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公开(公告)号：US06948940B2
公开(公告)日：2005-09-27
申请号：US10411175
申请日：2003-04-10
IPC分类号： G01R1/067 , G01R31/28 , H01L21/48 , H01L23/498 , H01R4/48 , H01R13/03 , H01R13/24 , H01R13/33 , H01R43/16 , H05K3/32 , H05K3/40 , H01R12/00
CPC分类号： G01R1/06733 , G01R1/06711 , G01R1/06744 , G01R31/2884 , H01L21/4853 , H01L23/49811 , H01L2224/16 , H01L2924/00014 , H01R4/4863 , H01R12/57 , H01R13/035 , H01R13/2421 , H01R13/33 , H01R43/16 , H05K3/326 , H05K3/4007 , H05K3/4092 , H05K2201/0133 , H05K2201/0367 , H05K2201/10265 , H05K2203/308 , H01L2224/0401
摘要： A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.
摘要翻译： 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 在替代实施例中，去除垫以留下独立的螺旋接触。
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公开(公告)号：US06780001B2
公开(公告)日：2004-08-24
申请号：US09795772
申请日：2001-02-27
IPC分类号： B29C4302
CPC分类号： G01R3/00 , B33Y80/00 , B81B2203/0118 , B81C1/00611 , B81C2201/0108 , B81C2201/0125 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L23/4822 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01057 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
摘要翻译： 公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。 每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。 每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。 还公开了用于制造成形工具的许多方法。 这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。
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公开(公告)号：US07458816B1
公开(公告)日：2008-12-02
申请号：US09547561
申请日：2000-04-12
IPC分类号： H01R12/00
CPC分类号： G01R1/07342 , G01R1/07357 , H05K3/4092
摘要： An interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is modified. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume).
摘要翻译： 一种互连元件，其包括适于联接到基板的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时，互连的形状被修改。 一个实例是具有可变形特性的材料，使得第一和/或第二元素材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转化。
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公开(公告)号：US07245137B2
公开(公告)日：2007-07-17
申请号：US11119715
申请日：2005-05-02
IPC分类号： G01R31/02
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A test head assembly can include a probe card, which can include first contact areas. The test head assembly can also include a contactor, which can include second contact areas. An interposer can include first spring contact structures and second spring contact structures. The first spring contact structures can contact one of the first contact areas, and the second spring contact structures can contact one of the second contact areas. Ones of the first spring contact structures can be electrically connected through the interposer to ones of the second spring contact structures. One of the first spring contact structures can include a pair of contacts, both of which can extend from a first surface of the interposer to contact one of the first contact areas. Alternatively or additionally, one of the second spring contact structures can include a pair of contacts, both of which can extend form a second surface of the interposer to contact one of the second contact areas.
摘要翻译： 测试头组件可以包括探针卡，其可以包括第一接触区域。 测试头组件还可以包括接触器，其可以包括第二接触区域。 插入件可以包括第一弹簧接触结构和第二弹簧接触结构。 第一弹簧接触结构可以接触第一接触区域中的一个，并且第二弹簧接触结构可以接触第二接触区域中的一个。 第一弹簧接触结构的一部分可以通过插入件电连接到第二弹簧接触结构中的一个。 第一弹簧接触结构中的一个可以包括一对触头，它们都可以从插入器的第一表面延伸以接触第一接触区域之一。 或者或另外，第二弹簧接触结构中的一个可以包括一对触头，它们都可以延伸形成插入件的第二表面以接触第二接触区域中的一个。
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15.发明授权公开(公告)号：US07189077B1
公开(公告)日：2007-03-13
申请号：US09710539
申请日：2000-11-09
IPC分类号： H01R12/10
CPC分类号： H05K7/1069 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H05K3/4092 , Y10T29/49151 , Y10T29/4922
摘要： Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.
摘要翻译： 公开了改进的光刻型微电子弹簧结构和方法，用于提供改善的基板上的尖端高度，改进的弹性范围，增加的强度和可靠性以及增加的弹簧刚度。 改进的结构适于由沉积在模制的牺牲衬底上的单个集成层（或一系列层）形成，从而避免多个阶梯式光刻层并降低制造成本。 特别地，为了实现上述改进，公开了在z方向上成形的平版印刷结构。 例如，公开了具有沿着弹簧的长度延伸的U形横截面，V形横截面和/或一个或多个肋的结构。 本发明另外提供了一种平版印刷型弹性接触件，其被波纹化以增加其有效长度和弹性范围并减小其在基底上的覆盖面，以及在俯视图中成形的弹簧。 本发明还提供了用于光刻型微电子弹簧结构的组合（串联和并联）电接触尖端。 根据本发明的微电子弹簧结构特别适用于制造用于集成电路和其它基板安装的电子设备的电连接器的非常精细的间距阵列，因为它们的性能特性被增强，同时它们可以是 与其他光刻型微电子弹簧结构相比大大降低了成本。
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公开(公告)号：US07127811B2
公开(公告)日：2006-10-31
申请号：US10651821
申请日：2003-08-29
IPC分类号： H05K3/02
CPC分类号： H01L24/13 , G01R1/06761 , G01R1/07342 , G01R1/07378 , G01R3/00 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H05K3/326 , H05K3/4092 , H05K2201/0308 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.
摘要翻译： 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。
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公开(公告)号：US5212988A
公开(公告)日：1993-05-25
申请号：US775631
申请日：1991-10-10
CPC分类号： G01N29/2437 , B01L3/5027 , G01H13/00 , G01H17/00 , G01L9/0025 , G01N29/022 , G01P15/08 , G10K11/36 , H03H9/42 , B01L2300/0663 , B01L2300/1827 , B01L2400/0421 , G01N2291/014 , G01N2291/0255 , G01N2291/0256 , G01N2291/02818 , G01N2291/02827 , G01N2291/02854 , G01N2291/0427
摘要： An ultrasonic structure which has a thin planar sheet of material forming a Lamb wave propagation medium The propagation medium is coated with a gel. The structure may also include a Lamb wave generator for generating Lamb waves in the propagation medium and an output device for producing an electrical signal representative of the propagation characteristics of the Lamb waves propagating along the propagation medium. A measuring device can be included to measure selected characteristics of the output electrical signal. The propagation medium has some physical characteristics that are determined by the value of a measurand acting on the medium and the determined physical characteristics determine the propagation characteristics of the Lamb waves which are propagated along the medium. When the sensor is acted on by a measurand to determine the physical characteristics of the propagation medium, the characteristics of the electrical signal are also determined. The measuring device measures the electrical signal and provides an indication of the measurand value.
摘要翻译： 具有形成兰姆波传播介质的薄平板材料的超声波结构传播介质用凝胶涂覆。 该结构还可以包括用于在传播介质中产生兰姆波的兰姆波发生器和用于产生表示沿着传播介质传播的兰姆波传播特性的电信号的输出装置。 可以包括测量装置来测量输出电信号的选定特性。 传播介质具有由作用在介质上的被测量的值确定的一些物理特性，并且所确定的物理特性确定沿着介质传播的兰姆波的传播特性。 当传感器被被测量作用以确定传播介质的物理特性时，也确定电信号的特性。 测量设备测量电信号并提供被测量值的指示。
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