公开(公告)号：US08671564B2

公开(公告)日：2014-03-18

申请号：US12554762

申请日：2009-09-04

Applicant: Hueng Jae Oh ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

Inventor： Hueng Jae Oh ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

IPC: H01K3/10

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract translation: 公开了一种用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US08486760B2

公开(公告)日：2013-07-16

申请号：US12923621

申请日：2010-09-29

Applicant: Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

Inventor： Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

IPC: H01L23/522

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

Abstract translation: 提供了制造用于倒装芯片的基板的方法和使用其制造的用于倒装芯片的基板。 该方法包括提供包括至少一个导电焊盘的基底衬底，在基底衬底上形成阻焊层，阻焊层包括暴露导电焊盘的第一开口，在阻焊层上形成干膜，干膜 包括与所述第一开口连接的第二开口，在所述第一开口中形成金属柱和所述第二开口的一部分，用焊膏填充所述金属柱上方的所述第二开口，通过对填充的所述第二开口进行回流处理来形成焊料盖 焊膏，使焊盘的表面平坦化，并除去干膜。 因此，可以实现精细的间距和提高可靠性。

公开(公告)号：US08456003B2

公开(公告)日：2013-06-04

申请号：US12926314

申请日：2010-11-09

Applicant: Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

Inventor： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

IPC: H01L2225/06513 ,  H01L2224/9201 ,  H01L2225/06517

CPC classification number: H01L21/4853 ,  H01L21/441 ,  H01L23/485 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13082

Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.

Abstract translation: 提供一种能够通过改善后端子的组成和形成来控制其翘曲程度的封装基板及其制造方法。 封装衬底包括具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 隔离层，设置在所述开口内的所述导电垫上，并形成为比所述绝缘层的所述侧壁的上表面高; 设置在分离阻挡层上的柱状端子; 以及设置在柱端子上的焊料凸块。

公开(公告)号：US20100314161A1

公开(公告)日：2010-12-16

申请号：US12554762

申请日：2009-09-04

Applicant: Hueng Jae OH ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

Inventor： Hueng Jae OH ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract translation: 公开了一种用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US20100116534A1

公开(公告)日：2010-05-13

申请号：US12379759

申请日：2009-02-27

Applicant: Jin Won Choi ,  Seung Wan Kim

Inventor： Jin Won Choi ,  Seung Wan Kim

IPC: H05K1/16 ,  H05K3/34

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0505 ,  H05K2203/0568 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.

Abstract translation: 本发明公开了一种具有流阻防止堤坝的印刷电路板及其制造方法。印刷电路板包括：具有焊盘的基底基板，形成在基底基板的焊盘上的焊料凸块， 使用干膜抗蚀剂的基底基板的周边区域。 防流动水坝可以防止底部填充溶液的流出，并且可以简单地形成。

公开(公告)号：US06258186B1

公开(公告)日：2001-07-10

申请号：US09473641

申请日：1999-12-28

Applicant: Jin Won Choi

Inventor： Jin Won Choi

IPC: B05D300

CPC classification number: C23C2/02

Abstract: A method for manufacturing a hot rolled galvanized steel sheet at a high speed, with the pickling skipped, is disclosed, in which an intermediate rapid cooling is carried out at a predetermined temperature so as to make the wüstite component of the scales become 20% or more after a hot rolling, then a reducing heat-treatment is carried out, and then the steel sheet is dipped into a zinc bath containing a predetermined amount of Al, thereby realizing a superior coating adherence and a superior productivity. The hot rolled steel sheet is cooled at a usual cooling rate, and is coiled. Then an intermediate rapid cooling is carried out on the hot rolled steel sheet (thus coiled) to an intermediate rapid cooling temperature of 300-500° C. so as to make a wüstite component of scales become 20% or more. Then a reducing heat treatment is carried out at a temperature of 550-700° C. for 30-300 seconds under a 20% (or more) hydrogen atmosphere. Then the hot rolled steel sheet (thus reduced) is dipped into a zinc bath having an Al concentration of 0.2-5.0 wt %, whereby a superior coating adherence and a superior productivity are realized.

