-Wen Hsu

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract translation: 在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。 封装主体的侧表面基本上与衬底单元的侧表面对准。 包装体限定了至少部分地暴露相应的连接元件的开口。 连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

公开(公告)号：US20110117700A1

公开(公告)日：2011-05-19

申请号：US12846630

申请日：2010-07-29

Applicant: CHENG-YI WENG ,  Chi-Chih Chu ,  Chien-Yuan Tseng

Inventor： CHENG-YI WENG ,  Chi-Chih Chu ,  Chien-Yuan Tseng

IPC: H01L21/50

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Described herein are stackable semiconductor device packages and related stacked package assemblies and methods. In one embodiment, a manufacturing method includes: (1) providing a substrate including contact pads disposed adjacent to an upper surface of the substrate; (2) applying an electrically conductive material to form conductive bumps disposed adjacent to respective ones of the contact pads; (3) electrically connecting a semiconductor device to the upper surface of the substrate; (4) applying a molding material to form a molded structure covering the conductive bumps and the semiconductor device; (5) forming a set of cutting slits extending partially through the molded structure and the conductive bumps to form truncated conductive bumps; and (6) reflowing the truncated conductive bumps to form reflowed conductive bumps.

Abstract translation: 这里描述的是可堆叠的半导体器件封装和相关的堆叠封装组件和方法。 在一个实施例中，制造方法包括：（1）提供包括邻近衬底的上表面设置的接触焊盘的衬底; （2）施加导电材料以形成邻近相应接触焊盘设置的导电凸块; （3）将半导体器件电连接到衬底的上表面; （4）施加模塑材料以形成覆盖导电凸块和半导体器件的模制结构; （5）形成一组切割狭缝，其部分地延伸穿过模制结构和导电凸块以形成截断的导电凸块; 和（6）回流截断的导电凸块以形成回流的导电凸块。

公开(公告)号：US20100237490A1

公开(公告)日：2010-09-23

申请号：US12561627

申请日：2009-09-17

Applicant: Chi-Chih CHU ,  Lin-Wang YU

Inventor： Chi-Chih CHU ,  Lin-Wang YU

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L23/49833 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a packaging substrate, a chip, an interposer substrate, a wire and an adhesive layer. The packaging substrate has an upper packaging surface. The chip is disposed on the upper packaging surface. The wire connects the packaging substrate and the interposer substrate. The adhesive layer is disposed between the packaging substrate and the interposer substrate, and covers the entire chip and part of the upper packaging surface. The adhesive layer includes a first adhesive part and a second adhesive part. The first adhesive part adheres the interposer substrate and the chip. The second adhesive part surrounds the first adhesive part, adheres the interposer substrate and the packaging substrate, and supports a periphery of the interposer substrate.

Abstract translation: 提供一种封装结构及其制造方法。 封装结构包括封装衬底，芯片，插入器衬底，线和粘合剂层。 包装基材具有上包装表面。 芯片设置在上部包装表面上。 导线连接包装基板和插入器基板。 粘合剂层设置在包装基板和插入件基板之间，并且覆盖整个芯片和上部封装表面的一部分。 粘合层包括第一粘合部分和第二粘合部分。 第一粘合部分粘附插入物基片和芯片。 第二粘合剂部分围绕第一粘合剂部分，粘合内插基片和封装基片，并且支撑插入物基片的周边。

公开(公告)号：US20100171206A1

公开(公告)日：2010-07-08

申请号：US12544560

申请日：2009-08-20

Applicant: Chi-Chih Chu ,  Cheng-Yi Weng

Inventor： Chi-Chih Chu ,  Cheng-Yi Weng

IPC: H01L23/538 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes: (1) a substrate including an upper surface and a lower surface opposite to the upper surface; (2) a chip mounted and electrically connected to the upper surface of the substrate; (3) an interposer mounted on the chip and electrically connected to the upper surface of the substrate, the interposer including an upper surface and a lower surface that is opposite to the upper surface and facing the chip, the interposer including a plurality of electrical contacts located on the upper surface of the interposer; and (4) a molding compound sealing the substrate, the interposer, and the chip, and exposing the lower surface of the substrate, the molding compound defining a plurality of holes that enclose and expose respective ones of the electrical contacts.

