公开(公告)号：US06965245B2

公开(公告)日：2005-11-15

申请号：US10429275

申请日：2003-05-01

Applicant: January Kister ,  David Beatson ,  Edward Laurent

Inventor： January Kister ,  David Beatson ,  Edward Laurent

IPC: G01R1/073 ,  G01R31/02 ,  H01R12/00

CPC classification number: G01R1/07357 ,  Y10T29/49117

Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

Abstract translation: 互连组件具有冶金结合到更大结构的端子的预制互连结构。 互连结构的独立且独立于较大结构的制造使得能够使用为微型钣金零件而众所周知的经济大规模制造技术。 在制造，定位和附接期间，每个互连结构与载体结构组合和/或保持在载体结构中，在附接到终端之后，载体结构被分离。 互连结构被配置成使得附接工具可以靠近互连结构和端子之间的连接接口，以便将粘结能量短时间地直接传输到附接界面上。 连接接口提供了导电和弯曲应力，该互连结构与端子之间的机械连接相反。 互连组件优选地是探针装置的一部分。

公开(公告)号：US20050247758A1

公开(公告)日：2005-11-10

申请号：US11092399

申请日：2005-03-29

Applicant: David Beatson ,  E. Frasch

Inventor： David Beatson ,  E. Frasch

IPC: B23K20/00 ,  B23K31/02 ,  H01L21/60

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K2101/40 ,  H01L2224/45015 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/2075 ,  H01L2924/20757 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.

Abstract translation: 一种用于将导线接合到半导体器件的引线接合机。 引线接合机包括具有安装到其上的接合工具的引线接合头。 接合工具适于将线端附接到半导体器件。 接合头传送系统使焊接工具沿垂直方向平移并且沿着第一水平轴平移焊接工具。 工作台支撑至少一个待接线的半导体器件。 工作台传送系统沿着第二水平轴转换半导体器件。

公开(公告)号：US20050184133A1

公开(公告)日：2005-08-25

申请号：US11065193

申请日：2005-02-24

Applicant: Horst Clauberg ,  Ronald Focia ,  David Beatson ,  Kenneth Dury

Inventor： Horst Clauberg ,  Ronald Focia ,  David Beatson ,  Kenneth Dury

IPC: B08B7/00 ,  B23K1/20 ,  B23K20/00 ,  B23K26/14

CPC classification number: H01L24/85 ,  B08B7/0042 ,  B23K20/004 ,  B23K26/1224 ,  B23K26/123 ,  B23K26/142 ,  B23K26/1462 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/7865 ,  H01L2224/8501 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00

Abstract: A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and adapted to attach a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system also includes a laser cleaning mechanism mounted to the frame, the laser cleaning mechanism including a laser for emitting laser light adapted to irradiate contaminants on a bonding pad, the laser mechanism located on the frame so as to emit light onto a bonding pad of at least one of the semiconductor device and the substrate prior to the bonding head attaching the wire thereto.

Abstract translation: 一种用于在半导体器件和衬底上的接合焊盘之间连接导线的引线接合系统。 引线接合系统包括框架和粘合头，该接合头附接到框架并且适于将导线附接到半导体器件和基板上的接合焊盘之间。 引线接合系统还包括安装到框架的激光清洁机构，激光清洁机构包括用于发射适合于在接合焊盘上照射污染物的激光的激光器，位于框架上的激光机构以将光发射到接合 所述半导体器件和所述基板中的至少一个的焊盘在所述焊接头附接所述导线之前。

公开(公告)号：US20070210815A1

公开(公告)日：2007-09-13

申请号：US11711319

申请日：2007-02-26

Applicant: Habib Kilicaslan ,  David McDevitt ,  Bahadir Tunaboylu ,  David Beatson

Inventor： Habib Kilicaslan ,  David McDevitt ,  Bahadir Tunaboylu ,  David Beatson

IPC: G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/06772

Abstract: A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

Abstract translation: 刀片探针卡包括多个叶片，每个叶片包括连接到印刷电路板的第一端和第二端。 探针构件附接到每个叶片的第二端并向外延伸以与待测试的装置接触。 接地构件附接到每个叶片的第二端。 刀片探针卡还包括与印刷电路板分离并联接到每个叶片的接地构件的公共接地构件。 每个叶片还可以包括形成在每个叶片的表面上的第一导电信号迹线和两个或更多个导电接地迹线。 第一导电信号迹线将探针构件电连接到印刷电路板上的触点。 两个或多个导电接地迹线与导电信号迹线相邻并且减小了叶片之间的串扰。

