公开(公告)号：US08431423B2

公开(公告)日：2013-04-30

申请号：US12503951

申请日：2009-07-16

申请人： Grigoriy Basin ,  Paul S. Martin

发明人： Grigoriy Basin ,  Paul S. Martin

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。

公开(公告)号：US20110223696A1

公开(公告)日：2011-09-15

申请号：US13115475

申请日：2011-05-25

申请人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

发明人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

IPC分类号： H01L33/52

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

公开(公告)号：US07553683B2

公开(公告)日：2009-06-30

申请号：US10863980

申请日：2004-06-09

申请人： Paul S. Martin ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Helena Ticha ,  Ladislav Tichy

发明人： Paul S. Martin ,  Gerd O. Mueller ,  Regina B. Mueller-Mach ,  Helena Ticha ,  Ladislav Tichy

IPC分类号： H01L21/00

CPC分类号： H01L33/501 ,  C03C3/12 ,  C03C8/10 ,  C03C14/004 ,  C03C2214/04 ,  C03C2214/16 ,  C09K11/02 ,  C09K11/7774 ,  H01L2933/0041

摘要： A semiconductor light emitting device is provided with a separately fabricated wavelength converting element. The wavelength converting element, of e.g., phosphor and glass, is produced in a sheet that is separated into individual wavelength converting elements, which are bonded to light emitting devices. The wavelength converting elements may be grouped and stored according to their wavelength converting properties. The wavelength converting elements may be selectively matched with a semiconductor light emitting device, to produce a desired mixture of primary and secondary light.

摘要翻译： 半导体发光器件设置有单独制造的波长转换元件。 例如磷光体和玻璃的波长转换元件在分离成各个波长转换元件的片材中产生，其结合到发光器件。 波长转换元件可以根据其波长转换特性进行分组和存储。 波长转换元件可以选择性地与半导体发光器件匹配，以产生所需的初级和次级光的混合。

公开(公告)号：US07170151B2

公开(公告)日：2007-01-30

申请号：US10346535

申请日：2003-01-16

申请人： Cresente S. Elpedes ,  Zainul Fiteri bin Aziz ,  Paul S. Martin

发明人： Cresente S. Elpedes ,  Zainul Fiteri bin Aziz ,  Paul S. Martin

IPC分类号： H01L23/495

CPC分类号： H01L33/642 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48465

摘要： An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.

摘要翻译： LED组件包括散热器和底座。 散热器具有可焊接润湿的顶部配合表面，并且底座具有可焊接润湿的底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 底座焊接在散热器顶部。 在焊料回流期间，熔融焊料使得底座与散热器的顶部配合表面对齐。 LED组件还可以包括具有顶部配合表面的衬底，并且散热器还可以包括底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 散热器焊接在基板上。 在焊料回流期间，熔融焊料使得散热器与衬底的顶部配合表面对齐。

公开(公告)号：US09081167B2

公开(公告)日：2015-07-14

申请号：US12049239

申请日：2008-03-14

申请人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

发明人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC分类号： H01L33/00 ,  G02B19/00 ,  H01L23/00 ,  H01L33/54 ,  H05K3/28 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58

CPC分类号： G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

摘要翻译： 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US20110049545A1

公开(公告)日：2011-03-03

申请号：US12552328

申请日：2009-09-02

申请人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

发明人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

摘要： After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

摘要翻译： 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

公开(公告)号：US07144135B2

公开(公告)日：2006-12-05

申请号：US10723711

申请日：2003-11-26

申请人： Paul S. Martin ,  Franklin J. Wall, Jr.

发明人： Paul S. Martin ,  Franklin J. Wall, Jr.

