公开(公告)号：US09196563B2

公开(公告)日：2015-11-24

申请号：US14374396

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Yuichi Sawai ,  Takashi Naito ,  Takuya Aoyagi ,  Tadashi Fujieda ,  Mutsuhiro Mori

IPC: H01L23/34 ,  H01L23/373 ,  B23K35/26 ,  H01L23/00 ,  C04B37/02 ,  C22C13/00 ,  H01L21/52 ,  H01L33/62 ,  H01L33/64 ,  C22C5/06

CPC classification number: H01L23/3736 ,  B23K35/26 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/408 ,  C22C5/06 ,  C22C13/00 ,  H01L21/52 ,  H01L23/3731 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1432 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/12014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: Bondability and heat conductivity of a bonded body in which some of metal, ceramic, or semiconductor are bonded to each other are improved. In the bonded body in which a first member and a second member each comprise one of metal, ceramic, or semiconductor are bonded to each other, the second member is bonded to the first member by way of an adhesive member disposed to the surface of the first member, and the adhesive member contains a V2O5-containing glass and metal particles. In a semiconductor module having a base metal, a ceramic substrate, a metal wiring, and a semiconductor chip, the ceramic substrate is bonded to the base metal by way of a first adhesive member disposed to the surface of the base metal, the metal wiring is bonded to the ceramic substrate by way of a second adhesive member disposed to the surface of the ceramic substrate, the semiconductor chip is bonded to the metal wiring by way of a third adhesive member disposed to the surface of the metal wiring, and the first adhesive member, the second adhesive member, and the third adhesive member each comprise a V2O5-containing glass and metal particles.

Abstract translation: 其中一些金属，陶瓷或半导体彼此结合的接合体的结合性和导热性得到改善。 在其中每个包括金属，陶瓷或半导体中的一个的第一构件和第二构件彼此结合的接合体中，第二构件通过设置在第二构件的表面上的粘合构件接合到第一构件 第一构件，并且粘合构件含有含V2O5的玻璃和金属颗粒。 在具有基底金属，陶瓷基板，金属布线和半导体芯片的半导体模块中，陶瓷基板通过设置在基板金属的表面上的第一粘合部件接合到基底金属，金属布线 通过设置在陶瓷基板的表面上的第二粘合部件与陶瓷基板接合，半导体芯片通过设置在金属布线表面的第三粘合部件与金属布线接合，第一 粘合剂构件，第二粘合构件和第三粘合构件各自包含含V 2 O 5的玻璃和金属颗粒。

公开(公告)号：US20140378581A1

公开(公告)日：2014-12-25

申请号：US14368978

申请日：2012-11-19

Applicant: Hitachi, Ltd.

Inventor： Takuya Aoyagi ,  Takashi Naito ,  Tadashi Fujieda ,  Yuichi Sawai ,  Hajime Murakami ,  Hiroshi Yoshida ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC: C08J5/12 ,  C08J3/28 ,  C08K7/14 ,  C09D125/06 ,  C09D163/00

CPC classification number: C08J5/12 ,  C03C3/21 ,  C03C12/00 ,  C03C14/00 ,  C03C2214/12 ,  C03C2214/30 ,  C08J3/28 ,  C08J2325/06 ,  C08J2363/00 ,  C08K7/14 ,  C09D7/61 ,  C09D125/06 ,  C09D163/00

Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.

Abstract translation: 复合材料的机械强度通过简单的工艺得到增强。 在包含树脂或橡胶和氧化物玻璃的复合材料中，树脂或橡胶分散在氧化物玻璃中，或者氧化物玻璃分散在树脂或橡胶中。 复合材料具有氧化物玻璃被电磁波软化和流化的功能。

公开(公告)号：US10442724B2

公开(公告)日：2019-10-15

申请号：US15755947

申请日：2016-07-11

Applicant: HITACHI, LTD.

Inventor： Takuya Aoyagi ,  Takashi Naito ,  Tatsuya Miyake

IPC: C03C8/24 ,  B32B7/02 ,  B32B7/12 ,  C03C3/12 ,  C03C3/14 ,  C03C3/21 ,  C03C8/02 ,  C03C8/04 ,  C03C8/08 ,  B23K35/36

Abstract: The purpose of the present invention is to provide a joining material that can easily join materials to be joined even when characteristics and physical properties thereof differ greatly. To solve the above problem, the joining material according to the present invention is characterized by including a base material, a first layer that is disposed on one surface of the base material, and a second layer that is disposed on the other surface of the base material and includes a phase having a different coefficient of thermal expansion to that of the phase configuring the first layer, at least one of the first and second layers including glass having a softening point of 600° C. or lower.

