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公开(公告)号：US20170236767A1
公开(公告)日：2017-08-17
申请号：US15500210
申请日：2015-07-29
IPC分类号： H01L23/373 , B22D19/00 , B22D18/02 , B22D17/00 , B32B9/00 , H05K1/02 , B32B9/04 , B32B15/20 , B21J5/00 , B21J1/00 , H01L23/367 , B22D21/00 , B32B3/26
摘要： An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≦Ax/B≦1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≦Ay/B≦1.00 and production method therefor.
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公开(公告)号：US20170142859A1
公开(公告)日：2017-05-18
申请号：US15322494
申请日：2015-07-03
发明人： Takeshi MIYAKAWA , Motonori KINO
CPC分类号： H05K7/209 , B22D19/00 , B22D19/14 , B22D21/007 , C04B41/009 , C04B41/5155 , C09K5/14 , C22C21/02 , C22C21/08 , H01L23/3733 , H01L23/4006
摘要： A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.
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公开(公告)号：US20200335415A1
公开(公告)日：2020-10-22
申请号：US16822225
申请日：2020-03-18
发明人： Daisuke GOTO , Takeshi MIYAKAWA , Yosuke ISHIHARA
IPC分类号： H01L23/373 , H01L23/14 , H01L23/12 , H01L23/36 , C22F1/04 , H01L21/48 , H01L23/367
摘要： To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.
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公开(公告)号：US20190093201A1
公开(公告)日：2019-03-28
申请号：US16084475
申请日：2016-12-27
IPC分类号： C22C26/00 , B22F3/17 , B22F3/26 , H01L23/373
摘要： Provided is an aluminum-diamond-based composite which can be processed with high dimensional accuracy. The flat-plate-shaped aluminum-diamond-based composite is coated with a surface layer of which the entire surface has an average film thickness of 0.01-0.2 mm and which contains not less than 80 volume % of a metal containing an aluminum.
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公开(公告)号：US20180215668A1
公开(公告)日：2018-08-02
申请号：US15748420
申请日：2015-07-31
发明人： Akimasa YUASA , Takeshi MIYAKAWA , Daisuke GOTO
IPC分类号： C04B35/565 , B22D19/14 , C04B41/88 , C04B38/00 , C22C1/10
CPC分类号： C04B35/565 , B22D19/00 , B22D19/02 , B22D19/14 , C04B35/573 , C04B35/6316 , C04B35/645 , C04B38/00 , C04B38/0032 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C04B2111/00931 , C04B2235/3418 , C04B2235/3826 , C04B2235/401 , C04B2235/402 , C04B2235/428 , C04B2235/5472 , C04B2235/6027 , C04B2235/616 , C04B2235/783 , C04B2235/786 , C04B2235/9607 , C22C1/10 , C22C1/1036 , C22C1/1068 , C22C2001/1021 , H01L21/4871 , H01L23/3731 , H01L23/3736 , C04B41/4521 , C04B41/4523 , C04B41/5096 , C04B41/515
摘要： [Problem to be Solved]Provided are an aluminum-silicon-carbide composite having high thermal conductivity, low thermal expansion, and low specific gravity and a method for producing the composite.[Solution]Provided is an aluminum-silicon-carbide composite formed by impregnating a porous silicon carbide molded body with an aluminum alloy. The ratio of silicon carbide in the composite is 60 vol % or more, and the composite contains 60-75 mass % of silicon carbide having a particle diameter of 80 μm or more and 800 μm or less, 20-30 mass % of silicon carbide having a particle diameter of 8 μm or more and less than 80 μm, and 5-10 mass % of silicon carbide having a particle diameter of less than 8
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公开(公告)号：US20170181272A1
公开(公告)日：2017-06-22
申请号：US15327159
申请日：2015-07-29
发明人： Ryota AONO , Akimasa YUASA , Takeshi MIYAKAWA
CPC分类号： H05K1/0271 , B23K1/0016 , B23K35/0244 , B23K35/3006 , C04B37/02 , C04B37/026 , C04B2237/125 , C04B2237/366 , C04B2237/407 , C04B2237/74 , C09K5/14 , H01L23/3735 , H01L2924/0002 , H05K1/0204 , H05K1/0306 , H05K1/053 , H05K3/022 , H05K3/061 , H05K3/067 , H05K3/4611 , H05K2201/068 , H05K2203/0285 , H01L2924/00
摘要： [Problem] To obtain a ceramic circuit board having superior crack-resistance with respect to ultrasonic bonding.[Solution] The abovementioned problem is solved by a ceramic circuit board characterized in that a metal circuit board is bonded to one surface of a ceramic substrate and a metal heat radiation plate is bonded to the other surface of the ceramic substrate, wherein the crystal grain size in the metal circuit board is at least 20 μm and at most 70 μm. This ceramic circuit board can be manufactured by arranging the metal circuit board on one surface of the ceramic substrate and arranging the metal heat radiation plate on the other surface of the ceramic substrate, and bonding in a vacuum of at most 1×10−3 Pa, at a bonding temperature of at least 780° C. and at most 850° C., for a retention time of at least 10 minutes and at most 60 minutes.
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17.发明申请公开(公告)号：US20170162469A1
公开(公告)日：2017-06-08
申请号：US15115955
申请日：2015-02-02
IPC分类号： H01L23/373 , B23P15/26 , H01L21/48
CPC分类号： H01L23/3738 , B23P15/26 , B23P2700/10 , H01L21/4871 , H01L23/367 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： [Problem] To inexpensively provide a heat dissipating component that has thermal conductivity, as well as a low specific gravity, and a coefficient of thermal expansion close to that of a ceramic substrate, and furthermore having warpage so as to be able to be joined with good closeness of contact to a heat dissipating component or the like. [Solution] A silicon carbide composite which is a plate-shaped composite formed by impregnation of a porous silicon carbide molded article by a metal having aluminum as a main component, wherein the amount of warpage with respect to 10 cm of length of the main surface of the composite is 250 μm or less, and the amount of warpage of a power module using the plate-shaped composite is 250 μm or less; and a heat dissipating component using the same.
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