公开(公告)号：US07005751B2

公开(公告)日：2006-02-28

申请号：US10410948

申请日：2003-04-10

申请人： Igor Y. Khandros ,  Charles A. Miller ,  Stuart W. Wenzel

发明人： Igor Y. Khandros ,  Charles A. Miller ,  Stuart W. Wenzel

IPC分类号： H01L23/48

CPC分类号： H05K3/4007 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81901 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01R12/57 ,  H01R43/007 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. A horizontal microelectronic spring contact and method of making the same are also disclosed. The horizontal spring contact has a rigid trace attached at a first end to a terminal of a substrate. The trace is free from attachment at its second end, and extends from the terminal in a direction substantially parallel to a surface of the substrate to the second end. At least a distal portion of the trace extending to the second end is spaced apart from the surface of the substrate. The spaced-apart distal portion is flexible in a plane parallel to the substrate.

摘要翻译： 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子通过柔性焊盘延伸到其端部区域。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 还公开了一种水平微电子弹簧触头及其制造方法。 水平弹簧触点具有在第一端附接到基板的端子的刚性迹线。 该迹线在其第二端处没有附着，并且从基板平行于基板的表面的方向从端子延伸到第二端。 至少延伸到第二端的迹线的远端部分与衬底的表面间隔开。 间隔开的远侧部分在平行于基底的平面中是柔性的。

公开(公告)号：US06720710B1

公开(公告)日：2004-04-13

申请号：US08779545

申请日：1997-01-06

申请人： Stuart W. Wenzel ,  Benedict J. Costello

发明人： Stuart W. Wenzel ,  Benedict J. Costello

IPC分类号： H01L4108

CPC分类号： G01N30/6095 ,  B01J2219/00891 ,  B01J2219/00916 ,  B01J2219/00932 ,  B01J2219/00952 ,  B01L3/50273 ,  B01L5/02 ,  B01L2200/10 ,  B01L2300/0816 ,  B01L2300/087 ,  B01L2300/088 ,  B01L2300/0883 ,  B01L2400/0439 ,  B01L2400/0496 ,  B82Y30/00 ,  F04B17/00 ,  F04B43/043 ,  F04B43/046 ,  G01N30/32 ,  G01N30/44 ,  G01N2030/122 ,  G01N2030/123 ,  G01N2030/326 ,  G01N2030/623 ,  G01N2030/77 ,  B01D2015/389 ,  G01N2030/285

摘要： A microsized pump is set forth. It comprises a substrate which at least partially defines one or more walls of a longitudinally extending tunnel. The tunnel has a vibratable wall portion. A sonic energy generator is positioned in sonic energy transmitting relation to the vibratable wall portion. The sonic energy generator is adapted to generate elastic waves which travel along the longitudinal extension of the tunnel. The pump is useful for moving material along the tunnel whereby chemical and biological analysis and reactions can be carried out on a micro scale.

摘要翻译： 阐述了微型泵。 其包括至少部分地限定纵向延伸的隧道的一个或多个壁的基底。 隧道具有可振动的壁部分。 声能量发生器位于与可振动壁部分的声能传递关系中。 声能量发生器适于产生沿着隧道的纵向延伸行进的弹性波。 泵可用于沿着隧道移动材料，从而可以在微观尺度上进行化学和生物学分析和反应。

公开(公告)号：US5189914A

公开(公告)日：1993-03-02

申请号：US792457

申请日：1991-11-15

申请人： Richard M. White ,  Stuart W. Wenzel

发明人： Richard M. White ,  Stuart W. Wenzel

IPC分类号： B01L3/00 ,  G01H13/00 ,  G01H17/00 ,  G01L9/00 ,  G01N29/02 ,  G01P15/08 ,  G10K11/36

CPC分类号： G10K11/36 ,  G01H13/00 ,  G01H17/00 ,  G01L9/0025 ,  G01N29/022 ,  G01P15/08 ,  B01L3/5027 ,  G01N2291/014 ,  G01N2291/0256 ,  G01N2291/02818 ,  G01N2291/02827 ,  G01N2291/02854 ,  G01N2291/0422 ,  G01N2291/0423 ,  G01N2291/0427

