-
公开(公告)号：US09856404B2
公开(公告)日：2018-01-02
申请号：US14938044
申请日：2015-11-11
CPC分类号： C09J11/04 , A61K9/5094 , B01J13/02 , B01J13/22
摘要： A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.
-
公开(公告)号：US20170130102A1
公开(公告)日：2017-05-11
申请号：US14938044
申请日：2015-11-11
CPC分类号： C09J11/04 , A61K9/5094 , B01J13/02 , B01J13/22
摘要： A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.
-
公开(公告)号：US09648723B2
公开(公告)日：2017-05-09
申请号：US14855635
申请日：2015-09-16
CPC分类号： H05K3/26 , H01P3/02 , H05K1/0213 , H05K1/0237 , H05K1/0242 , H05K1/0298 , H05K1/0393 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/181 , H05K3/06 , H05K3/064 , H05K3/382 , H05K3/46 , H05K3/4611 , H05K2201/0355 , H05K2201/0391 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
-
公开(公告)号：US09607172B2
公开(公告)日：2017-03-28
申请号：US14583921
申请日：2014-12-29
CPC分类号： G06F21/6245 , G01N27/045 , G01R17/00 , G01R27/02 , G06F21/60 , G06F21/87 , H05K3/30
摘要： An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.
-
公开(公告)号：US20160328568A1
公开(公告)日：2016-11-10
申请号：US14704035
申请日：2015-05-05
IPC分类号： G06F21/62
摘要： In an example, a method includes obtaining an expected biological sample value at a computing device. The expected biological sample value indicates an expected concentration of a material biologically processed by a courier. The computing device determines whether the measured biological sample value is associated with the courier based on a comparison of the expected biological sample value to the measured biological sample value. The method also includes determining a particular set of operations to be performed at the computing device based on a result of the comparison.
摘要翻译： 在一个示例中，一种方法包括在计算设备处获得期望的生物样品值。 预期的生物样品值表示由快递公司生物处理的材料的预期浓度。 计算装置根据预期的生物样品值与所测量的生物样品值的比较，确定所测量的生物样品值是否与快递相关联。 该方法还包括基于比较的结果确定要在计算设备处执行的特定操作集合。
-
公开(公告)号：US09329147B1
公开(公告)日：2016-05-03
申请号：US14578737
申请日：2014-12-22
CPC分类号： G06F21/6245 , G01N27/045 , G01R17/00 , G01R27/02 , G06F21/60 , G06F21/87 , H05K3/30
摘要： An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.
摘要翻译： 公开了一种用于为集成电路（IC）芯片提供安全性的装置。 该装置可以包括附接到印刷电路板（PCB）的表面的IC芯片。 PCB可以包括附接到PCB表面和暴露的IC芯片表面的第一，电绝缘的保形涂层。 PCB还可以包括惠斯通电桥电路，以指示对第二X射线不透明，光学不透明和电阻的保形涂层的变化。 电路可以包括由第二共形涂层区域形成的四个电阻器，PCB上的四组导电焊盘，每组电连接到四个电阻器的电阻器。 电路还可以包括连接到两个导电焊盘的电压源和监控装置，其连接到另外两个导电焊盘并被配置成检测惠斯通电桥的电阻变化。
-
17.发明授权Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance 有权在蚀刻的硅晶圆槽中采用水平对准的石墨纳米纤维，以提高热性能公开(公告)号：US09245813B2
公开(公告)日：2016-01-26
申请号：US13754149
申请日：2013-01-30
发明人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K Sinha , Kevin A. Splittstoesser , Timothy A. Tofil
IPC分类号： H01L23/34 , H01L23/00 , H01L23/373 , H01L23/36 , H01L23/42 , H01L23/427 , H01L21/48 , H01L25/065 , H01L23/48
CPC分类号： H01L23/00 , H01L21/4882 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/4275 , H01L23/481 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.
摘要翻译： 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括在第一芯片和第二芯片之间的热界面材料焊盘，其中热界面材料焊盘包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，以及热连接到热 界面材料垫。
-
公开(公告)号：US10657271B2
公开(公告)日：2020-05-19
申请号：US14704035
申请日：2015-05-05
摘要： In an example, a method includes obtaining an expected biological sample value at a computing device. The expected biological sample value indicates an expected concentration of a material biologically processed by a courier. The computing device determines whether the measured biological sample value is associated with the courier based on a comparison of the expected biological sample value to the measured biological sample value. The method also includes determining a particular set of operations to be performed at the computing device based on a result of the comparison.
-
公开(公告)号：US10595416B2
公开(公告)日：2020-03-17
申请号：US16397298
申请日：2019-04-29
IPC分类号： H05K3/26 , H05K3/06 , H05K1/02 , H05K1/09 , H05K3/38 , H01P3/02 , H05K1/11 , H05K1/18 , H05K3/46 , H05K1/03
摘要： A circuit apparatus includes a first circuit feature upon a first insulator and a second circuit feature upon the first insulator. The first circuit feature includes a planarized surface and the second circuit feature includes an irregular surface. The first circuit feature and the second circuit feature may be formed from patterning a conductive sheet that is upon the first insulator. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions thereof and is maintained in second regions thereof. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
-
公开(公告)号：US20190254172A1
公开(公告)日：2019-08-15
申请号：US16397298
申请日：2019-04-29
IPC分类号： H05K3/26 , H05K1/02 , H05K1/09 , H05K3/06 , H05K1/11 , H05K3/46 , H05K3/38 , H01P3/02 , H05K1/18
摘要： A circuit apparatus includes a first circuit feature upon a first insulator and a second circuit feature upon the first insulator. The first circuit feature includes a planarized surface and the second circuit feature includes an irregular surface. The first circuit feature and the second circuit feature may be formed from patterning a conductive sheet that is upon the first insulator. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions thereof and is maintained in second regions thereof. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
-
-
-
-
-
-
-
-
-
搜索结果
45 条记录 (耗时 0.019 秒)
