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    Electronic array and chip package
    11.
    发明授权
    Electronic array and chip package 有权
    电子阵列和芯片封装

    公开(公告)号：US09111772B1

    公开(公告)日：2015-08-18

    申请号：US14166880

    申请日：2014-01-29

    Applicant: Infineon Technologies AG

    Inventor： Volker Strutz ,  Horst Theuss ,  Chee Voon Tan ,  Hui Teng Wang

    IPC: H01L29/06

    CPC classification number: H01L29/0649 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099

    Abstract: An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.

    Abstract translation: 电子阵列可以包括具有第一操作电压的第一电子部件，具有第二操作电压的第二电子部件，其中第二操作电压不同于第一操作电压，并且其中第一电子部件和第二电子部件 在第一电子部件和第二电子部件之间布置有隔离层，其中隔离层将第一电子部件与第二电子部件电隔离，至少一个连接层至少部分地形成在隔离层和 所述第一电子部件或所述隔离层和所述第二电子部件之间，其中所述连接层包括第一部分和第二部分，其中所述第一部分和所述第二部分各自从相应的电子部件延伸到所述隔离层，其中， 第一部分包括a n隔离材料，其将隔离层固定到相应的电子部件，并且其中第二部分包括将相应的电子部件电耦合到隔离层的导电材料。

    Sensor devices with sensor chip and busbar
    14.
    发明授权
    Sensor devices with sensor chip and busbar 有权

    公开(公告)号：US11493538B2

    公开(公告)日：2022-11-08

    申请号：US16947910

    申请日：2020-08-24

    Applicant: Infineon Technologies AG

    Inventor： Rainer Markus Schaller ,  Juergen Hoegerl ,  Volker Strutz

    IPC: G01R15/20 ,  G01R19/00

    Abstract: A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.

    SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE
    16.
    发明申请
    SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE 审中-公开

    公开(公告)号：US20200056910A1

    公开(公告)日：2020-02-20

    申请号：US16532680

    申请日：2019-08-06

    Applicant: Infineon Technologies AG

    Inventor： Volker Strutz ,  Rainer Markus Schaller

    IPC: G01D11/24 ,  G01R33/07

    Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.

    Current sensor
    19.
    发明授权
    Current sensor 有权

    公开(公告)号：US11835600B2

    公开(公告)日：2023-12-05

    申请号：US17807002

    申请日：2022-06-15

    Applicant: Infineon Technologies AG

    Inventor： Rainer Markus Schaller ,  Volker Strutz ,  Jochen Dangelmaier

    IPC: G01R33/07 ,  G01R15/20 ,  G01R33/09

    CPC classification number: G01R33/07 ,  G01R15/202 ,  G01R15/205 ,  G01R33/09

    Abstract: What is proposed is a current sensor comprising a current rail and comprising a magnetic field sensor, wherein the magnetic field sensor is configured to measure a magnetic field induced by a current flowing through the current rail, wherein a first insulation layer and a second insulation layer are arranged between the current rail and the magnetic field sensor, wherein an interface between the first insulation layer and the second insulation layer is free of a contact with the current rail and/or is free of a contact with the magnetic field sensor.

    Sensor apparatuses with a bypass current path and associated production methods
    20.
    发明授权
    Sensor apparatuses with a bypass current path and associated production methods 有权

    公开(公告)号：US11561245B2

    公开(公告)日：2023-01-24

    申请号：US17217390

    申请日：2021-03-30

    Applicant: Infineon Technologies AG

    Inventor： Klaus Elian ,  Rainer Markus Schaller ,  Volker Strutz

    IPC: G01R15/20 ,  G01R19/00 ,  G01R33/07

    Abstract: A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.

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