公开(公告)号：US20120312040A1

公开(公告)日：2012-12-13

申请号：US13490552

申请日：2012-06-07

申请人： Inho CHOI ,  Keunseo PARK ,  Kyunghwan KIM

发明人： Inho CHOI ,  Keunseo PARK ,  Kyunghwan KIM

IPC分类号： F25D21/06

CPC分类号： B60H1/00392 ,  B60H1/00907 ,  B60H1/321 ,  B60H2001/00949 ,  B60H2001/00961 ,  F25B13/00 ,  F25B47/02 ,  F25B2313/008 ,  F25B2313/0251 ,  F25B2313/02741

摘要： The present invention relates to an air conditioner in an electric vehicle, and more particularly to an air conditioner in an electric vehicle, which can make continuous heating operation even in defrosting operation, can enhance heating efficiency and performance even in the defrosting operation, and can recover heat discharged from various components of the electric vehicle even in the defrosting operation for preventing liquid refrigerant from being introduced to a compressor.

摘要翻译： 本发明涉及一种电动车辆中的空气调节器，更具体地，涉及一种即使在除霜操作中也能够进行连续加热操作的电动车辆中的空调机，即使在除霜操作中也可以提高加热效率和性能，并且可以 即使在用于防止液体制冷剂被引入压缩机的除霜操作中，也能够回收从电动车辆各部件排出的热量。

公开(公告)号：US20110285152A1

公开(公告)日：2011-11-24

申请号：US13114818

申请日：2011-05-24

申请人： Jeong Hwan Kwon ,  Inho Choi ,  Nakseung Jung ,  Mun Yong Lee ,  Sang Eon Park

发明人： Jeong Hwan Kwon ,  Inho Choi ,  Nakseung Jung ,  Mun Yong Lee ,  Sang Eon Park

IPC分类号： B60R19/02

CPC分类号： B60R19/34 ,  B60R19/24 ,  B60R2019/182 ,  B60R2019/242

摘要： A bumper beam assembly for a vehicle may include a bumper beam having a horizontal support plate, front and rear vertical support plates attached to the horizontal support plate, wherein the rear vertical support plate includes an insertion hole, a partition formed along the horizontal support plate between the front and rear vertical support plates, and a stay, an end portion of which may be inserted into the insertion hole.

摘要翻译： 用于车辆的保险杠梁组件可以包括具有水平支撑板的缓冲梁，附接到水平支撑板的前后垂直支撑板，其中后垂直支撑板包括插入孔，沿着水平支撑板形成的隔板 在前后垂直支撑板之间，并且其端部可以插入到插入孔中的撑杆。

公开(公告)号：US09991245B2

公开(公告)日：2018-06-05

申请号：US14958928

申请日：2015-12-03

申请人： Jae Choon Kim ,  Donghan Kim ,  Jikho Song ,  Mitsuo Umemoto ,  Inho Choi

发明人： Jae Choon Kim ,  Donghan Kim ,  Jikho Song ,  Mitsuo Umemoto ,  Inho Choi

IPC分类号： H01L23/495 ,  H01L23/10 ,  H01L23/34 ,  H01L25/00 ,  H01L23/367 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar.

公开(公告)号：US20160204080A1

公开(公告)日：2016-07-14

申请号：US14958928

申请日：2015-12-03

申请人： Jae Choon KIM ,  Donghan KIM ,  Jikho SONG ,  Mitsuo UMEMOTO ,  Inho CHOI

发明人： Jae Choon KIM ,  Donghan KIM ,  Jikho SONG ,  Mitsuo UMEMOTO ,  Inho CHOI

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L23/31

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar.

摘要翻译： 一种半导体封装，包括：半导体芯片; 与所述半导体芯片相邻配置的连接柱; 设置在半导体芯片上的第一散热层; 以及设置在所述第一散热层上的第二散热层，所述第二散热层包括延伸超过所述半导体芯片的周边并朝向所述连接柱延伸的第一突起。

公开(公告)号：US09105503B2

公开(公告)日：2015-08-11

申请号：US14047120

申请日：2013-10-07

申请人： Yonghoon Kim ,  Hyo-Soon Kang ,  Inho Choi

发明人： Yonghoon Kim ,  Hyo-Soon Kang ,  Inho Choi

IPC分类号： H01L23/48 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

摘要： A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device.

