FIBER-REINFORCED COMPOSITE LAYUP
    12.
    发明申请

    公开(公告)号:US20250010560A1

    公开(公告)日:2025-01-09

    申请号:US18888258

    申请日:2024-09-18

    Inventor: Larry S. Hebert

    Abstract: Fiber-reinforced composites is provided. The composites include a plurality of prepreg layers, each comprising a polymeric resin and a plurality of fibers disposed therein; and at least one electrically-conductive layer at least partially embedded in the plurality of prepreg layers. These fiber-reinforced composites can save weight relative to externally provided wires and can be provided in forms suitable for use in automated fiber placement and automated tape layup machines. Advantageous applications include uses in lightning strike protection, energy storage, signal transmission, and power distribution.

    FIBER-REINFORCED COMPOSITE LAYUP
    13.
    发明申请

    公开(公告)号:US20220055324A1

    公开(公告)日:2022-02-24

    申请号:US17414248

    申请日:2019-12-16

    Inventor: Larry S. Hebert

    Abstract: Fiber-reinforced composites is provided. The composites include a plurality of prepreg layers, each comprising a polymeric resin and a plurality of fibers disposed therein; and at least one electrically-conductive layer at least partially embedded in the plurality of prepreg layers. These fiber-reinforced composites can save weight relative to externally provided wires and can be provided in forms suitable for use in automated fiber placement and automated tape layup machines. Advantageous applications include uses in lightning strike protection, energy storage, signal transmission, and power distribution.

    PROTECTION FILM
    14.
    发明申请

    公开(公告)号:US20210283883A1

    公开(公告)日:2021-09-16

    申请号:US16323486

    申请日:2017-09-25

    Abstract: Provided is a protection film including a plurality of layers, including a first carrier layer having a plurality of electrically conductive fibers; a metal layer; and a second carrier layer having a plurality of electrically conductive fibers. Each of the first and second carrier layers has a void volume at least partially filled with a hardenable composition. Also provided is a protection film including a first metal layer, a carrier layer, and a second metal layer, in which the carrier layer is at least partially filled with a hardenable composition. These films can provide lightning strike protection with suitable tensile, rigidity and tack properties for automatic tape layup and automatic fiber placement applications.

    METHOD OF MAKING STRUCTURED HYBRID ADHESIVE ARTICLES

    公开(公告)号:US20190160729A1

    公开(公告)日:2019-05-30

    申请号:US16265211

    申请日:2019-02-01

    Abstract: A method is provided for making structured hybrid adhesive articles comprising the steps of: a) providing an adhesive article comprising: i) a base resin comprising an epoxy resin, ii) a first epoxy curative, and iii) a second epoxy curative, by reacting the base resin with the first epoxy curative such that the first epoxy curative is substantially reacted with epoxy resin in the article and the second epoxy curative is substantially unreacted in the article; b) embossing the adhesive article with a relief pattern; and c) curing the adhesive article such that the second epoxy curative is substantially reacted with epoxy in the article. In some embodiments, the method additionally comprises a step of embedding a scrim in the adhesive. In some embodiments, the method additionally comprises a step of depositing an electrically conductive layer onto the surface of the adhesive article embossed with the relief pattern.

    PLATING BRONZE ON POLYMER SHEETS
    18.
    发明申请

    公开(公告)号:US20180347059A1

    公开(公告)日:2018-12-06

    申请号:US15571118

    申请日:2016-06-13

    CPC classification number: C25D3/58 C23C28/023 C25D5/18 C25D5/56

    Abstract: An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.

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