中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

18 records (took 0.02 seconds)

    LOW STRESS INTEGRATED DEVICE PACKAGE
    12.
    发明申请
    LOW STRESS INTEGRATED DEVICE PACKAGE 有权

    公开(公告)号：US20220177298A1

    公开(公告)日：2022-06-09

    申请号：US17112894

    申请日：2020-12-04

    Applicant: Analog Devices, Inc.

    Inventor： Yeonsung Kim ,  Shafi Saiyed ,  Thomas M. Goida

    IPC: B81B7/00 ,  B81C1/00

    Abstract: An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

    LOW STRESS INTEGRATED DEVICE PACKAGES
    14.
    发明申请
    LOW STRESS INTEGRATED DEVICE PACKAGES 审中-公开

    公开(公告)号：US20170320725A1

    公开(公告)日：2017-11-09

    申请号：US15496987

    申请日：2017-04-25

    Applicant: ANALOG DEVICES, INC.

    Inventor： Thomas M. Goida

    IPC: B81B7/00 ,  H01L23/538 ,  H01L23/49 ,  H01L23/50 ,  H01L23/24 ,  H01L23/20

    Abstract: An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.

    STRESS ISOLATION FEATURES FOR STACKED DIES
    15.
    发明申请
    STRESS ISOLATION FEATURES FOR STACKED DIES 审中-公开
    应力分离特征用于堆积的模具

    公开(公告)号：US20170022051A1

    公开(公告)日：2017-01-26

    申请号：US15092234

    申请日：2016-04-06

    Applicant: ANALOG DEVICES, INC.

    Inventor： Xiaojie Xue ,  Michael J. Zylinski ,  Thomas M. Goida ,  Kathleen O. O'Donnell

    IPC: B81B7/00 ,  B81C1/00 ,  H01L23/24 ,  H01L25/065

    CPC classification number: B81B7/0048 ,  B81B2207/115 ,  B81C1/00365 ,  B81C2201/0147 ,  B81C2203/0136 ,  H01L23/057 ,  H01L23/562 ,  H01L25/0657 ,  H01L2225/06575

    Abstract: An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.

    Abstract translation: 公开了一种集成器件封装。 封装可以包括诸如第一集成器件管芯的载体和堆叠在第一集成器件管芯上的第二集成器件管芯。 封装可以包括缓冲层，该缓冲层涂覆第一集成器件管芯的外表面的至少一部分，并且设置在第二集成器件管芯和第一集成器件管芯之间。 缓冲层可以包括用于减少第一集成器件管芯和第二集成器件裸片之间的应力传输的图案。

    Pre-Molded MEMS Device Package
    17.
    发明申请
    Pre-Molded MEMS Device Package 有权
    预成型MEMS器件封装

    公开(公告)号：US20140070382A1

    公开(公告)日：2014-03-13

    申请号：US13795874

    申请日：2013-03-12

    Applicant: ANALOG DEVICES, INC.

    Inventor： Thomas M. Goida

    IPC: B81B7/00

    CPC classification number: B81B7/007 ,  B81B7/0032 ,  B81B7/0077 ,  B81B2201/0257 ,  B81B2207/093 ,  H01L21/50 ,  H01L23/495 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/3025 ,  H01L2924/00

    Abstract: A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

    Abstract translation: MEMS引线框架封装体包围封装在由模具体和盖子形成的内部空腔中的MEMS装置。 为了容纳MEMS麦克风，声孔延伸穿过模具体。 在一些实施例中，导电柱延伸穿过预成型体，以允许从部分封装的引线框架到导电盖的电连接。 一些实施例可以包括在模具体内的多层空腔，用于安装由MEMS装置上方的间隙分开的集成电路。

    Microphone System with Offset Apertures
    18.
    发明申请
    Microphone System with Offset Apertures 有权
    具有偏移孔径的麦克风系统

    公开(公告)号：US20130195284A1

    公开(公告)日：2013-08-01

    申请号：US13795026

    申请日：2013-03-12

    Applicant: ANALOG DEVICES, INC.

    Inventor： Jicheng Yang ,  Thomas M. Goida

    IPC: H04R1/04

    CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/222 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A microphone system has a base forming a base aperture, and a lid coupled to the base to form a package having an interior chamber. The system also has a member coupled with the base within the interior chamber, and a microphone die coupled to the member within the interior chamber. The member is positioned between the base and the microphone die and has a member aperture that is laterally offset from the base aperture. The member aperture, member, and base together form an acoustic path between the base aperture and the microphone die.

    Abstract translation: 麦克风系统具有形成基座孔的底座和联接到基座的盖以形成具有内部腔室的包装。 该系统还具有与内部室内的基部连接的构件，以及耦合到内部室内的构件的麦克风模具。 该构件位于基座和麦克风模具之间，并且具有从基座孔侧向偏移的构件孔。 构件孔，构件和底座一起在基座孔和麦克风管芯之间形成声路。

Patent Agency Ranking