公开(公告)号：US20170091491A1

公开(公告)日：2017-03-30

申请号：US14865551

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG

IPC: G06F21/87 ,  H05K1/02 ,  H05K3/10 ,  G06F21/72

CPC classification number: H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/167 ,  H05K3/062 ,  H05K3/366 ,  H05K2201/0352 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

公开(公告)号：US20200045812A1

公开(公告)日：2020-02-06

申请号：US16596941

申请日：2019-10-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  John R. DANGLER ,  Michael J. FISHER ,  David C. LONG

IPC: H05K1/02 ,  G06F21/86 ,  H05K1/11 ,  H05K1/18 ,  H05K5/02 ,  G01N27/04 ,  G06F21/87

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

公开(公告)号：US20190037687A1

公开(公告)日：2019-01-31

申请号：US15810295

申请日：2017-11-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  John R. DANGLER ,  Michael J. FISHER ,  David C. LONG

IPC: H05K1/02 ,  G06F21/87 ,  H05K5/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  G01N27/04

CPC classification number: H05K1/0275 ,  G01N27/045 ,  G06F21/86 ,  G06F21/87 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10204 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

公开(公告)号：US20180096173A1

公开(公告)日：2018-04-05

申请号：US15819540

申请日：2017-11-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG ,  Michael T. PEETS

IPC: G06F21/87 ,  H05K5/02 ,  H05K5/03 ,  H01R12/59 ,  G06F21/75 ,  H05K1/02

CPC classification number: G06F21/87 ,  G06F21/75 ,  H01R12/59 ,  H05K1/0275 ,  H05K5/0208 ,  H05K5/03 ,  H05K2201/055 ,  H05K2201/056

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

公开(公告)号：US20170332485A1

公开(公告)日：2017-11-16

申请号：US15154077

申请日：2016-05-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Silvio DRAGONE ,  Michael J. FISHER ,  Michael A. GAYNES ,  David C. LONG ,  Kenneth P. RODBELL ,  William SANTIAGO-FERNANDEZ ,  Thomas WEISS

IPC: H05K1/02 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K1/0275 ,  G06F21/87 ,  H05K1/181 ,  H05K1/185 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.

公开(公告)号：US20170156223A1

公开(公告)日：2017-06-01

申请号：US14955283

申请日：2015-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. FISHER ,  David C. LONG ,  Michael T. PEETS ,  Robert WEISS ,  Thomas WEISS ,  James E. TERSIGNI

IPC: H05K5/02 ,  H05K13/00

CPC classification number: H05K5/0208 ,  G06F21/00 ,  G06F21/86

Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

公开(公告)号：US20170094847A1

公开(公告)日：2017-03-30

申请号：US14941872

申请日：2015-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. FISHER ,  David C. LONG ,  Michael T. PEETS ,  Thomas WEISS

IPC: H05K13/00 ,  H05K3/10

CPC classification number: H05K13/00 ,  H05K3/10 ,  H05K5/0208

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

公开(公告)号：US20170094808A1

公开(公告)日：2017-03-30

申请号：US14941908

申请日：2015-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  Silvio DRAGONE ,  Roger S. KRABBENHOFT ,  David C. LONG ,  Stefano S. OGGIONI ,  Michael T. PEETS ,  William SANTIAGO-FERNANDEZ

IPC: H05K3/30 ,  H05K3/32

CPC classification number: G01D5/16 ,  H05K1/0275 ,  H05K1/0298 ,  H05K1/182 ,  H05K3/30 ,  H05K3/32 ,  H05K2201/09263 ,  H05K2201/096 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.

公开(公告)号：US20170094778A1

公开(公告)日：2017-03-30

申请号：US14865708

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Zachary T. DREISS ,  Michael J. FISHER ,  David C. LONG ,  William SANTIAGO-FERNANDEZ ,  Thomas WEISS

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0213 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/183 ,  H05K5/0208 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

公开(公告)号：US20200152930A1

公开(公告)日：2020-05-14

申请号：US16189011

申请日：2018-11-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Noah SINGER ,  Prabjit SINGH ,  John G. TOROK ,  David C. LONG

IPC: H01M2/10 ,  H01M10/52 ,  H01M2/12 ,  H01M10/653

Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.