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37 条记录 (耗时 0.028 秒)

    Rigid-flexible circuit board and method of manufacturing the same
    12.
    发明授权
    Rigid-flexible circuit board and method of manufacturing the same 失效
    刚性柔性电路板及其制造方法

    公开(公告)号：US08198543B2

    公开(公告)日：2012-06-12

    申请号：US12618726

    申请日：2009-11-14

    申请人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

    发明人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

    IPC分类号： H05K1/00

    CPC分类号： H05K3/4641 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/189 ,  H05K3/462 ,  H05K3/4691 ,  H05K2203/0315 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.

    摘要翻译： 公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路 并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得 刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。 还提供了制造刚性柔性电路板的方法。

    Light emitting diode package including monitoring photodiode
    14.
    发明授权
    Light emitting diode package including monitoring photodiode 有权
    发光二极管封装包括监控光电二极管

    公开(公告)号：US07649208B2

    公开(公告)日：2010-01-19

    申请号：US11313508

    申请日：2005-12-21

    申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

    发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

    IPC分类号： H01L27/15

    CPC分类号： H01L31/147 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014

    摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

    摘要翻译： 本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。 而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。 在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。 第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。 此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

    Method of manufacturing package substrate for optical element
    15.
    发明授权
    Method of manufacturing package substrate for optical element 有权
    制造光学元件封装基板的方法

    公开(公告)号：US08603842B2

    公开(公告)日：2013-12-10

    申请号：US13418241

    申请日：2012-03-12

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/62

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    17.
    发明申请
    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于光学元件的封装基板及其制造方法

    公开(公告)号：US20110140144A1

    公开(公告)日：2011-06-16

    申请号：US12721539

    申请日：2010-03-10

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/00 ,  H01L31/00

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    18.
    发明申请
    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于光学元件的封装基板及其制造方法

    公开(公告)号：US20110101392A1

    公开(公告)日：2011-05-05

    申请号：US12642326

    申请日：2009-12-18

    申请人： Sung Keun Park ,  Seog Moon Choi ,  Young Ki Lee ,  Chang Hyun Lim

    发明人： Sung Keun Park ,  Seog Moon Choi ,  Young Ki Lee ,  Chang Hyun Lim

    IPC分类号： H01L33/00 ,  H01L21/56

    CPC分类号： H01L33/50 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Disclosed is a package substrate for an optical element, which includes a metal core having a hole formed therein, an insulating layer formed on the surface of the metal core, a first metal layer formed to a predetermined thickness on the surface of the insulating layer so as to include therein the metal core insulated by the insulating layer, an optical element mounted on the first metal layer, and a fluorescent resin material applied on the optical element in order to protect the optical element, thereby simplifying a package substrate process and improving light uniformity, light reflectivity and heat dissipating properties compared to a conventional configuration. A method of manufacturing the package substrate is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括其中形成有孔的金属芯，形成在金属芯的表面上的绝缘层，在绝缘层的表面上形成为预定厚度的第一金属层， 在其中包括由绝缘层绝缘的金属芯，安装在第一金属层上的光学元件和施加在光学元件上的荧光树脂材料，以保护光学元件，从而简化了封装衬底处理和改善光 均匀性，光反射率和散热特性。 还提供了制造封装基板的方法。

    LED package using Si substrate and fabricating method thereof
    19.
    发明授权
    LED package using Si substrate and fabricating method thereof 失效
    使用Si衬底的LED封装及其制造方法

    公开(公告)号：US07582496B2

    公开(公告)日：2009-09-01

    申请号：US11312412

    申请日：2005-12-21

    申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

    发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

    IPC分类号： H01L21/00 ,  H01L33/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

    摘要翻译： 提供了使用Si衬底的LED封装和LED封装的制造方法。 在LED封装中，支撑结构包括Si衬底和形成在Si衬底的顶表面和底表面上的绝缘层，并且支撑结构通过部分去除Si衬底和绝缘层而在底表面中限定至少一个凹槽 。 多个上电极形成在支撑结构的顶表面上。 至少一个LED安装在支撑结构的顶表面上，并且LED包括电连接到上电极的两个端子。 金属填料填充在支撑结构的底面中限定的槽中。