IPC分类号： F21V29/00

CPC分类号： F21V29/74 ,  F21K9/233 ,  F21S6/003 ,  F21S8/026 ,  F21V7/0091 ,  F21V17/101 ,  F21V17/164 ,  F21V29/004 ,  F21V29/505 ,  F21V29/67 ,  F21V29/673 ,  F21V29/75 ,  F21V29/77 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10

摘要： An LED lamp includes an exterior shell that has the same form factor as a conventional incandescent light bulb, such as a PAR type bulb. The LED lamp includes an optical reflector that is disposed within the shell and that directs the light emitted from one or more LEDs. The optical reflector and shell define a space that is used to channel air to cool the device. The LED is mounted on a heat sink that is disposed within the shell. A fan moves air over the heat sink and through the spaced defined by the optical reflector and the shell. The shell includes one or more apertures that serve as air inlet or exhaust apertures. One or more apertures defined by the optical reflector and shell at the opening of the shell can also be used as air exhaust or inlet apertures.

摘要翻译： LED灯包括具有与常规白炽灯泡（例如PAR型灯泡）相同形状因数的外壳。 LED灯包括设置在外壳内并引导从一个或多个LED发出的光的光学反射器。 光学反射器和壳体限定了用于引导空气冷却设备的空间。 LED安装在设置在外壳内的散热器上。 风扇将空气移动到散热器上方并通过光学反射器和外壳限定的间隔。 壳体包括用作空气入口或排气孔的一个或多个孔。 由光学反射器和壳体在壳体的开口处限定的一个或多个孔也可以用作排气孔或入口孔。

公开(公告)号：US06603258B1

公开(公告)日：2003-08-05

申请号：US09556770

申请日：2000-04-24

申请人： Regina Mueller-Mach ,  Gerd O. Mueller ,  Paul S. Martin

发明人： Regina Mueller-Mach ,  Gerd O. Mueller ,  Paul S. Martin

IPC分类号： H01J154

CPC分类号： H01L33/50 ,  H01L33/08

摘要： A white-light emitting diode (LED) is provided that emits primary light at a wavelength that is in the range of 485 to 515 nanometers (nm), which corresponds to a bluish-green color. A portion of the primary light is converted into a reddish-colored light that ranges in wavelength from approximately 600 to approximately 620 nm. At least a portion of the converted light combines with the unconverted portion of the primary light to produce white light. A number of phosphor-converting elements are suitable for use with the LED, including a resin admixed with a phosphor powder, epoxies admixed with a phosphor powder, organic luminescent dyes, phosphor-converting thin films and phosphor-converting substrates. Preferably, the phosphor-converting element is a resin admixed with a phosphor powder in such a manner that a portion of the primary light impinging on the resin is converted into the reddish-colored light and a portion of the primary light passes through the resin without being converted. The unconverted primary light and the phosphor-converted reddish-colored light combine to produce white light. The LED is mounted in a reflector cup that is filled with the phosphor-converting resin. The LED may be mounted in either a normal or flip-chip configuration within the reflector cup.

摘要翻译： 提供一种白光发光二极管（LED），其发射波长在485至515纳米（nm）范围内的初级光，其对应于蓝绿色。 初级光的一部分被转换成波长从大约600nm到大约620nm的红色光。 转换的光的至少一部分与初级光的未转换部分组合以产生白光。 许多荧光体转换元件适用于LED，包括与荧光体粉末混合的树脂，与荧光体粉末混合的环氧树脂，有机发光染料，磷光体转换薄膜和磷光体转换基板。 优选地，磷光体转换元件是与荧光体粉末混合的树脂，使得入射到树脂上的初级光的一部分被转换成红色的光，并且一部分一次光通过树脂而没有 被转换。 未转换的初级光和磷光体转换的红色光结合产生白光。 LED安装在填充有磷光体转换树脂的反射杯中。 LED可以以反射杯内的正常或倒装芯片配置安装。

公开(公告)号：US08273587B2

公开(公告)日：2012-09-25

申请号：US13115475

申请日：2011-05-25

申请人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

发明人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

公开(公告)号：US20110012149A1

公开(公告)日：2011-01-20

申请号：US12503951

申请日：2009-07-16

申请人： Grigoriy Basin ,  Paul S. Martin

发明人： Grigoriy Basin ,  Paul S. Martin

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。