公开(公告)号：US20110240349A1

公开(公告)日：2011-10-06

申请号：US13162802

申请日：2011-06-17

Applicant: Lakshmi Supriya ,  Gloria Alejandra Camacho-Bragado

Inventor： Lakshmi Supriya ,  Gloria Alejandra Camacho-Bragado

IPC: H05K1/09 ,  B82Y99/00

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/53276 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/11003 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014

Abstract: A multiple die structure includes a first die (110), a second die (120), a carbon nanotube (130) having a first end (131) in physical contact with the first die and having a second end (132) in physical contact with the second die, and an electrically conductive material (240) in physical contact with the first end of the carbon nanotube and in physical contact with the first die. Forming a connection between the first die and the second die can include providing a connection structure (400, 500, 600, 900) in which the electrically conductive material is adjacent to the carbon nanotube, placing the connection structure adjacent to the first die and to the second die, and bonding the first die and the second die to the connection structure.

Abstract translation: 多管芯结构包括第一管芯（110），第二管芯（120），碳纳米管（130），其具有与第一管芯物理接触的第一末端（131）并具有物理接触的第二末端（132） 与第二管芯相连，以及与碳纳米管的第一端物理接触并与第一管芯物理接触的导电材料（240）。 形成第一管芯和第二管芯之间的连接可以包括提供连接结构（400,500,600,900），其中导电材料邻近于碳纳米管，将连接结构放置在第一管芯附近，并且 第二管芯，并将第一管芯和第二管芯结合到连接结构。

公开(公告)号：US07843075B2

公开(公告)日：2010-11-30

申请号：US12151063

申请日：2008-05-01

Applicant: Lakshmi Supriya ,  Anna M. Prakash ,  Tommy L. Ashton

Inventor： Lakshmi Supriya ,  Anna M. Prakash ,  Tommy L. Ashton

IPC: H01L29/40 ,  H01L21/44

CPC classification number: H05K3/3489 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/731 ,  H01L2224/73104 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83194 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2203/0113 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599

Abstract: Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.

Abstract translation: 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。

公开(公告)号：US20090166396A1

公开(公告)日：2009-07-02

申请号：US11966943

申请日：2007-12-28

Applicant: Lakshmi SUPRIYA ,  Ravi NALLA

Inventor： Lakshmi SUPRIYA ,  Ravi NALLA

IPC: B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/1316 ,  H01L2224/13186 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3478 ,  H05K2201/0224 ,  H05K2201/083 ,  H05K2201/09036 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0776 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/05381 ,  H01L2924/01027 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed.

Abstract translation: 描述了用于制造电子设备的电子设备和方法。 一种方法包括在其上提供具有多个接合焊盘的基板，并且提供多个焊料微球，所述微球包括其上的涂层。 该方法还包括将焊料微球流到衬底上并将焊料微球定位在焊盘上。 该方法还包括加热焊料微球以回流并形成焊料微球和焊盘之间的接头。 描述和要求保护其他实施例。

公开(公告)号：US20080070349A1

公开(公告)日：2008-03-20

申请号：US11533653

申请日：2006-09-20

Applicant: James C. Matayabas ,  Lakshmi Supriya

Inventor： James C. Matayabas ,  Lakshmi Supriya

IPC: H01L21/00 ,  H01L23/04

CPC classification number: H01L21/76897 ,  H01L21/486 ,  H01L21/76802 ,  H05K3/0017 ,  H05K2203/1173

Abstract: Methods and systems for forming holes in a substrate using dewetting coating are described herein.

Abstract translation: 本文描述了使用去湿涂层在基底中形成孔的方法和系统。

公开(公告)号：US09101931B2

公开(公告)日：2015-08-11

申请号：US11966560

申请日：2007-12-28

Applicant: Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

Inventor： Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

IPC: B01J19/00 ,  B01L3/00 ,  B29C65/00

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Abstract translation: 微电子封装包括可以包括用于分析流体的MEMS和CMOS电路的管芯。 提供了将流体引导到管芯的限定的路径。 定义的路径不是在封装衬底中图案化凹陷或物理通道，而是包括可以将液体流引导到用于生物传感器类型应用的管芯的涂层。 所定义的路径可以包括对流体具有亲和性的润湿涂层。 类似地，所定义的路径可以包括去潮涂层，其倾向于排斥路径周围的流体。

公开(公告)号：US07727886B2

公开(公告)日：2010-06-01

申请号：US11824212

申请日：2007-06-29

Applicant: Lakshmi Supriya ,  Omar J. Bchir

Inventor： Lakshmi Supriya ,  Omar J. Bchir

IPC: H01L21/4763

CPC classification number: H05K3/0017 ,  H01L21/486 ,  H01L21/76802 ,  H05K3/4644 ,  H05K2203/083 ,  H05K2203/1105 ,  H05K2203/308

Abstract: In one embodiment, the present invention includes a method for forming a sacrificial material layer, patterning it to obtain a first patterned sacrificial material layer, embedding the first patterned sacrificial material layer into a dielectric material, treating the first patterned sacrificial material layer to remove it to thus provide a patterned dielectric layer having a plurality of openings in which vias may be formed. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，本发明包括一种形成牺牲材料层的方法，将其图形化以获得第一图案化牺牲材料层，将第一图案化牺牲材料层嵌入电介质材料中，处理第一图案化牺牲材料层以去除它 从而提供具有多个开口的图案化电介质层，其中可以形成通孔。 描述和要求保护其他实施例。