摘要： An ultrasonic sensor which has a thin planar sheet of material forming a Lamb wave propagation medium, the sheet having a thickness which is no greater than about twenty microns. The sensor also includes a Lamb wave generator for generating Lamb waves in the propagation medium and an output device for producing an electrical signal representative of the propagation characteristics of the Lamb waves propagating along the propagation medium. A measuring device is included in the sensor to measure selected characteristics of the output electrical signal. The propagation medium has some physical characteristics that are determined by the value of a measurand acting on the medium and the determined physical characteristics determine the propagation characteristics of the Lamb waves which are propagated along the medium. When the sensor is acted on by a measurand to determine the physical characteristics of the propagation medium, the characteristics of the electrical signal are also determined. The measuring device measures the electrical signal and provides an indication of the measurand value. Several sensing arrangements are also disclosed as well as methods for making the planar propagation medium.

摘要翻译： 一种具有形成兰姆波传播介质的薄平板材料的超声波传感器，该薄片的厚度不大于约20微米。 传感器还包括用于在传播介质中产生兰姆波的兰姆波发生器和用于产生代表传播介质传播的兰姆波的传播特性的电信号的输出装置。 传感器中包含测量装置，以测量输出电信号的选定特性。 传播介质具有由作用在介质上的被测量的值确定的一些物理特性，并且所确定的物理特性确定沿着介质传播的兰姆波的传播特性。 当传感器被被测量作用以确定传播介质的物理特性时，也确定电信号的特性。 测量设备测量电信号并提供被测量值的指示。 还公开了几种感测装置以及用于制造平面传播介质的方法。

公开(公告)号：US07131848B2

公开(公告)日：2006-11-07

申请号：US11237091

申请日：2005-09-27

申请人： Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

发明人： Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

IPC分类号： H01R12/00

CPC分类号： G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

摘要： A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

摘要翻译： 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 在替代实施例中，去除垫以留下独立的螺旋接触。

公开(公告)号：US06939474B2

公开(公告)日：2005-09-06

申请号：US09781833

申请日：2001-02-12

申请人： Benjamin N. Eldridge ,  Stuart W. Wenzel

发明人： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC分类号： B81C1/00 ,  B81B3/00 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01H11/04 ,  H01L21/768 ,  H01L23/48 ,  H01L23/482 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  B29C43/02

CPC分类号： G01R1/06716 ,  G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  Y10T29/49147 ,  H01L2924/00

摘要： A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one free-standing spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.

摘要翻译： 公开了一种用于制造微电子弹簧结构的方法。 在该方法的初始步骤中，在衬底上形成牺牲材料层。 然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。 轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。 如果需要，则牺牲层被固化或硬化。 弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。 然后牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。 单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。 还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。 在替代方法的初始步骤中，在衬底上提供一层材料。 然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。 流体被固化或硬化以稳定弯液面的轮廓形状。 然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

公开(公告)号：US06888362B2

公开(公告)日：2005-05-03

申请号：US09880658

申请日：2001-06-13

申请人： Benjamin N. Eldridge ,  Stuart W. Wenzel

发明人： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC分类号： H01R12/61 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L23/48 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  G01R31/02

CPC分类号： G01R1/06716 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2442 ,  H01R2201/20 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

摘要： An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.

摘要翻译： 公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。 微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座， 梁的第一端和位于梁的与基座相对的自由端的尖端。 梁在其自由端和底座之间具有不受支撑的跨距。 微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。 弹簧触点可以具有各种创新的轮廓形状。 在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

公开(公告)号：US06640432B1

公开(公告)日：2003-11-04

申请号：US09547560

申请日：2000-04-12

申请人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

发明人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC分类号： H01R900

CPC分类号： H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

摘要翻译： 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US5129262A

公开(公告)日：1992-07-14

申请号：US467412

申请日：1990-01-18

申请人： Richard M. White ,  Stuart W. Wenzel

发明人： Richard M. White ,  Stuart W. Wenzel

IPC分类号： B01L3/00 ,  G01H13/00 ,  G01H17/00 ,  G01L9/00 ,  G01N29/02 ,  G01P15/08 ,  G10K11/36

CPC分类号： G10K11/36 ,  G01H13/00 ,  G01H17/00 ,  G01L9/0025 ,  G01N29/022 ,  G01P15/08 ,  B01L3/5027 ,  G01N2291/014 ,  G01N2291/0256 ,  G01N2291/02818 ,  G01N2291/02827 ,  G01N2291/02854 ,  G01N2291/0422 ,  G01N2291/0423 ,  G01N2291/0427 ,  H03H9/02228

