公开(公告)号：US20150187600A1

公开(公告)日：2015-07-02

申请号：US14613183

申请日：2015-02-03

Applicant: ASM International N.V.

Inventor： Suvi P. Haukka ,  Antti Niskanen ,  Marko Tuominen

IPC: H01L21/3205 ,  H01L21/768 ,  H01L21/02

CPC classification number: H01L21/7685 ,  C23C16/0227 ,  C23C16/14 ,  C23C16/45525 ,  H01L21/02068 ,  H01L21/02697 ,  H01L21/28562 ,  H01L21/32051 ,  H01L21/32053 ,  H01L21/76826 ,  H01L21/76829 ,  H01L21/76838 ,  H01L21/76849 ,  H01L21/76883

Abstract: Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In preferred embodiments, a first precursor forms a layer or adsorbed species on the first surface and is subsequently reacted or converted to form a metallic layer. Preferably the deposition temperature is selected such that a selectivity of above about 90% is achieved.

Abstract translation: 金属层可以相对于基板的第二表面选择性地沉积在基板的表面上。 在优选实施例中，金属层选择性地沉积在铜上，而不是绝缘或介电材料。 在优选的实施方案中，第一前体在第一表面上形成层或吸附的物质，随后反应或转化以形成金属层。 优选选择沉积温度使得达到高于约90％的选择性。

公开(公告)号：US10043880B2

公开(公告)日：2018-08-07

申请号：US15492892

申请日：2017-04-20

Applicant: ASM INTERNATIONAL N.V.

Inventor： Viljami J. Pore ,  Suvi P. Haukka ,  Tom E. Blomberg ,  Eva E. Tois

IPC: H01L29/45 ,  C23C16/06 ,  C23C16/455 ,  C23C16/40 ,  H01L21/285 ,  H01L21/324 ,  H01L21/3215 ,  H01L29/78 ,  H01L29/66 ,  H01L29/49

CPC classification number: H01L29/45 ,  C23C16/06 ,  C23C16/406 ,  C23C16/45527 ,  H01L21/28518 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/3215 ,  H01L21/324 ,  H01L21/76843 ,  H01L21/76855 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/66666 ,  H01L29/7827

Abstract: In one aspect, methods of silicidation and germanidation are provided. In some embodiments, methods for forming metal silicide can include forming a non-oxide interface, such as germanium or solid antimony, over exposed silicon regions of a substrate. Metal oxide is formed over the interface layer. Annealing and reducing causes metal from the metal oxide to react with the underlying silicon and form metal silicide. Additionally, metal germanide can be formed by reduction of metal oxide over germanium, whether or not any underlying silicon is also silicided. In other embodiments, nickel is deposited directly and an interface layer is not used. In another aspect, methods of depositing nickel thin films by vapor phase deposition processes are provided. In some embodiments, nickel thin films are deposited by ALD.

公开(公告)号：US20170352737A1

公开(公告)日：2017-12-07

申请号：US15492892

申请日：2017-04-20

Applicant: ASM INTERNATIONAL N.V.

Inventor： Viljami J. Pore ,  Suvi P. Haukka ,  Tom E. Blomberg ,  Eva E. Tois

IPC: H01L29/45 ,  H01L29/66 ,  H01L21/3215 ,  H01L21/324 ,  C23C16/06 ,  H01L21/285 ,  C23C16/455 ,  H01L29/78 ,  C23C16/40 ,  H01L29/49

CPC classification number: H01L29/45 ,  C23C16/06 ,  C23C16/406 ,  C23C16/45527 ,  H01L21/28518 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/3215 ,  H01L21/324 ,  H01L21/76843 ,  H01L21/76855 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/66666 ,  H01L29/7827

Abstract: In one aspect, methods of silicidation and germanidation are provided. In some embodiments, methods for forming metal silicide can include forming a non-oxide interface, such as germanium or solid antimony, over exposed silicon regions of a substrate. Metal oxide is formed over the interface layer. Annealing and reducing causes metal from the metal oxide to react with the underlying silicon and form metal silicide. Additionally, metal germanide can be formed by reduction of metal oxide over germanium, whether or not any underlying silicon is also silicided. In other embodiments, nickel is deposited directly and an interface layer is not used. In another aspect, methods of depositing nickel thin films by vapor phase deposition processes are provided. In some embodiments, nickel thin films are deposited by ALD.

公开(公告)号：US09679808B2

公开(公告)日：2017-06-13

申请号：US14988374

申请日：2016-01-05

Applicant: ASM International N.V.