公开(公告)号：US10177069B2

公开(公告)日：2019-01-08

申请号：US15501374

申请日：2015-09-09

Applicant: HITACHI, LTD.

Inventor： Takashi Naito ,  Motomune Kodama ,  Takuya Aoyagi ,  Shigeru Kikuchi ,  Takashi Nogawa ,  Mutsuhiro Mori ,  Eiichi Ide ,  Toshiaki Morita ,  Akitoyo Konno ,  Taigo Onodera ,  Tatsuya Miyake ,  Akihiro Miyauchi

IPC: C03C8/02 ,  C03C8/08 ,  C03C8/24 ,  H01L23/373 ,  C09J1/00 ,  C09J11/04 ,  H01L21/52 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00

Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

公开(公告)号：US09796821B2

公开(公告)日：2017-10-24

申请号：US14368978

申请日：2012-11-19

Applicant: Hitachi, Ltd.

Inventor： Takuya Aoyagi ,  Takashi Naito ,  Tadashi Fujieda ,  Yuichi Sawai ,  Hajime Murakami ,  Hiroshi Yoshida ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC: C08J3/28 ,  C08J5/12 ,  C03C3/21 ,  C03C3/12 ,  C03C8/08 ,  C03C14/00 ,  C03C12/00 ,  C09D7/12 ,  C09D125/06 ,  C09D163/00 ,  C08K7/14 ,  C08K3/40

CPC classification number: C08J5/12 ,  C03C3/21 ,  C03C12/00 ,  C03C14/00 ,  C03C2214/12 ,  C03C2214/30 ,  C08J3/28 ,  C08J2325/06 ,  C08J2363/00 ,  C08K7/14 ,  C09D7/61 ,  C09D125/06 ,  C09D163/00

Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.

公开(公告)号：US09543265B2

公开(公告)日：2017-01-10

申请号：US14178847

申请日：2014-02-12

Applicant: Hitachi, Ltd.

Inventor： Motomune Kodama ,  Takashi Naito ,  Tadashi Fujieda ,  Yuichi Sawai ,  Takuya Aoyagi ,  Masanori Miyagi

IPC: H01F3/00 ,  H01L23/00 ,  C04B35/645 ,  C04B37/02

CPC classification number: H01L24/29 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2731 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29169 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29224 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29269 ,  H01L2224/29288 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29369 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83487 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/15788 ,  H01L2924/351 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.

Abstract translation: 公开了一种接合体，其中多个基底构件通过接合层彼此接合，并且至少一个基底构件是陶瓷材料，半导体或玻璃的基底构件。 接合材料层含有金属和氧化物。 氧化物含有V和Te，并且存在于金属和基体之间。 还公开了含有含有V和Te，金属颗粒和溶剂的氧化物玻璃的糊状物的接合材料; 以包含V和Te的氧化物玻璃的颗粒嵌入的箔片或板的形式; 或以包含含有V和Te的氧化物玻璃层和金属层的箔片或板的形式。

公开(公告)号：US09373558B2

公开(公告)日：2016-06-21

申请号：US14769231

申请日：2013-02-22

Applicant: HITACHI, LTD.

Inventor： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Takashi Naito ,  Motomune Kodama ,  Masanori Miyagi ,  Takuya Aoyagi

IPC: H01L23/29 ,  H01L25/07 ,  H01L25/16 ,  H01L23/31

CPC classification number: H01L23/291 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/564 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/37124 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8389 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/8489 ,  H01L2224/8592 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.

Abstract translation: 本发明旨在提高树脂密封电子控制装置的耐湿性。 树脂密封电子控制装置包括：半导体芯片; 片式电容器; 芯片电阻; 接合部件; 底物; 一个案例; 散热板; 玻璃涂层; 和第一密封材料。 玻璃涂层直接覆盖由元件组成的电子电路，包括：半导体芯片; 片式电容器; 芯片电阻，接合部件和基板，并由第一密封材料密封。 通过不透水，玻璃涂层防止元件组附近的吸水，并且可以防止由于吸水引起的半导体芯片的泄漏电流的增加，以及由迁移引起的绝缘性能降低等绝缘性能下降 在元素组内。

公开(公告)号：US20150028333A1

公开(公告)日：2015-01-29

申请号：US14379208

申请日：2013-01-15

Applicant: Hitachi, Ltd.