摘要翻译： 包装封装器件在封装衬底上并排地包括存储器芯片。 因此，可以减小半导体封装的厚度。 此外，逻辑芯片的数据和指令板可以被定位成与存储器芯片的数据和指令焊盘相邻。 因此，焊盘之间的布线距离可以缩小，因此可以提高信号传送速度。 这使得可以提高装置的操作速度。

公开(公告)号：US08336934B2

公开(公告)日：2012-12-25

申请号：US13114818

申请日：2011-05-24

申请人： Jeong Hwan Kwon ,  Inho Choi ,  Nakseung Jung ,  Mun Yong Lee ,  Sang Eon Park

发明人： Jeong Hwan Kwon ,  Inho Choi ,  Nakseung Jung ,  Mun Yong Lee ,  Sang Eon Park

IPC分类号： B60R19/24

CPC分类号： B60R19/34 ,  B60R19/24 ,  B60R2019/182 ,  B60R2019/242

摘要： A bumper beam assembly for a vehicle may include a bumper beam having a horizontal support plate, front and rear vertical support plates attached to the horizontal support plate, wherein the rear vertical support plate includes an insertion hole, a partition formed along the horizontal support plate between the front and rear vertical support plates, and a stay, an end portion of which may be inserted into the insertion hole.

摘要翻译： 用于车辆的保险杠梁组件可以包括具有水平支撑板的缓冲梁，附接到水平支撑板的前后垂直支撑板，其中后垂直支撑板包括插入孔，沿着水平支撑板形成的隔板 在前后垂直支撑板之间，并且其端部可以插入到插入孔中的撑杆。

公开(公告)号：US20120055656A1

公开(公告)日：2012-03-08

申请号：US13030920

申请日：2011-02-18

申请人： Sungwon Han ,  Inho Choi ,  Kyunghwan Kim ,  Kidong Kim

发明人： Sungwon Han ,  Inho Choi ,  Kyunghwan Kim ,  Kidong Kim

IPC分类号： F28F13/12 ,  F01D5/22

CPC分类号： F04D29/281 ,  F04D29/30

摘要： A turbo fan includes a main plate for rotation in a rotational direction about a rotational axis and a plurality of blades arranged at intervals around the rotational axis of the main plate. At least one blade includes: a first blade section having a leading end and a trailing end; a second blade section having a leading end and a trailing end, wherein the first blade section is between the main plate and the second blade section; and a third blade section having a leading end and a trailing end, wherein the third blade section is between the first blade section and the second blade section.

摘要翻译： 涡轮风扇包括用于沿旋转轴线旋转的方向旋转的主板和围绕主板的旋转轴线间隔开的多个叶片。 至少一个叶片包括：具有前端和后端的第一叶片部分; 第二叶片部分，其具有前端和后端，其中所述第一叶片部分在所述主板和所述第二叶片部分之间; 以及具有前端和后端的第三叶片部分，其中所述第三叶片部分在所述第一叶片部分和所述第二叶片部分之间。

公开(公告)号：US20050113568A1

公开(公告)日：2005-05-26

申请号：US10786052

申请日：2004-02-26

申请人： Chulwook Kim ,  Jungsou Yeo ,  Junggyu Lee ,  Youngmin Song ,  Kwangkeun Cho ,  Kihwa Chung ,  Ilsuk Kim ,  Sangkeun Jin ,  Suhyun Park ,  Jiwon Jung ,  Minjung Lee ,  Eunjung Kwon ,  Eunsegk Cho ,  Hwokrai Cho ,  Sunmin Shin ,  Heesun Nam ,  Yeonhee Hong ,  Sungkwang Hong ,  Yangsu Kang ,  Youngjoo Ha ,  Jeongman Rou ,  Sukchun Kwack ,  Inho Choi ,  Byeongwoo Kim