Abstract translation: 半导体封装包括：（1）包括上表面和与上表面相对的下表面的基板; （2）安装并电连接到所述基板的上表面的芯片; （3）安装在芯片上并电连接到衬底的上表面的插入器，插入器包括与上表面相对并面向芯片的上表面和下表面，插入器包括多个电触点 位于中介层的上表面上; 以及（4）密封基板，插入件和芯片的模塑料，并且暴露基板的下表面，模制化合物限定了包围并暴露相应的电触头的多个孔。

公开(公告)号：US20100014015A1

公开(公告)日：2010-01-21

申请号：US12416302

申请日：2009-04-01

Applicant: Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

Inventor： Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

IPC: G02F1/1335 ,  G09F13/04

CPC classification number: G02F1/133605 ,  G02F2202/22 ,  G09F13/04 ,  G09F13/14

Abstract: A backlight module and a display panel device using the same are provided. The backlight module includes a light source module, an open frame, and a reflector sheet. The open frame is disposed around the light source module and has a first free-end and a second free-end. A space interval exists between the first and second free-ends. The reflector sheet is disposed on a rear side of the light source module and has a body and a sidewall. The sidewall corresponds to the space interval between the first and second free-ends and extends over the light source module. The display panel further includes a liquid crystal display panel (LCD panel) on the light source module and a front frame which is disposed on the LCD panel enclosing a lateral side of the LCD panel. The sidewall of the reflector sheet extends between the lateral side of the LCD panel and the front frame to provide insulation.

Abstract translation: 提供背光模块和使用其的显示面板装置。 背光模块包括光源模块，开放框架和反射板。 开放框架设置在光源模块周围，并且具有第一自由端和第二自由端。 在第一和第二自由端之间存在空间间隔。 反射片设置在光源模块的后侧，具有主体和侧壁。 侧壁对应于第一自由端和第二自由端之间的间隔，并且在光源模块上延伸。 显示面板还包括在光源模块上的液晶显示面板（LCD面板）和设置在LCD面板上的前框架，该框架包围LCD面板的侧面。 反射片的侧壁在LCD面板的侧面和前框架之间延伸以提供绝缘。

公开(公告)号：US20090264572A1

公开(公告)日：2009-10-22

申请号：US12137861

申请日：2008-06-12

Applicant: Chin-Yi LIAO ,  Chien-Chih CHU

Inventor： Chin-Yi LIAO ,  Chien-Chih CHU

IPC: C08L83/06 ,  C08G65/332 ,  C08K3/22 ,  C08K3/30 ,  C08K3/26 ,  C08K3/34 ,  C08L67/00

CPC classification number: C09D171/02 ,  C08K3/22 ,  C08K3/26 ,  C08K3/30 ,  C08K3/34 ,  C08K5/0075 ,  C08K5/5419 ,  C08L33/08 ,  C08L83/06 ,  C09D7/61 ,  C09D7/65 ,  C09D7/67 ,  C09K3/16 ,  C08L2666/04

Abstract: A coating composition comprises a resin, an antistatic agent and an antistatic aid, wherein the antistatic aid is selected from a group consisting of a siloxane compound, a fluoro-compound and a combination thereof. The antistatic aid can generate a synergy effect with the antistatic agent, and carry the antistatic agent out of the coating surface, thus can obviously reduce the amount of antistatic agent to achieve the desired antistatic effect by using a small amount of antistatic aid. The coating composition can be applied to various products with antistatic needs.

