公开(公告)号：US20130161085A1

公开(公告)日：2013-06-27

申请号：US13402638

申请日：2012-02-22

申请人： Hueng Jae Oh ,  Boo Yang Jung ,  Dae Young Lee ,  Jin Won Choi

发明人： Hueng Jae Oh ,  Boo Yang Jung ,  Dae Young Lee ,  Jin Won Choi

IPC分类号： H05K1/18 ,  H05K3/00

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/11474 ,  H01L2224/1184 ,  H01L2224/119 ,  H01L2224/11912 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/831 ,  H05K1/111 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0588 ,  Y02P70/611 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.

摘要翻译： 这里公开了印刷电路板（PCB）及其制造方法。 PCB包括基底基板，形成在基底基板上的电路层，包括连接焊盘，形成在基底基板的上部上并具有露出连接焊盘的开口的阻焊层，形成在上部的金属柱 的连接焊盘和阻焊层，并且具有多个直径，以及沿着金属柱的界面形成在阻焊层的上部和开口的内壁上的种子层。

公开(公告)号：US08420955B2

公开(公告)日：2013-04-16

申请号：US12805413

申请日：2010-07-29

申请人： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

发明人： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

IPC分类号： H05K1/11 ,  H05K7/00 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.

摘要翻译： 用于封装衬底的引脚包括耦合销，头部和防止流动部分。 连接销插入到形成在外部基板中的孔中。 头部形成在连接销的一端。 当头部安装在封装基板上时，流动防止部分形成在头部的顶表面上，并防止焊膏朝向头部的顶表面上的连接销流动。

公开(公告)号：US20110185122A1

公开(公告)日：2011-07-28

申请号：US13015100

申请日：2011-01-27

申请人： Jin Won Choi

发明人： Jin Won Choi

IPC分类号： G06F12/00

CPC分类号： G06F3/0635 ,  G06F3/0607 ,  G06F3/0683 ,  G06F3/0689 ,  G06F11/1008 ,  G06F11/1076

摘要： A storage system includes a plurality of data processing devices connected in series. One of the data processing devices either accesses a first data storage device or transmits an access command output from a host to an next data processing device in the series according to the access command. The data processing device determines whether to access a second data storage device according to the received access command.

摘要翻译： 存储系统包括串联连接的多个数据处理装置。 数据处理装置中的一个可以访问第一数据存储装置，或者根据访问命令将从主机输出的访问命令发送到该系列中的下一个数据处理装置。 数据处理装置根据接收到的访问命令确定是否存取第二数据存储装置。

公开(公告)号：US20110133332A1

公开(公告)日：2011-06-09

申请号：US12926279

申请日：2010-11-05

申请人： Seon Jae Mun ,  Dae Young Lee ,  Tae Joon Chung ,  Dong Gyu Lee ,  Jin Won Choi

发明人： Seon Jae Mun ,  Dae Young Lee ,  Tae Joon Chung ,  Dong Gyu Lee ,  Jin Won Choi

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°.

摘要翻译： 提供了一种通过改善焊料凸块的结构来提高可靠性的封装衬底及其制造方法。 封装衬底包括：具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 位于所述开口内的所述导电垫上的支柱端子; 以及设置在立柱端子上并且在其底表面和侧表面之间具有从80°至120°的角度的焊料凸块。

公开(公告)号：US20110127676A1

公开(公告)日：2011-06-02

申请号：US12805295

申请日：2010-07-22

申请人： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

发明人： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

IPC分类号： H01L23/48 ,  H01B5/00

CPC分类号： H01L23/49811 ,  H01L2224/32225 ,  H01L2924/09701

摘要： Disclosed is a lead pin for a semiconductor package. The lead pin includes a coupling pin inserted into a hole formed in an external device, a head portion disposed at one end of the coupling pin, and a step portion formed in a stepped manner between the coupling pin and the head portion, the step portion having a smaller size than the head portion.

摘要翻译： 公开了一种用于半导体封装的引脚。 引导销包括插入到形成在外部装置中的孔中的联接销，设置在联接销的一端的头部和在连接销和头部之间以阶梯形式形成的台阶部分，台阶部分 具有比头部小的尺寸。

公开(公告)号：US20110115121A1

公开(公告)日：2011-05-19

申请号：US12926864

申请日：2010-12-14

申请人： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

发明人： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

IPC分类号： B29C45/00 ,  B82Y30/00

CPC分类号： H05K1/056 ,  B82Y10/00 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20481 ,  H05K2201/026 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

公开(公告)号：US20110079926A1

公开(公告)日：2011-04-07

申请号：US12923621

申请日：2010-09-29

申请人： Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

发明人： Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00014 ,  H01L2224/13099

摘要： There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

摘要翻译： 提供了制造用于倒装芯片的基板的方法和使用其制造的用于倒装芯片的基板。 该方法包括提供包括至少一个导电焊盘的基底衬底，在基底衬底上形成阻焊层，阻焊层包括暴露导电焊盘的第一开口，在阻焊层上形成干膜，干膜 包括与所述第一开口连接的第二开口，在所述第一开口中形成金属柱和所述第二开口的一部分，用焊膏填充所述金属柱上方的所述第二开口，通过对所述第一开口进行回流处理来形成焊料盖 焊膏，使焊盘的表面平坦化，并除去干膜。 因此，可以实现精细的间距和提高可靠性。

公开(公告)号：US20110068473A1

公开(公告)日：2011-03-24

申请号：US12805559

申请日：2010-08-05

申请人： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

发明人： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC分类号： H01L23/498 ,  H01B5/00

CPC分类号： H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

公开(公告)号：US20110012261A1

公开(公告)日：2011-01-20

申请号：US12923453

申请日：2010-09-22

申请人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

发明人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

摘要翻译： 在用于电连接到外部装置的基板的电极焊盘上形成的凸块，所述柱凸起包括形成在所述电极焊盘上的金属柱; 以及形成在所述金属柱上并形成为圆顶的焊料，所述圆顶占据由沿所述金属柱的轴向方向从所述金属柱的周边延伸的假想线限定的空间。

公开(公告)号：US20100299638A1

公开(公告)日：2010-11-25

申请号：US12557322

申请日：2009-09-10

申请人： Jin-Won CHOI

发明人： Jin-Won CHOI

IPC分类号： G06F3/033 ,  G06F3/048

CPC分类号： G06F3/04886 ,  G06F3/0488 ,  G06F3/04883

摘要： A function execution method and apparatus thereof for displaying one or more sub-functions included in a function selected by a first touch on a trace according to a second touch input based upon the first and the second touches inputted with a timing difference, and executing the relevant sub-function selected among the displayed one or more sub-functions. For this purpose, a function execution method according to the present invention is performed by comprising: detecting a first touch input touched on a display unit; detecting a drag created by a second touch inputted while maintaining the first touch; and displaying one or more sub-functions included in a function selected by the first touch along a trace of the detected drag on the display unit.

摘要翻译： 一种功能执行方法及其装置，用于根据基于以定时差输入的第一触摸和第二触摸，根据第二触摸输入，在轨迹上由第一次触摸选择的功能中包含的一个或多个子功能，以及执行 在显示的一个或多个子功能中选择相关子功能。 为此，根据本发明的功能执行方法包括：检测在显示单元上触摸的第一触摸输入; 检测在保持第一次触摸的同时输入的第二触摸产生的拖动; 以及在所述显示单元上沿着所述检测到的拖动的迹线，显示包括在由所述第一触摸选择的功能中的一个或多个子功能。