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11.发明申请公开(公告)号：US20170057815A1
公开(公告)日：2017-03-02
申请号：US14833871
申请日：2015-08-24
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: H01L21/563 , B81B7/0038 , B81B7/0058 , B81B2201/0264 , B81B2207/012 , B81C1/00285 , B81C2203/0118 , H01L2224/48091 , H01L2924/00014
Abstract: A first semiconductor substrate having at least one integrated semiconductor device is provided. A lift-off layer is formed on a main surface of the first semiconductor substrate. The lift-off layer is patterned so as to form openings in the lift-off layer that are arranged on either side of a first portion of the lift-off layer. The first substrate is connected together with a second substrate by an interconnect structure to form an assembly with the main surface of the first semiconductor substrate being exposed. Exposed surfaces of the assembly are coated with a parylene coating, with a first portion of the parylene coating being supported by the first portion of the lift-off layer. The first portion of the parylene coating is selectively removed using a lift-off technique that removes the first portion of the lift-off layer. The lift-off technique is performed after connecting the first substrate and second substrates together.
Abstract translation: 提供具有至少一个集成半导体器件的第一半导体衬底。 在第一半导体衬底的主表面上形成剥离层。 剥离层被图案化以在剥离层中形成布置在剥离层的第一部分的任一侧上的开口。 第一衬底通过互连结构与第二衬底连接在一起，以形成暴露第一半导体衬底的主表面的组件。 组件的暴露表面涂覆有聚对二甲苯涂层，聚对二甲苯涂层的第一部分由剥离层的第一部分支撑。 使用去除剥离层的第一部分的剥离技术选择性地除去聚对二甲苯涂层的第一部分。 在将第一基板和第二基板连接在一起之后进行剥离技术。
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公开(公告)号：US09164156B2
公开(公告)日：2015-10-20
申请号：US13629659
申请日：2012-09-28
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Georg Ernst , Horst Theuss
CPC classification number: G01R33/072 , G01D5/147 , G01R33/06 , G01R33/091
Abstract: An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.
Abstract translation: 设备可以包括背偏磁体; 和半导体芯片元件; 其中所述半导体芯片元件具有用于测量磁场强度的传感器; 并且其中在所述背偏压磁体的接触侧和所述半导体芯片元件的接触侧上形成接触表面，并且其中所述半导体芯片元件的接触侧具有一个或多个结构，使得所述背面的接触表面 -bias磁体以对应于半导体芯片元件的结构的方式成形。
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13.发明申请Method of Packaging a Semiconductor Chip Using a 3D Printing Process and Semiconductor Package Having Angled Surfaces 有权使用3D印刷工艺封装半导体芯片的方法和具有有角度表面的半导体封装公开(公告)号：US20150249043A1
公开(公告)日：2015-09-03
申请号：US14193480
申请日：2014-02-28
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: H01L23/3135 , B29C64/00 , B29C64/10 , B29C64/106 , B29C70/72 , B29K2025/08 , B29K2033/04 , B29K2105/253 , B29L2031/3481 , B33Y40/00 , B33Y80/00 , B81C1/00309 , B81C2203/0136 , H01L21/4867 , H01L21/56 , H01L23/3121 , H01L23/315 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49113 , H01L2924/00014 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099 , H01L2924/00
Abstract: In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.
Abstract translation: 一方面，一种封装半导体模块的方法包括提供具有第一表面，与第一表面相对的第二表面和在第一表面和第二表面之间延伸的边缘边的半导体模块。 至少部分地通过3D打印处理形成包装组件。 包装组件包括半导体模块和在第一表面上延伸的保护覆盖物。
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公开(公告)号：US20140264255A1
公开(公告)日：2014-09-18
申请号：US14289512
申请日：2014-05-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Klaus Elian , Guenther Ruhl , Horst Theuss , Irmgard Escher-Poeppel
IPC: H01L29/16
CPC classification number: H01L29/1606 , G01N27/127 , G01N33/0059 , H01L21/561 , H01L21/568 , H01L23/28 , H01L23/293 , H01L23/3135 , H01L23/315 , H01L23/49562 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/94 , H01L24/96 , H01L2224/02379 , H01L2224/0346 , H01L2224/0401 , H01L2224/04042 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/24105 , H01L2224/24226 , H01L2224/48245 , H01L2224/48247 , H01L2224/48465 , H01L2224/94 , H01L2224/96 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2224/11 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01079 , H01L2924/01083 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.
Abstract translation: 在基板上产生石墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。
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公开(公告)号：US20140097514A1
公开(公告)日：2014-04-10
申请号：US13647740
申请日：2012-10-09
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Klaus Elian , Jens Pohl , Horst Theuss , Renate Hofmann , Alexander Glas , Carsten Ahrens
CPC classification number: H01L23/295 , H01F2017/0066 , H01F2017/0086 , H01L21/568 , H01L23/49816 , H01L23/5227 , H01L23/5389 , H01L23/645 , H01L24/19 , H01L24/96 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H01L2224/94 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/1421 , H01L2924/1431 , H01L2924/1461 , H01L2924/181 , H01L2924/19042 , H01L2924/19104 , H01L2224/03 , H01L2924/00
Abstract: A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.
Abstract translation: 半导体封装包括半导体芯片，施加到半导体芯片的电感器。 电感器包括至少一个绕组。 至少一个绕组内的空间填充有磁性材料。
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Patent Agency Ranking
公开(公告)号：US12135853B2
公开(公告)日：2024-11-05
申请号：US17823372
申请日：2022-08-30
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
Abstract: What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor.
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公开(公告)号：US11860272B2
公开(公告)日：2024-01-02
申请号：US18053583
申请日：2022-11-08
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Christoph Steiner , Horst Theuss , Matthias Eberl , Fabian Merbeler
Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.
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公开(公告)号：US20210028125A1
公开(公告)日：2021-01-28
申请号：US16935459
申请日：2020-07-22
Applicant: Infineon Technologies AG
Inventor： Jochen Dangelmaier , Klaus Elian
IPC: H01L23/00 , H01L23/31 , H01L23/495 , H01L21/48 , H01L21/56
Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.
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公开(公告)号：US10539779B2
公开(公告)日：2020-01-21
申请号：US15674149
申请日：2017-08-10
Applicant: Infineon Technologies AG
Inventor： Ludwig Heitzer , Derek Debie , Klaus Elian , Cyrus Ghahremani , Johannes Lodermeyer , Oskar Neuhoff , Johann Strasser
Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.
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公开(公告)号：US09998812B2
公开(公告)日：2018-06-12
申请号：US15043831
申请日：2016-02-15
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/083 , B81B7/0061 , B81B2201/0257 , H01L2224/95 , H01L2924/14 , H01L2924/1461 , H01L2924/15 , H01L2924/181 , H01L2924/19106 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003 , H04R2410/05 , H04R2499/11
Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
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