Inventor： Tadashi Fujieda ,  Takashi Naito ,  Takuya Aoyagi ,  Yuichi Sawai

IPC: H01L31/032 ,  H01L31/18

CPC classification number: H01L31/032 ,  C23D5/00 ,  H01L31/18 ,  H02S40/20

Abstract: A metal matrix composite having high corrosion resistance even if the coating film deposit amount is low is obtained. A metal matrix composite includes a metal or alloy substrate coated with a molten transition metal oxide glass, wherein the transition metal oxide glass has an n-type polarity. Further, a method for producing a metal matrix composite includes a step of applying a paste containing a transition metal oxide glass, an organic binder, and an organic solvent onto the surface of a metal or alloy substrate, and a step of forming a glass coating film on the substrate by heating to and maintaining a temperature equal to or higher than the softening point of the transition metal oxide glass after the application step, wherein the transition metal oxide glass has an n-type polarity.

Abstract translation: 即使涂膜沉积量低，也可获得具有高耐蚀性的金属基复合材料。 金属基复合材料包括涂有熔融过渡金属氧化物玻璃的金属或合金基底，其中过渡金属氧化物玻璃具有n型极性。 此外，金属基质复合体的制造方法包括将含有过渡金属氧化物玻璃，有机粘合剂和有机溶剂的糊料涂布到金属或合金基材的表面上的步骤，以及形成玻璃涂层 通过在施加步骤之后加热并保持等于或高于过渡金属氧化物玻璃的软化点的温度在基板上的膜，其中过渡金属氧化物玻璃具有n型极性。

公开(公告)号：US20150017409A1

公开(公告)日：2015-01-15

申请号：US14367744

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Takashi Naito ,  Tadashi Fujieda ,  Takuya Aoyagi ,  Yuichi Sawai ,  Hajime Murakami ,  Masahiko Ogino ,  Akihiro Miyauchi ,  Hiroshi Yoshida

IPC: B05D3/06 ,  C03C8/10 ,  H05K1/18 ,  H05K1/03 ,  H01L31/048 ,  B05D1/12

CPC classification number: B05D3/06 ,  B05D1/12 ,  C03C3/21 ,  C03C8/08 ,  C03C8/10 ,  C03C8/16 ,  C03C8/24 ,  H01L31/048 ,  H01L31/0481 ,  H05K1/0306 ,  H05K1/181 ,  Y02E10/50 ,  Y10T428/24975 ,  Y10T428/265

Abstract: The gas barrier property of a laminate constituted by a base material containing a resin or a rubber and an oxide glass is improved. A composite member containing an oxide glass 2 formed as a layer densely on a base material 1 containing a resin or a rubber, in which the oxide glass is bonded to the base material by irradiating the oxide glass with an electromagnetic wave and softening and fluidizing the oxide glass.

Abstract translation: 由含有树脂或橡胶的基材和氧化物玻璃构成的层压体的阻气性提高。 一种复合构件，其含有氧化物玻璃2，其密集地形成在包含树脂或橡胶的基材1上，其中通过用电磁波照射氧化物玻璃将氧化物玻璃结合到基材上，并使 氧化物玻璃。

公开(公告)号：US20140334937A1

公开(公告)日：2014-11-13

申请号：US14368479

申请日：2012-11-01

Applicant: Hitachi, Ltd.

Inventor： Tadashi Fujieda ,  Takashi Naito ,  Takuya Aoyagi ,  Yuichi Sawai ,  Hajime Murakami ,  Hiroshi Yoshida ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC: C08K3/40 ,  F03D1/06 ,  C09D125/06

CPC classification number: C08K3/40 ,  C03C3/122 ,  C03C3/21 ,  C03C13/00 ,  C03C14/00 ,  C08J5/10 ,  C09D125/06 ,  F03D1/0675 ,  Y02E10/721

Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber, and the oxide glass is softened and fluidized by heating at or lower than a heat decomposition temperature of the resin or the rubber.

Abstract translation: 复合材料的机械强度通过简单的工艺得到增强。 在包含树脂或橡胶和氧化物玻璃的复合材料中，树脂或橡胶分散在氧化物玻璃中，或者氧化物玻璃分散在树脂或橡胶中，氧化物玻璃通过加热软化和流化 等于或低于树脂或橡胶的热分解温度。