Abstract translation: 涂料组合物包含树脂，抗静电剂和抗静电助剂，其中抗静电助剂选自硅氧烷化合物，氟化合物及其组合。 抗静电剂可以与抗静电剂产生协同作用，并将抗静电剂从涂层表面出来，因此可以通过使用少量的抗静电剂显着地减少抗静电剂的量以达到所需的抗静电效果。 涂料组合物可以应用于具有抗静电需要的各种产品。

公开(公告)号：US07500801B2

公开(公告)日：2009-03-10

申请号：US11979646

申请日：2007-11-07

Applicant: Ming-Chih Chu ,  Cheng-Yi Wang

Inventor： Ming-Chih Chu ,  Cheng-Yi Wang

IPC: A46B17/04

CPC classification number: A45D34/04 ,  A45D34/042 ,  A46B11/0041 ,  A46B11/0079 ,  A46B2200/1046

Abstract: A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component.

Abstract translation: 液体化妆品容器具有刷装置，其包括连接到容器主体的施加部件和围绕施加部件的夹持部件; 所述涂敷部件位于所述容器主体的开口部的上方，并具有用于使液体化妆品流过的通道; 所述施加部件具有位于所述通道的尾端附近的尾部的施加部分; 剪切元件具有开口端，并且延伸穿过开口端的两个间隙，因此开口端是可压缩的; 夹持部件在开口端的内侧具有两个相对的夹持部分; 盖用于覆盖容器主体的开口; 盖在内侧具有挤压部分，以压缩夹持部件的开口端，以阻止施加部件的通过。

公开(公告)号：US07417329B2

公开(公告)日：2008-08-26

申请号：US11420230

申请日：2006-05-25

Applicant: Meng-Jung Chuang ,  Cheng-Yin Lee ,  Wei-Chang Tai ,  Chi-Chih Chu

Inventor： Meng-Jung Chuang ,  Cheng-Yin Lee ,  Wei-Chang Tai ,  Chi-Chih Chu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/284 ,  H05K3/3452 ,  H05K2203/0588 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.

Abstract translation: 系统级封装结构包括具有成型区域和周边区域的载体基板，至少设置在模制区域中的芯片，覆盖芯片和模制区域的封装，设置在外围区域中的多个焊盘 以及设置在周边区域中并部分地暴露焊盘表面的焊接掩模。 焊料掩模至少包括其中的空隙。

公开(公告)号：US20050047069A1

公开(公告)日：2005-03-03

申请号：US10956604

申请日：2004-10-01

Applicant: Chih Chu

Inventor： Chih Chu

IPC: G06F1/16

CPC classification number: G06F1/1698 ,  G06F1/1626 ,  G06F1/166 ,  G06F1/1679 ,  G06F2200/1614 ,  G06F2200/1634

Abstract: A universal entertainment system includes an entertainment unit, a universal mounting stand, and a folding joint. The entertainment unit includes an entertainment housing having a multimedia compartment, a display screen provided on a screen side, and a multi-functional multimedia circuitry disposed in the multimedia compartment for reading digital data of a multimedia. The universal mounting stand is adapted for supporting at a fixture surface. The folding joint pivotally connects the entertainment unit with the universal mounting stand in a rotatably movable manner, wherein the entertainment unit is adapted to pivotally fold with respect to the universal mounting stand to selectively adjust a tilt angle of the display screen with respect to the fixture surface and is adapted to rotatably fold with respect to the universal mounting stand to selectively adjust a revolving angle with respect to the universal mounting stand.

Abstract translation: 通用娱乐系统包括娱乐单元，通用安装支架和折叠接头。 娱乐单元包括具有多媒体室的娱乐室，在屏幕侧设置的显示屏，以及设置在多媒体室中用于读取多媒体数字数据的多功能多媒体电路。 通用安装支架适于在夹具表面上支撑。 折叠接头以可旋转的方式将娱乐单元与通用安装台枢转地连接，其中娱乐单元适于相对于通用安装台可枢转地折叠，以选择性地调节显示屏相对于固定装置的倾斜角度 并且适于相对于通用安装台可旋转地折叠以选择性地相对于通用安装台调节旋转角度。