Inventor： Suvi P. Haukka ,  Antti Niskanen ,  Marko Tuominen

IPC: H01L21/4763 ,  H01L21/768 ,  C23C16/02 ,  C23C16/14 ,  C23C16/455 ,  H01L21/285 ,  H01L21/02 ,  H01L21/3205

CPC classification number: H01L21/7685 ,  C23C16/0227 ,  C23C16/14 ,  C23C16/45525 ,  H01L21/02068 ,  H01L21/02697 ,  H01L21/28562 ,  H01L21/32051 ,  H01L21/32053 ,  H01L21/76826 ,  H01L21/76829 ,  H01L21/76838 ,  H01L21/76849 ,  H01L21/76883

Abstract: Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In preferred embodiments, a first precursor forms a layer or adsorbed species on the first surface and is subsequently reacted or converted to form a metallic layer. Preferably the deposition temperature is selected such that a selectivity of above about 90% is achieved.

公开(公告)号：US09587307B2

公开(公告)日：2017-03-07

申请号：US13950049

申请日：2013-07-24

Applicant: ASM International N.V.

Inventor： Suvi P. Haukka ,  Marko J. Tuominen ,  Antti Rahtu

IPC: C23C16/08 ,  C23C16/02 ,  C23C16/18 ,  C23C16/455 ,  H01L21/285

CPC classification number: C23C16/08 ,  C23C16/0218 ,  C23C16/18 ,  C23C16/45525 ,  H01L21/28562

Abstract: The invention relates generally to processes for enhancing the deposition of noble metal thin films on a substrate by atomic layer deposition. Treatment with gaseous halides or metalorganic compounds reduces the incubation time for deposition of noble metals on particular surfaces. The methods may be utilized to facilitate selective deposition. For example, selective deposition of noble metals on high-k materials relative to insulators can be enhanced by pretreatment with halide reactants. In addition, halide treatment can be used to avoid deposition on the quartz walls of the reaction chamber.

Abstract translation: 本发明一般涉及通过原子层沉积来增强在衬底上沉积贵金属薄膜的方法。 使用气态卤化物或金属有机化合物进行处理减少了在特定表面上沉积贵金属的孵育时间。 该方法可用于促进选择性沉积。 例如，可以通过用卤化物反应物预处理来提高贵金属在高k材料上相对于绝缘体的选择性沉积。 此外，可以使用卤化物处理以避免沉积在反应室的石英壁上。

公开(公告)号：US20170018433A1

公开(公告)日：2017-01-19

申请号：US15186950

申请日：2016-06-20

Applicant: ASM International N.V.

Inventor： Viljami J. Pore ,  Suvi P. Haukka ,  Tom E. Blomberg ,  Eva E. Tois

IPC: H01L21/285 ,  H01L29/45 ,  H01L21/3213 ,  H01L29/66 ,  H01L21/321 ,  H01L21/3215

CPC classification number: H01L21/28518 ,  H01L21/28052 ,  H01L21/28568 ,  H01L21/321 ,  H01L21/32133 ,  H01L21/3215 ,  H01L21/76843 ,  H01L21/76855 ,  H01L21/76886 ,  H01L29/456 ,  H01L29/665 ,  H01L29/78

Abstract: In one aspect, methods of silicidation and germanidation are provided. In some embodiments, methods for forming metal silicide can include forming a non-oxide interface, such as germanium or solid antimony, over exposed silicon regions of a substrate. Metal oxide is formed over the interface layer. Annealing and reducing causes metal from the metal oxide to react with the underlying silicon and form metal silicide. Additionally, metal germanide can be formed by reduction of metal oxide over germanium, whether or not any underlying silicon is also silicided. In other embodiments, nickel is deposited directly and an interface layer is not used. In another aspect, methods of depositing nickel thin films by vapor phase deposition processes are provided. In some embodiments, nickel thin films are deposited by ALD. Nickel thin films can be used directly in silicidation and germanidation processes.

Abstract translation: 一方面，提供了硅化和锗化的方法。 在一些实施例中，用于形成金属硅化物的方法可包括在衬底的暴露的硅区上形成非氧化物界面，例如锗或固体锑。 在界面层上形成金属氧化物。 退火和还原使得来自金属氧化物的金属与下面的硅反应并形成金属硅化物。 另外，可以通过在锗上还原金属氧化物来形成金属锗化物，无论底层的硅是否也被硅化。 在其它实施例中，直接沉积镍，并且不使用界面层。 另一方面，提供了通过气相沉积工艺沉积镍薄膜的方法。 在一些实施例中，镍薄膜通过ALD沉积。 镍薄膜可以直接用于硅化和锗化工艺。

公开(公告)号：US10157786B2

公开(公告)日：2018-12-18

申请号：US15356306

申请日：2016-11-18

Applicant: ASM International N.V.