公开(公告)号：US20060060631A1

公开(公告)日：2006-03-23

申请号：US11230767

申请日：2005-09-20

Applicant: E. Frasch ,  David Beatson

Inventor： E. Frasch ,  David Beatson

IPC: B23K37/00

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  B23K37/0282 ,  B23K2101/40 ,  B23Q1/44 ,  B23Q1/4852 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01105 ,  H02K41/0356 ,  H02K2201/18 ,  H01L2224/48 ,  H01L2224/45099

Abstract: A motion control device for controlling rotary and linear motion which includes a first linear actuator having a first fixed member and a first moveable drive member, the first moveable drive member being driven for motion relative to the first fixed member along a first longitudinal axis. The device also includes a second linear actuator having a second fixed member and a second moveable drive member, the second movable drive member being driven for motion relative to the second fixed member along a second longitudinal axis. A drive assembly is configured to be driven by the first and second moveable drive members for (a) linear motion along an axis substantially parallel to the first and second longitudinal axes, and (b) rotation about an axis of rotation. A position of each of the moveable drive members is separately controllable to control rotational and linear positions of the drive assembly.

Abstract translation: 一种用于控制旋转和直线运动的运动控制装置，其包括具有第一固定构件和第一可移动驱动构件的第一线性致动器，所述第一可移动驱动构件被驱动以沿着第一纵向轴线相对于第一固定构件运动。 该装置还包括具有第二固定构件和第二可移动驱动构件的第二线性致动器，第二可动驱动构件被驱动以相对于第二固定构件沿着第二纵向轴线运动。 驱动组件被构造成由第一和第二可移动驱动构件驱动，用于（a）沿着基本上平行于第一和第二纵向轴线的轴线的直线运动，以及（b）围绕旋转轴线旋转。 每个可移动驱动构件的位置是可分离地控制的，以控制驱动组件的旋转和线性位置。

公开(公告)号：US20060027747A1

公开(公告)日：2006-02-09

申请号：US11196194

申请日：2005-08-03

Applicant: Bahadir Tunaboylu ,  Edward Malantonio ,  David Beatson ,  Andrew Hmiel

Inventor： Bahadir Tunaboylu ,  Edward Malantonio ,  David Beatson ,  Andrew Hmiel

IPC: C25D5/02 ,  C25D17/00 ,  H01J40/00

CPC classification number: C25D5/02 ,  C25D5/022 ,  C25D7/00 ,  C25D17/00 ,  G01R1/06738 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00

Abstract: A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

公开(公告)号：US20050286060A1

公开(公告)日：2005-12-29

申请号：US11148486

申请日：2005-06-09

Applicant: David Beatson ,  Deepak Sood ,  Norman Lucas

Inventor： David Beatson ,  Deepak Sood ,  Norman Lucas

IPC: B23K20/00 ,  G01B11/14

CPC classification number: H01L24/78 ,  B23K20/007 ,  H01L2224/78301 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/14 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

Abstract translation: 提供了一种用于确定用于引线接合器和光学成像器的引线接合工具布置的系统。 该系统包括设置在光学成像器下方的棱镜和引线接合工具。 该系统还包括沿着第一光轴定位在棱镜和引线接合工具的下部之间的至少一个透镜。 所述至少一个透镜和所述棱镜在所述至少一个透镜和所述引线接合工具的下部之间限定物平面。 所述至少一个透镜沿着第二光轴定位在所述棱镜和所述光学成像器之间。 所述至少一个透镜和所述棱镜限定所述至少一个透镜和所述光学成像器之间的图像平面。

公开(公告)号：US20050253140A1

公开(公告)日：2005-11-17

申请号：US11121703

申请日：2005-05-03

Applicant: David Beatson

Inventor： David Beatson

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/607 ,  H01L21/66 ,  H01L23/485 ,  H01L23/58

CPC classification number: H01L24/11 ,  G01R31/2884 ,  H01L22/32 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48471 ,  H01L2224/48477 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2224/45099

Abstract: A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer.

Abstract translation: 提供了一种处理包括多个半导体管芯的半导体晶片的方法。 该方法包括提供包括多个半导体管芯的半导体晶片，半导体管芯的至少一部分包括用于测试各个半导体管芯的接触焊盘。 该方法还包括在完成半导体晶片的晶片测试之前和在从半导体晶片分离多个半导体管芯之前，在接触焊盘上定位导电凸块。 在半导体晶片的晶片测试期间，导电凸块的至少一部分被配置为电路径。