公开(公告)号：US20100072617A1

公开(公告)日：2010-03-25

申请号：US12284531

申请日：2008-09-22

Applicant: Lakshmi Supriya ,  Gloria Alejandra Camacho-Bragado

Inventor： Lakshmi Supriya ,  Gloria Alejandra Camacho-Bragado

IPC: H01L21/60 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/53276 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/11003 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014

Abstract: A multiple die structure includes a first die (110), a second die (120), a carbon nanotube (130) having a first end (131) in physical contact with the first die and having a second end (132) in physical contact with the second die, and an electrically conductive material (240) in physical contact with the first end of the carbon nanotube and in physical contact with the first die. Forming a connection between the first die and the second die can include providing a connection structure (400, 500, 600, 900) in which the electrically conductive material is adjacent to the carbon nanotube, placing the connection structure adjacent to the first die and to the second die, and bonding the first die and the second die to the connection structure.

Abstract translation: 多管芯结构包括第一管芯（110），第二管芯（120），碳纳米管（130），其具有与第一管芯物理接触的第一末端（131）并具有物理接触的第二末端（132） 与第二管芯相连，以及与碳纳米管的第一端物理接触并与第一管芯物理接触的导电材料（240）。 形成第一管芯和第二管芯之间的连接可以包括提供连接结构（400,500,600,900），其中导电材料邻近于碳纳米管，将连接结构放置在第一管芯附近，并且 第二管芯，并将第一管芯和第二管芯结合到连接结构。

公开(公告)号：US20090317641A1

公开(公告)日：2009-12-24

申请号：US12145364

申请日：2008-06-24

Applicant: Lakshmi Supriya ,  Jessica Weninger ,  Leonel Arana ,  Lateef Mustapha

Inventor： Lakshmi Supriya ,  Jessica Weninger ,  Leonel Arana ,  Lateef Mustapha

IPC: B32B9/04 ,  B29C65/02

CPC classification number: F28F7/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/30 ,  H01L24/33 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01033 ,  H01L2924/01056 ,  Y10T156/10 ,  Y10T428/31663

Abstract: Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).

Abstract translation: 公开了处理热界面材料以实现热界面材料的容易拾取和放置而不降低完成的半导体封装的热性能的方法。 一种方法包括在热界面材料的一个或多个表面上施加非粘合剂层，将热界面材料与一种或多种组分接合，使其间的非粘合剂层相互接触，并施加热量以将非粘合剂层改变为 增加热界面材料和界面部件之间的热接触。

公开(公告)号：US20090087644A1

公开(公告)日：2009-04-02

申请号：US11863122

申请日：2007-09-27

Applicant: Lakshmi Supriya ,  Linda A. Shekhawat

Inventor： Lakshmi Supriya ,  Linda A. Shekhawat

IPC: B32B5/16 ,  B05D1/36

CPC classification number: H01L23/373 ,  B05D1/002 ,  B05D2202/45 ,  B05D2451/00 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/2991 ,  Y10T428/2998 ,  B05D2401/32 ,  H01L2924/00

Abstract: Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of functionalized nanoparticles on a substrate by immersing the substrate in at least one of a solvent and a polymer matrix, wherein at least one of the solvent and the polymer matrix comprises a plurality of functionalized nanoparticles; and forming a second layer of functionalized nanoparticles on the first layer of functionalized particles, wherein there is a gradient in a property between the first layer and the second layer.

Abstract translation: 描述形成微电子器件的方法和相关结构。 这些方法可以包括通过将基底浸入溶剂和聚合物基质中的至少一种而在基底上形成第一层官能化纳米颗粒，其中至少一种溶剂和聚合物基质包含多个官能化纳米颗粒; 以及在所述第一功能化颗粒层上形成第二层官能化纳米颗粒，其中在所述第一层和所述第二层之间具有特性梯度。

公开(公告)号：US09156973B2

公开(公告)日：2015-10-13

申请号：US13631089

申请日：2012-09-28

Applicant: Lakshmi Supriya ,  Christopher M. Comeaux ,  Mathilde Leboeuf

Inventor： Lakshmi Supriya ,  Christopher M. Comeaux ,  Mathilde Leboeuf

IPC: C08L27/18 ,  C08K3/00 ,  C08L67/03

CPC classification number: C08L27/18 ,  C08L67/03 ,  C08L67/04 ,  C08L27/12

Abstract: A polymer article includes a meltprocessable blend of a melt-viscid fluoropolymer and a liquid crystalline polymer. Methods are presented for preparing a meltprocessable blend from a melt-viscid fluoropolymer and liquid crystalline polymer.

Abstract translation: 聚合物制品包括熔融粘稠的含氟聚合物和液晶聚合物的可熔融加工的共混物。 提出了用于从熔融粘稠的氟聚合物和液晶聚合物制备可熔融加工的共混物的方法。