Abstract translation: 公开了一种在预定温度下进行中间快速冷却以使鳞片的钨酸盐成分变为20％的方式，高速地制造热轧镀锌钢板的方法，其中酸洗被跳过， 进行热轧后，进行还原热处理，然后将钢板浸渍到含有规定量的Al的锌浴中，从而实现优异的涂布粘附性和优异的生产率。 将该热轧钢板以通常的冷却速度进行冷却，并进行卷绕。 然后在热轧钢板（这样卷取）上进行中间快速冷却至300-500℃的中间快速冷却温度，以使鳞片的重质成分达到20％以上。 然后在20℃（或更多）氢气氛下，在550-700℃的温度下进行30-300秒的还原热处理。 然后将热轧钢板（因此减少）浸入Al浓度为0.2-5.0重量％的锌浴中，从而实现优异的涂层粘附性和优异的生产率。

公开(公告)号：US20150205369A1

公开(公告)日：2015-07-23

申请号：US14386899

申请日：2012-12-21

Applicant: Jin Won CHOI

Inventor： Jin Won Choi

IPC: G06F3/02 ,  G06F3/023

CPC classification number: G06F3/0219 ,  G06F3/0202 ,  G06F3/0233 ,  G06F3/0238

Abstract: The present invention relates to a keyboard for inputting multiple languages using a detachable keypad, and more particularly, to a rotary-type keyboard for inputting multiple languages that includes a baseboard, rows of a plurality of key caps placed on the baseboard, and a plurality of moving mechanism members connecting the key caps to the baseboard and enabling the key caps to move upward and downward with respect to the baseboard. The key caps are divided into an opaque portion and a transparent portion, and have a plurality of rotatable members which are provided between the baseboard and the transparent portion in the direction in which the rows of key caps extend, and which have characters printed on the outer surfaces thereof. The plurality of rotatable members provide the user with different characters through the transparent portion depending on the angle of rotation.

Abstract translation: 本发明涉及一种用于使用可拆卸键盘输入多种语言的键盘，更具体地，涉及一种用于输入多种语言的旋转式键盘，所述多种语言包括基板，放置在基板上的多个键帽的行，以及多个 移动机构构件将键帽连接到基板，并使键帽相对于基板上下移动。 键帽分为不透明部分和透明部分，并且具有多个可转动部件，它们设置在基板和透明部分之间，其中键帽延伸的方向上具有打印在 外表面。 多个可旋转构件根据旋转角度通过透明部分为使用者提供不同的字符。

公开(公告)号：US08822841B2

公开(公告)日：2014-09-02

申请号：US13411168

申请日：2012-03-02

Applicant: Dong Gyu Lee ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

Inventor： Dong Gyu Lee ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

IPC: H05K1/11 ,  H01K3/10

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/05552

Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract translation: 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。

公开(公告)号：US08336201B2

公开(公告)日：2012-12-25

申请号：US13137778

申请日：2011-09-12

Applicant: Jin Won Choi ,  Seung Wan Kim

Inventor： Jin Won Choi ,  Seung Wan Kim

IPC: H05K3/34

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0505 ,  H05K2203/0568 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist.

Abstract translation: 一种制造具有流动防止堤坝的印刷电路板的方法，包括：在具有焊盘的基底上涂覆干膜抗蚀剂，然后将干膜抗蚀剂主要暴露于光; 二次将形成在基底基板的周边区域上的主要暴露的干膜抗蚀剂曝光，从而形成防流水坝; 去除未曝光的干膜抗蚀剂以露出焊盘，从而形成开口; 用焊膏印刷开口，然后通过回流工艺形成焊料凸块; 并除去主要暴露的干膜抗蚀剂。

公开(公告)号：US20110264417A1

公开(公告)日：2011-10-27

申请号：US13142198

申请日：2009-12-04

Applicant: Jin Won Choi ,  Lertlakkhanakul Jumphon ,  Doo Young Kwon

Inventor： Jin Won Choi ,  Lertlakkhanakul Jumphon ,  Doo Young Kwon

IPC: G06F17/50

CPC classification number: G06T17/00

Abstract: Disclosed is a spatial modelling system. The spatial modelling system comprises: a modelling module for generating modelling information about a space in accordance with input from a user; a space syntax module for perceiving the space on the basis of the modelling information generated by the modelling module, and generating information about the space syntax of at least one portion of the space; and a control module for displaying the results of an analysis of the space syntax of the at least one portion of the space, on the basis of information about the space syntax obtained by analysis by means of the space syntax module.

Abstract translation: 公开了一种空间建模系统。 所述空间建模系统包括：建模模块，用于根据用户的输入生成关于空间的建模信息; 空间语法模块，用于基于由所述建模模块生成的建模信息来感知所述空间，以及生成关于所述空间的至少一部分的所述空间语法的信息; 以及控制模块，用于基于通过空间语法模块的分析获得的关于空间语法的信息来显示空间的至少一部分的空间语法的分析结果。