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    Apparatus for supplying source
    11.
    发明申请
    Apparatus for supplying source 审中-公开
    用于供应源的装置

    公开(公告)号：US20120018008A1

    公开(公告)日：2012-01-26

    申请号：US12926823

    申请日：2010-12-10

    申请人： Dong Joo Shin ,  Sung Taek Lim ,  Choon Keun Lee

    发明人： Dong Joo Shin ,  Sung Taek Lim ,  Choon Keun Lee

    IPC分类号： F99Z99/00

    CPC分类号： B05C1/0813 ,  B05C1/0804 ,  B05C1/0808 ,  B05C1/0817 ,  B05C1/0826 ,  B29C39/18 ,  B29C39/44 ,  Y10T137/7287

    摘要： Disclosed herein is an apparatus for supplying a source for constantly maintaining a film source water level in a source reservoir.The apparatus for supplying a source according to the present invention includes a source reservoir into which a liquid-phase film source is injected; a carrier film that is horizontally delivered from one side of the source reservoir; a casting roller that is rotated along the delivery direction of the carrier film and applies the liquid-phase film source injected into the source reservoir to the carrier film; a water level control plate that is vertically driven in the source reservoir to control the liquid-phase film source level; and a plate driving unit that moves the water level control plate up and down.

    摘要翻译： 本文公开了一种用于供应源以持续保持源储罐中的膜源水位的装置。 根据本发明的用于供应源的装置包括其中注入液相膜源的源储存器; 从源储存器的一侧水平地传送的载体膜; 沿着载体膜的传送方向旋转的浇铸辊，将注入到所述源容器中的液相膜源施加到载体膜上; 水位控制板，其在源储液器中垂直驱动以控制液相膜源水平; 以及上下移动水位控制板的板驱动单元。

    COATING SOLUTION FOR FORMING HIGH DIELECTRIC CONSTANT THIN FILM AND METHOD FOR FORMING DIELECRIC THIN FILM USING THE SAME
    13.
    发明申请
    COATING SOLUTION FOR FORMING HIGH DIELECTRIC CONSTANT THIN FILM AND METHOD FOR FORMING DIELECRIC THIN FILM USING THE SAME 失效
    用于形成高介电常数薄膜的涂料溶液及其形成薄膜薄膜的方法

    公开(公告)号：US20090214776A1

    公开(公告)日：2009-08-27

    申请号：US12437672

    申请日：2009-05-08

    申请人： Jun Hee BAE ,  Seung Hyun KIM ,  Yul Kyo CHUNG ,  Won Hoon SONG ,  Sung Taek LIM ,  Hyun Ju JIN

    发明人： Jun Hee BAE ,  Seung Hyun KIM ,  Yul Kyo CHUNG ,  Won Hoon SONG ,  Sung Taek LIM ,  Hyun Ju JIN

    IPC分类号： B05D3/12

    CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

    摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

    摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

    Capacitor embedded printed circuit board and manufacturing method thereof
    14.
    发明申请
    Capacitor embedded printed circuit board and manufacturing method thereof 审中-公开
    电容器嵌入式印刷电路板及其制造方法

    公开(公告)号：US20080100986A1

    公开(公告)日：2008-05-01

    申请号：US11907563

    申请日：2007-10-15

    申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Sung Taek Lim ,  Hyung Mi Jung

    发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Sung Taek Lim ,  Hyung Mi Jung

    IPC分类号： H01G4/00 ,  H01L21/20

    CPC分类号： H01G4/33 ,  H01G4/228 ,  H05K1/162 ,  H05K3/388 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0179 ,  H05K2201/035 ,  H05K2201/09509 ,  H05K2201/09763

    摘要： Provided is a method of manufacturing a capacitor embedded printed circuit board. In the method, a laminated body is prepared, including a laminated plate having first and second copper films on both sides thereof, where at least one bottom electrode is provided on at least one side. A dielectric layer is formed on the at least one bottom electrode. A metal layer is formed on a top surface of the dielectric layer where a capacitor is to be formed. A conductive paste layer is formed on at least one region of a top surface of the metal layer, where the conductive paste layer and the metal layer is provided as a top electrode. An insulation resin layers are formed on both sides of the laminated plate, respectively. A conductive via is formed in the insulation resin layer such that it is connected to the conductive paste layer.