摘要： An ultrasonic sensor which has a thin planar sheet of material forming a Lamb wave propagation medium, the sheet having a thickness which is no greater than about twenty microns. The sensor also includes a Lamb wave generator for generating Lamb waves in the propagation medium and an output device for producing an electrical signal representative of the propagation characteristics of the Lamb waves propagating along the propagation medium. A measuring device is included in the sensor to measure selected characteristics of the output electrical signal. The propagation medium has some physical characteristics that are determined by the value of a measurand acting on the medium and the determined physical characteristics determine the propagation characteristics of the Lamb waves which are propagated along the medium. When the sensor is acted on by a measurand to determine the physical characteristics of the propagation medium, the characteristics of the electrical signal are also determined. The measuring device measures the electrical signal and provides an indication of the measurand value. Several sensing arrangements are also disclosed as well as methods for making the planar propagation medium.

摘要翻译： 一种具有形成兰姆波传播介质的薄平板材料的超声波传感器，该薄片的厚度不大于约20微米。 传感器还包括用于在传播介质中产生兰姆波的兰姆波发生器和用于产生代表传播介质传播的兰姆波的传播特性的电信号的输出装置。 传感器中包含测量装置，以测量输出电信号的选定特性。 传播介质具有由作用在介质上的被测量的值确定的一些物理特性，并且所确定的物理特性确定沿着介质传播的兰姆波的传播特性。 当传感器被被测量作用以确定传播介质的物理特性时，也确定电信号的特性。 测量设备测量电信号并提供被测量值的指示。 还公开了几种感测装置以及用于制造平面传播介质的方法。

公开(公告)号：US07675301B2

公开(公告)日：2010-03-09

申请号：US11779183

申请日：2007-07-17

申请人： Benjamin N. Eldridge ,  Stuart W. Wenzel

发明人： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC分类号： G01R31/26

CPC分类号： G01R1/06716 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2442 ,  H01R2201/20 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

摘要： An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.

摘要翻译： 公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。 微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座， 梁的第一端和位于梁的与基座相对的自由端的尖端。 梁在其自由端和底座之间具有不受支撑的跨距。 微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。 弹簧触点可以具有各种创新的轮廓形状。 在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

公开(公告)号：US07524194B2

公开(公告)日：2009-04-28

申请号：US11551621

申请日：2006-10-20

申请人： Benjamin N. Eldridge ,  Stuart W. Wenzel

发明人： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC分类号： H01R12/00

CPC分类号： H05K7/1069 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49151 ,  Y10T29/4922

摘要： Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.

摘要翻译： 公开了改进的光刻型微电子弹簧结构和方法，用于提供改善的基板上的尖端高度，改进的弹性范围，增加的强度和可靠性以及增加的弹簧刚度。 改进的结构适于由沉积在模制的牺牲衬底上的单个集成层（或一系列层）形成，从而避免多个阶梯式光刻层并降低制造成本。 特别地，为了实现上述改进，公开了在z方向上成形的平版印刷结构。 例如，公开了具有沿着弹簧的长度延伸的U形横截面，V形横截面和/或一个或多个肋的结构。 本发明另外提供了一种平版印刷型弹性接触件，其被波纹化以增加其有效长度和弹性范围并减小其在基底上的覆盖面，以及在俯视图中成形的弹簧。 本发明还提供了用于光刻型微电子弹簧结构的组合（串联和并联）电接触尖端。 根据本发明的微电子弹簧结构特别适用于制造用于集成电路和其它基板安装的电子设备的电连接器的非常精细的间距阵列，因为它们的性能特性被增强，同时它们可以是 与其他光刻型微电子弹簧结构相比大大降低了成本。