发明人： Chulwook Kim ,  Jungsou Yeo ,  Junggyu Lee ,  Youngmin Song ,  Kwangkeun Cho ,  Kihwa Chung ,  Ilsuk Kim ,  Sangkeun Jin ,  Suhyun Park ,  Jiwon Jung ,  Minjung Lee ,  Eunjung Kwon ,  Eunsegk Cho ,  Hwokrai Cho ,  Sunmin Shin ,  Heesun Nam ,  Yeonhee Hong ,  Sungkwang Hong ,  Yangsu Kang ,  Youngjoo Ha ,  Jeongman Rou ,  Sukchun Kwack ,  Inho Choi ,  Byeongwoo Kim

IPC分类号： C12N15/12 ,  C07H21/00 ,  C07H21/04 ,  C07K14/47

CPC分类号： C07K14/47

摘要： The present invention relates to novel growth-related genes derived from pig and provides novel growth-related genes DNA which are involved in incensement of growth rate of pig using the microarray technology. Therefore, the growth-related genes derived from pig according to the present invention can be used in feeds for increasing the daily body weight gain of pig or applied in genetic improvement of pig with excellent growth performance. Thus, the present invention is very useful for the hog raising industry.

摘要翻译： 本发明涉及来自猪的新型生长相关基因，并提供使用微阵列技术参与猪生长速度参与的新型生长相关基因DNA。 因此，根据本发明的来自猪的生长相关基因可用于增加猪的日常体重增加或用于具有优异生长性能的猪的遗传改良中的饲料中。 因此，本发明对于养猪业非常有用。

公开(公告)号：US20050112597A1

公开(公告)日：2005-05-26

申请号：US10785981

申请日：2004-02-26

申请人： Chulwook Kim ,  Jungsou Yeo ,  Junggyu Lee ,  Youngmin Song ,  Kwangkeun Cho ,  Kihwa Chung ,  Ilsuk Kim ,  Sangkeun Jin ,  Suhyun Park ,  Jiwon Jung ,  Minjung Lee ,  Eunjung Kwon ,  Eunsegk Cho ,  Hwokrai Cho ,  Sunmin Shin ,  Heesun Nam ,  Yeonhee Hong ,  Sungkwang Hong ,  Yangsu Kang ,  Youngjoo Ha ,  Jeongman Rou ,  Sukchun Kwack ,  Inho Choi ,  Byeongwoo Kim

发明人： Chulwook Kim ,  Jungsou Yeo ,  Junggyu Lee ,  Youngmin Song ,  Kwangkeun Cho ,  Kihwa Chung ,  Ilsuk Kim ,  Sangkeun Jin ,  Suhyun Park ,  Jiwon Jung ,  Minjung Lee ,  Eunjung Kwon ,  Eunsegk Cho ,  Hwokrai Cho ,  Sunmin Shin ,  Heesun Nam ,  Yeonhee Hong ,  Sungkwang Hong ,  Yangsu Kang ,  Youngjoo Ha ,  Jeongman Rou ,  Sukchun Kwack ,  Inho Choi ,  Byeongwoo Kim

IPC分类号： C12Q1/68 ,  G01N33/48 ,  G01N33/50 ,  G06F19/00

CPC分类号： C12Q1/6888 ,  C12Q1/6837 ,  C12Q2600/158

摘要： The present invention relates to screening of the expression profile of growth specific genes in swine and a functional cDNA chip using the same and provides nucleotide sequences of novel growth factors related to the growth in the muscle and fat tissues of swine. Also, the present invention provides a functional cDNA chip for screening and function analysis of growth specific gene according to breeds and tissues of swine prepared by integrating only the growth specific genes obtained as described above. Therefore, the functional cDNA chip for screening and function analysis of growth specific gene according to breeds and tissues of swine can be used in the swine improvement and breeding of a new breed.

摘要翻译： 本发明涉及使用该方法筛选猪和功能性cDNA芯片中生长特异性基因的表达谱，并提供与猪的肌肉和脂肪组织中生长相关的新生长因子的核苷酸序列。 此外，本发明提供了一种功能性cDNA芯片，用于根据通过仅将如上所述获得的生长特异性基因整合制备的猪的品种和组织的生长特异性基因的筛选和功能分析。 因此，根据猪的品种和组织的生长特异性基因的筛选和功能分析的功能cDNA芯片可用于新品种的猪改良和育种。