    摘要翻译： 提供一种制造电容器嵌入式印刷电路板的方法。 在该方法中，制备层压体，其包括其两侧具有第一和第二铜膜的层压板，其中在至少一侧上设置有至少一个底部电极。 在所述至少一个底部电极上形成介电层。 在要形成电容器的电介质层的顶表面上形成金属层。 在金属层的顶表面的至少一个区域上形成导电浆料层，其中导电浆料层和金属层设置为顶部电极。 绝缘树脂层分别形成在层压板的两侧。 导电通孔形成在绝缘树脂层中，使其与导电糊层连接。

    Capacitor and manufacturing method thereof
    16.
    发明申请
    Capacitor and manufacturing method thereof 有权
    电容及其制造方法

    公开(公告)号：US20080259523A1

    公开(公告)日：2008-10-23

    申请号：US12078648

    申请日：2008-04-02

    申请人： Sung-Taek LIM ,  Yul-Kyo CHUNG ,  Woon-Chun KIM

    发明人： Sung-Taek LIM ,  Yul-Kyo CHUNG ,  Woon-Chun KIM

    IPC分类号： H01G4/06 ,  H01G4/20 ,  H01G7/00

    CPC分类号： H01G4/33 ,  H01G2/06 ,  H01G4/10 ,  H05K1/162 ,  H05K3/048 ,  H05K3/244 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/0315 ,  Y10T29/435

    摘要： A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

    摘要翻译： 公开了电容器和制造该电容器的方法。 电容器可以包括板，形成在板的一侧上的聚合物层，选择性地形成在聚合物层上的电路图案，以及与电路图案对应的二氧化钛纳米片。 本发明的实施例可以提供板中的平坦度，并且允许板的铜保持其作为电极的功能，同时增加与二氧化钛纳米片的粘合性。 因此，二氧化钛纳米片可以在图案化的板上实现所需的形状，层数和厚度。

    SLITTER
    17.
    发明申请
    SLITTER 审中-公开

    公开(公告)号：US20120292424A1

    公开(公告)日：2012-11-22

    申请号：US13448243

    申请日：2012-04-16

    申请人： Dong Joo Shin ,  Sung Taek Lim ,  Choon Keun Lee

    发明人： Dong Joo Shin ,  Sung Taek Lim ,  Choon Keun Lee

    IPC分类号： B65H35/02

    CPC分类号： B65H35/02 ,  B65H35/08 ,  B65H2601/511 ,  B65H2701/12 ,  B65H2701/1752 ,  B65H2701/1864 ,  B65H2701/20

    摘要： Disclosed herein is a slitter. The slitter according to the exemplary embodiment of the present invention includes an unwinding part from which an insulating film is consecutively taken out; a plurality of transfer rollers that transfer the insulating film supplied from the unwinding part in one direction; a wheel knife that senses an air pocket formed on the insulating film taken out from the unwinding part to form fine holes on the insulating film; a cutter that is disposed between the transfer rollers and cuts, at a predetermined interval, the insulating film transferred in one direction through the transfer roller; and a winding part individually winding the insulating film divided at a predetermined interval by the cutter.

