摘要:
A developing process of the photo-resist coated on the wafer is performed, cleaning the developing solution by a cleaning solution then transferring the wafer to the electron beam radiation unit before the rinsing solution and the resist dries out. The radiation chamber is replaced with a helium gas to form a predetermined degree of vacuum or atmospheric pressure. An electron beam is radiated and the front face of the wafer is heated for a predetermined period of time. In this method, deformation and breaking of a pattern caused by drying after the development can be prevented.
摘要:
A semiconductor device according to the present invention includes a semiconductor substrate; device isolation regions provided in the semiconductor substrate; a first conductivity type semiconductor layer provided between the device isolation regions; a gate insulating layer provided on an active region of the first conductivity type semiconductor layer; a gate electrode provided on the gate insulating layer; gate electrode side wall insulating layers provided on side walls of the gate electrode; and second conductivity type semiconductor layers provided adjacent to the gate electrode side wall insulating layers so as to cover a portion of the corresponding device isolation region, the second conductivity type semiconductor layers acting as a source region and/or a drain region. The gate electrode and the first conductivity type semiconductor layer are electrically connected to each other. The second conductivity type semiconductor layers are provided above the first conductivity type semiconductor layer and have a thickness which gradually increases from the device isolation region toward the gate electrode.
摘要:
A gate oxide film (23), a gate electrode (24) and a gate cap insulating film (25) are stacked on an active region of a p-type semiconductor substrate (21), and an insulating side wall (29) is formed, followed by BF2 ion implantation. Thus, a surface of the p-type semiconductor substrate becomes amorphous so that single-crystal silicon is prevented from epitaxially growing in the next process of depositing polysilicon (33). Halo regions (32) are formed using the BF2 ions having the opposite conductivity to a source/drain to reduce the short-channel effect. The substrate is then passed through a nitrogen purge chamber having a dew point kept at −100° C. to remove water molecules completely, and polysilicon (33) is deposited. Because native oxide is prevented from growing at an interface between the active region and the polysilicon, source/drain regions (34) formed later by implantation and diffusion of n-type impurity ions achieve a uniform junction depth.
摘要:
By removing halogen atoms existing on the surface of the silicon layer and in the subsurface thereof so that the concentration of halogen atoms becomes 100 ppm or lower and forming an electrode on the resulting silicon layer, the electrode which has a low resistance can be produced, and a highly reliable semiconductor device can be produces as well.
摘要:
A semiconductor device having a gate electrode on a Si-substrate through a gate oxide film; a first impurity diffusion region having a conductivity type reversed to a well which will form a part of source and drain regions in the two opposing sides of the gate electrode through gate electrode sidewall dielectric films; a second impurity diffusion region having the same conductivity type as the first impurity diffusion region beneath the gate electrode sidewall dielectric film, touching a channel region directly below the gate electrode and being shallower than the first impurity diffusion region; a titanium silicide film on the gate electrode and the surface of the Si-substrate of the first impurity diffusion region in the two opposing sides of the gate electrode sidewall dielectric film; and a third impurity diffusion region, formed in the first impurity diffusion region, having a higher concentration than the first impurity diffusion region and the same conductivity type as the first and second impurity diffusion region. The above semiconductor device is able to suppress the short-channel effects, and reduce the source-drain parasitic resistance and the source-drain junction leakage current while maintaining a small source-drain capacity.
摘要:
In a laser diode driving method, a bias current set about the light emission threshold current of a laser diode, and a pulse current for causing the laser diode to emit light are adjusted in accordance with the ambient temperature. The laser diode is driven by a current prepared by superposing the bias current and the pulse current, thereby controlling the optical output and extinction ratio of the laser diode at a constant level. A laser diode driving circuit is also disclosed.
摘要:
The reflector-provided dipole-antenna shows outstanding performance in a wide frequency range and allows simultaneous transmission and reception at different frequencies. A dipole antenna element is provided at the back of a dielectric substrate set to the reflector surface. A parasitic element is provided on the front of the dielectric substrate, which is constituted by forming and protruding the central portion of a linear conductor forward in an almost trapezoidal shape, for example. The protruded portion is set to a position corresponding to the front of the feed point of the dipole antenna element and the portions of the said parasitic element towards the ends are set to positions corresponding to the rear of the dipole antenna element. A feed circuit provided on the face side of dielectric substrate is connected to a coaxial connector provided at the back of the reflector.
摘要:
In accordance with the development of the fineness of MOSFETs, a gate insulating film and a capacitor insulating film are required to have a smaller thickness and a higher film quality. Accordingly, the present invention is intended to provide a method for forming a high-quality insulating film while preventing hydrogen atoms which cause a leak current and an electron trap from entering the insulating film. The present method uses a gas of molecules containing at least nitrogen, the gas is a compound which includes no oxygen atom and has no bond of a nitrogen atom and a hydrogen atom (N--H) and generates monoatomic nitrogen when the gas dissociates.
摘要:
In a head (21) of an inkjet printer, a plurality of outlet rows are arranged in a scanning direction, the plurality of outlet rows each having a plurality of outlets arranged in a direction intersecting the scanning direction. The plurality of outlets are each capable of forming dots of a plurality of sizes on printing paper upon receiving different driving signals from an ejection control part (44). In the inkjet printer, under control of the ejection control part (44), some of the outlet rows form dots of only one size out of the plurality of sizes, and the other outlet rows form dots of only another size. In this way, causing the plurality of outlets in each outlet row to form dots of only one size makes it possible to reduce the occurrence of satellite droplets or the like and improve print quality.
摘要:
A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layer 14 free from lead and formed on a substrate 11 or an electronic device bonding substrate 10 having such a solder layer, the solder layer 14 has a specific resistance of not more than 0.4 Ω·μm. The electronic device bonding substrate 10 can have a thermal resistance of not more than 0.5 K/W and a thickness of not more than 10 μm. Then, voids contained in the solder layer 14 have a maximum diameter of not more than 0.5 μm and the substrate can be a submount substrate.