Inventor： Suvi P. Haukka ,  Antti Niskanen ,  Marko Tuominen

IPC: H01L21/768 ,  H01L21/02 ,  H01L23/532 ,  H01L21/28 ,  H01L21/3105 ,  H01L21/285 ,  C23C16/04 ,  C23C16/14 ,  C23C16/455

Abstract: Metallic layers can be selectively deposited on one surface of a substrate relative to a second surface of the substrate. In some embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In some embodiments, a first precursor forms a layer on the first surface and is subsequently reacted or converted to form a metallic layer. The deposition temperature may be selected such that a selectivity of above about 50% or even about 90% is achieved.

公开(公告)号：US09634106B2

公开(公告)日：2017-04-25

申请号：US14815633

申请日：2015-07-31

Applicant: ASM INTERNATIONAL N.V.

Inventor： Viljami J. Pore ,  Suvi P. Haukka ,  Tom E. Blomberg ,  Eva E. Tois

IPC: H01L29/66 ,  H01L29/78 ,  H01L21/285 ,  H01L21/324 ,  C23C16/40 ,  C23C16/06 ,  H01L29/45 ,  C23C16/455 ,  H01L21/3215 ,  H01L29/49

CPC classification number: H01L29/45 ,  C23C16/06 ,  C23C16/406 ,  C23C16/45527 ,  H01L21/28518 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/3215 ,  H01L21/324 ,  H01L21/76843 ,  H01L21/76855 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/66666 ,  H01L29/7827

Abstract: In one aspect, methods of silicidation and germanidation are provided. In some embodiments, methods for forming metal silicide can include forming a non-oxide interface, such as germanium or solid antimony, over exposed silicon regions of a substrate. Metal oxide is formed over the interface layer. Annealing and reducing causes metal from the metal oxide to react with the underlying silicon and form metal silicide. Additionally, metal germanide can be formed by reduction of metal oxide over germanium, whether or not any underlying silicon is also silicided. In other embodiments, nickel is deposited directly and an interface layer is not used. In another aspect, methods of depositing nickel thin films by vapor phase deposition processes are provided. In some embodiments, nickel thin films are deposited by ALD.

公开(公告)号：US20170069527A1

公开(公告)日：2017-03-09

申请号：US15356306

申请日：2016-11-18

Applicant: ASM International N.V.

Inventor： Suvi P. Haukka ,  Antti Niskanen ,  Marko Tuominen

IPC: H01L21/768 ,  C23C16/14 ,  H01L23/532 ,  C23C16/455 ,  H01L21/02 ,  H01L21/285

CPC classification number: H01L21/7685 ,  C23C16/04 ,  C23C16/14 ,  C23C16/45536 ,  C23C16/45553 ,  H01L21/02068 ,  H01L21/28518 ,  H01L21/28562 ,  H01L21/28568 ,  H01L21/3105 ,  H01L21/76826 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76867 ,  H01L21/76883 ,  H01L21/76886 ,  H01L21/76889 ,  H01L23/53238

Abstract: Metallic layers can be selectively deposited on one surface of a substrate relative to a second surface of the substrate. In some embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In some embodiments, a first precursor forms a layer on the first surface and is subsequently reacted or converted to form a metallic layer. The deposition temperature may be selected such that a selectivity of above about 50% or even about 90% is achieved.

Abstract translation: 金属层可以相对于基板的第二表面选择性沉积在衬底的一个表面上。 在一些实施例中，金属层选择性地沉积在铜上而不是绝缘或介电材料。 在一些实施方案中，第一前体在第一表面上形成一层，随后反应或转化以形成金属层。 可以选择沉积温度使得达到高于约50％或甚至约90％的选择性。

公开(公告)号：US09502289B2

公开(公告)日：2016-11-22

申请号：US14737293

申请日：2015-06-11

Applicant: ASM International N.V.

Inventor： Suvi P. Haukka ,  Antti Niskanen ,  Marko Tuominen

IPC: H01L21/768 ,  H01L23/532 ,  H01L21/02 ,  H01L23/528 ,  H01L21/3105 ,  H01L21/285 ,  C23C16/04 ,  C23C16/14

CPC classification number: H01L21/7685 ,  C23C16/04 ,  C23C16/14 ,  C23C16/45536 ,  C23C16/45553 ,  H01L21/02068 ,  H01L21/28518 ,  H01L21/28562 ,  H01L21/28568 ,  H01L21/3105 ,  H01L21/76826 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76867 ,  H01L21/76883 ,  H01L21/76886 ,  H01L21/76889 ,  H01L23/53238

Abstract: Metallic layers can be selectively deposited on one surface of a substrate relative to a second surface of the substrate. In some embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In some embodiments, a first precursor forms a layer on the first surface and is subsequently reacted or converted to form a metallic layer. The deposition temperature may be selected such that a selectivity of above about 50% or even about 90% is achieved.