    摘要翻译： 本文公开了一种分切机。 根据本发明的示例性实施例的分切机包括：连续取出绝缘膜的退绕部; 多个转印辊，其从一个方向转印从退绕部供给的绝缘膜; 感测从所述退绕部取出的绝缘膜上形成的空气袋的轮刮刀，在所述绝缘膜上形成细孔; 以预定间隔设置在转印辊和切口之间的切割器，所述绝缘膜沿一个方向通过转印辊转印; 以及通过切割器以预定的间隔分开地卷绕绝缘膜的绕组部分。

    APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE
    18.
    发明申请
    APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE 审中-公开
    用于制造基板的装置和方法

    公开(公告)号：US20110200753A1

    公开(公告)日：2011-08-18

    申请号：US12762924

    申请日：2010-04-19

    申请人： Dong Joo Shin ,  Choon Keun Lee ,  Sung Taek Lim

    发明人： Dong Joo Shin ,  Choon Keun Lee ,  Sung Taek Lim

    IPC分类号： B05D3/12 ,  B05C11/00

    CPC分类号： B05D3/002 ,  H01L21/67109 ,  H01L21/6776 ,  H05K3/022 ,  H05K3/146 ,  H05K3/381 ,  H05K2203/085 ,  H05K2203/1545

    摘要： Disclosed herein is an apparatus for manufacturing a substrate, including: a first chamber supplying an insulation layer; a second chamber including a roughening roller roughening at least one side of the insulation layer supplied from the first chamber, an evaporator depositing a metal layer on the roughened insulation layer, and a pressing roller pressing the insulation layer and the metal layer; and a third chamber storing the insulation layer including the metal layer formed thereon, the insulation layer being taken out from the second chamber. The apparatus for manufacturing a substrate is advantageous in that substrates are continuously produced, thus increasing the productivity of the substrates and preventing the substrates from being contaminated by the air.

    摘要翻译： 本文公开了一种用于制造衬底的装置，包括：提供绝缘层的第一腔室; 第二室，包括使从第一室供应的绝缘层的至少一侧粗糙化的粗糙化辊;在粗糙化绝缘层上沉积金属层的蒸发器;以及按压绝缘层和金属层的加压辊; 以及第三室，存储包括形成在其上的金属层的绝缘层，绝缘层从第二室取出。 用于制造基板的装置的优点在于，连续地生产基板，从而提高基板的生产率并防止基板被空气污染。

    NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME
    20.
    发明申请
    NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME 审中-公开
    具有低介电常数和低损耗特性的NORBENNENE-based聚合物，绝缘材料，印刷电路板和使用其的功能元件

    公开(公告)号：US20100063226A1

    公开(公告)日：2010-03-11

    申请号：US12389086

    申请日：2009-02-19

    申请人： Jae-Choon Cho ,  Do-Yeung Yoon ,  Jun-Rok Oh ,  Hwa-Young Lee ,  Sung-Taek Lim ,  Andreas Greiner

    发明人： Jae-Choon Cho ,  Do-Yeung Yoon ,  Jun-Rok Oh ,  Hwa-Young Lee ,  Sung-Taek Lim ,  Andreas Greiner

    IPC分类号： C08F132/08 ,  C08F2/00

    CPC分类号： C08F132/08 ,  H05K1/032

    摘要： The present invention relates to a to a norbornene-based polymer having a low dielectric constant and low-loss properties, and an insulating material, a printed circuit board and a functional device using the same. More particularly, it relates to a norbornene-based polymer expressed by the following formula (1): wherein, at least one of R1 to R4 is independently substituted or unsubstituted linear C4-C31 arylalkyl or substituted or unsubstituted branched C4-C31 arylalkyl; the rest of R1 to R4 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 250 to 400.

    摘要翻译： 本发明涉及具有低介电常数和低损耗特性的降冰片烯类聚合物，以及绝缘材料，印刷电路板以及使用其的功能元件。 更具体地，涉及由下式（1）表示的降冰片烯系聚合物：其中，R 1〜R 4中的至少一个为独立的取代或未取代的直链C 4 -C 31芳烷基或取代或未取代的支链C 4 -C 31芳烷基; R 1至R 4的其余部分各自独立地为H，取代或未取代的直链C 1 -C 3烷基或取代或未取代的支链C 1 -C 3烷基; n为250〜400的整数。