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11.发明申请METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD 有权生产印刷电路板的方法，包括至少两个印刷电路板区域和印刷电路板公开(公告)号：US20140376196A1
公开(公告)日：2014-12-25
申请号：US14368623
申请日：2012-12-28
CPC分类号： H05K3/4611 , H05K1/11 , H05K1/142 , H05K1/18 , H05K3/368 , H05K3/403 , H05K3/4694 , H05K2201/09045 , H05K2201/0919 , H05K2201/09572 , H05K2201/1059 , H05K2201/209 , Y10T29/49126
摘要： The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board.
摘要翻译： 本发明涉及一种用于制造由至少两个印刷电路板区域组成的印刷电路板的方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过机械联接相互连接。 根据本发明，导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧面处彼此导电耦合，从而在印刷之间形成简单且可靠的横向电耦合 使彼此连接的电路板区域成为可能。 本发明还涉及这种印刷电路板。
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12.发明授权公开(公告)号：US11658142B2
公开(公告)日：2023-05-23
申请号：US16947786
申请日：2020-08-17
发明人： Heinz Moitzi , Johannes Stahr , Andreas Zluc
CPC分类号： H01L24/16 , H01L21/4846 , H01L23/49838 , H01L24/05 , H01L24/13 , H01L24/81 , H05K1/111 , H05K1/181 , H05K3/3436 , H01L2224/0401 , H01L2224/05557 , H01L2224/05572 , H01L2224/13019 , H01L2224/1607 , H01L2224/16059 , H01L2224/81143 , H01L2224/81345 , H01L2224/81801 , H05K2201/09472 , H05K2201/10636 , H05K2201/10727 , H05K2203/048
摘要： A connection arrangement for forming a component carrier structure is disclosed. The connection arrangement includes a first electrically conductive connection element and a second electrically conductive connection element. The first connection element and the second connection element are configured such that, upon connecting the first connection element with the second connection element along a connection direction, a form fit is established between the first connection element and the second connection element that limits a relative motion between the first connection element and the second connection element in a plane perpendicular to the connection direction. A component carrier and a method of forming a component carrier structure are also disclosed.
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公开(公告)号：US11523520B2
公开(公告)日：2022-12-06
申请号：US16184470
申请日：2018-11-08
发明人： Gerald Weidinger , Andreas Zluc , Johannes Stahr
摘要： The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.
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14.发明授权公开(公告)号：US11049778B2
公开(公告)日：2021-06-29
申请号：US16436111
申请日：2019-06-10
发明人： Johannes Stahr , Gerald Weidinger , Gerhard Schmid , Andreas Zluc
IPC分类号： H01L23/13 , H01L23/498 , H01L23/00 , H05K1/18
摘要： Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.
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公开(公告)号：US20210195749A1
公开(公告)日：2021-06-24
申请号：US17247469
申请日：2020-12-11
发明人： Ivan Salkovic , Gerald Weidinger , Johannes Stahr
摘要： A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.
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16.发明授权公开(公告)号：US10665526B2
公开(公告)日：2020-05-26
申请号：US15721116
申请日：2017-09-29
发明人： Jonathan Silvano de Sousa , Bernhard Reitmaier , Erich Schlaffer , Johannes Stahr , Wolfgang Schrittwieser , Gerald Weidinger , Alexander Kasper , Gernot Grober
IPC分类号： H01L23/427 , H05K1/02 , F21V29/51 , F28D15/02 , F28D20/02 , F28F3/08 , H01L21/673
摘要： The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.
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17.发明申请公开(公告)号：US20190306983A1
公开(公告)日：2019-10-03
申请号：US16431289
申请日：2019-06-04
发明人： Johannes Stahr , Wolfgang Schrittwieser , Mike Morianz , Christian Vockenberger , Markus Leitgeb
摘要： The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.
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公开(公告)号：US10165685B2
公开(公告)日：2018-12-25
申请号：US15505144
申请日：2015-08-05
发明人： Markus Leitgeb , Johannes Stahr
摘要： In a printed circuit board (1) comprising a plurality of insulating layers and conductive layers, and comprising at least one cavity (7) at least one electromagnetic coil (8) is arranged on an outer layer (4) of the printed circuit board (1) and cooperates with a permanent magnet (6) arranged inside the at least one cavity (7).
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公开(公告)号：US20180257364A1
公开(公告)日：2018-09-13
申请号：US15980864
申请日：2018-05-16
CPC分类号： B32B37/26 , C08L91/06 , H05K1/183 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , Y10T156/1064 , Y10T156/1153 , Y10T156/1195 , Y10T428/24802 , Y10T428/265
摘要： The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.
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公开(公告)号：US09418930B2
公开(公告)日：2016-08-16
申请号：US14897217
申请日：2014-05-06
发明人： Johannes Stahr , Andreas Zluc , Gernot Grober , Timo Schwarz
IPC分类号： H01L23/36 , H01L23/498 , H01L23/373 , H01L23/31 , H01L23/367 , H01L23/538
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/36 , H01L23/367 , H01L23/3735 , H01L23/49833 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/06181 , H01L2224/18 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2924/0002 , H01L2924/00
摘要： A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates, wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is connected via a contact, a portion of a structured conductor layer, and the conductive, metal intermediate layer to at least one portion of the metal inner layer of the heat dissipation plate, which forms part of the terminal line to the electrode terminal.
摘要翻译： 一种具有印刷电路板芯的功率模块，其包含嵌入绝缘层中的至少一个电子功率部件，所述芯布置在两个散热板之间，其中每个散热板具有金属外层和金属内层 通过导热的电绝缘中间层与所述金属外层电隔离，并且至少一个功率部件的电极端子经由端子线从芯引出，其中绝缘层两侧的印刷电路板芯 具有导体层，至少一个导体层至少部分地构成，并且每个导体层至少部分地通过导电的金属中间层连接到散热板的金属内层，从结构化 导体层至少一个功率部件的电极端子，以及至少一个功率部件的至少一个电源端子 通过接触，结构化导体层的一部分和导电的金属中间层将热功率元件连接到散热板的金属内层的至少一部分，其形成端子线的一部分到电极 终奌站。
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