公开(公告)号：US06847232B2

公开(公告)日：2005-01-25

申请号：US10059987

申请日：2002-01-29

申请人： Steven Tinsley ,  James Dietz ,  Mark Morgan

发明人： Steven Tinsley ,  James Dietz ,  Mark Morgan

IPC分类号： H03K19/0175 ,  H03K19/0185 ,  H04L25/02

CPC分类号： H03K19/017527 ,  H03K19/018585 ,  H04L25/0274 ,  H04L25/0278 ,  H04L25/028 ,  H04L25/0282 ,  H04L25/0292 ,  H04L25/0294

摘要： A system and method is described for a driver circuit used for high speed data transmission in LVDS and CML transceiver device applications. The transceivers are intended to receive a low voltage differential input signal and interchangeably drive a standard LVDS load with a TIA/EIA-644 compliant LVDS signal, and a standard CML load with a standard CML compatible signal. The driver circuit operates at speeds up to 1.36 Gbps, making it compatible with the OC-24 signaling rate for optical transmission. To accomplish this, the driver uses a mixed combination of voltage and current mode drive sections in the output circuit when coupled to LVDS loads, and when the driver is coupled to CML loads, operates purely in a current mode using only the current mode drive section. MOS transistors and a current source are used in the current mode switch portion to switch the drive with a constant current at the high speeds, and NPN transistors in the voltage mode output portion provide variable impedance for the output circuit. A common mode compensation circuit using a feedback voltage from the load generates a compensation signal for variable impedance control of the NPN transistors to yield a regulated voltage for the common mode dc voltage.

摘要翻译： 描述了用于LVDS和CML收发器设备应用中用于高速数据传输的驱动器电路的系统和方法。 收发器旨在接收低电压差分输入信号，并可互换地使用符合TIA / EIA-644标准的LVDS信号驱动标准LVDS负载，以及具有标准CML兼容信号的标准CML负载。 驱动器电路的工作速度高达1.36 Gbps，使其与OC-24信号传输速率兼容。 为了实现这一点，驱动器在耦合到LVDS负载时使用输出电路中的电压和电流模式驱动部分的混合组合，并且当驱动器耦合到CML负载时，仅使用当前模式驱动部分 。 MOS晶体管和电流源用于电流模式开关部分，以高速度以恒定电流切换驱动器，并且电压模式输出部分中的NPN晶体管为输出电路提供可变阻抗。 使用来自负载的反馈电压的共模补偿电路产生用于NPN晶体管的可变阻抗控制的补偿信号，以产生用于共模直流电压的调节电压。

公开(公告)号：US06716271B1

公开(公告)日：2004-04-06

申请号：US10282377

申请日：2002-10-29

申请人： Jose Arno ,  Edward Sturm ,  Luping Wang ,  James Dietz

发明人： Jose Arno ,  Edward Sturm ,  Luping Wang ,  James Dietz

IPC分类号： B01D5304

CPC分类号： B01D53/04 ,  B01D2253/102 ,  B01D2259/40083 ,  B01D2259/40086 ,  B01D2259/40088 ,  B01D2259/4525 ,  Y10S95/901

摘要： A germane storage and dispensing system, in which germane gas is sorptively retained on an activated carbon sorbent medium in a vessel containing adsorbed and free germane gas. The activated carbon sorbent medium is deflagration-resistant in relation to the germane gas adsorbed thereon, i.e., under deflagration conditions of 65° C. and 650 torr, under which free germane gas undergoes deflagration, the activated carbon sorbent medium does not sustain deflagration of the adsorbed germane gas or thermally desorb the germane gas so that it undergoes subsequent deflagration. The deflagration-resistance of the activated carbon sorbent medium is promoted by pre-treatment of the sorbent material to remove extraneous sorbables therefrom and by maintaining the fill level of the sorbent medium in the gas storage and dispensing vessel at a substantial value, e.g., of at least 30%.

摘要翻译： 锗烷存储和分配系统，其中将锗烷气体吸附保留在含有吸附和游离的锗烷气体的容器中的活性炭吸附剂介质上。 活性炭吸附剂介质相对于其上吸附的锗烷气体，即在65℃和650托的爆燃条件下，具有爆燃阻力，在此条件下，游离的锗烷气体经历爆燃，活性炭吸附剂介质不能保持爆燃 吸附的锗烷气体或热解吸锗烷气体，使其经历随后的爆燃。 通过预处理吸附剂材料来促进活性炭吸附剂介质的防爆性，以从其中除去外来的吸附物，并且通过将吸附剂介质在气体储存和分配容器中的填充水平保持在基本值，例如 至少30％。

公开(公告)号：US07819981B2

公开(公告)日：2010-10-26

申请号：US10973673

申请日：2004-10-26

申请人： Frank DiMeo, Jr. ,  James Dietz ,  W. Karl Olander ,  Robert Kaim ,  Steven E. Bishop ,  Jeffrey W. Neuner ,  Jose I. Arno

发明人： Frank DiMeo, Jr. ,  James Dietz ,  W. Karl Olander ,  Robert Kaim ,  Steven E. Bishop ,  Jeffrey W. Neuner ,  Jose I. Arno

IPC分类号： B08B6/00

CPC分类号： C23G5/00 ,  C23C14/564 ,  H01J37/08 ,  H01J37/32862 ,  H01J2237/022 ,  H01J2237/31701

摘要： A method and apparatus for cleaning residue from components of an ion source region of an ion implanter used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive halide composition for sufficient time and under sufficient conditions to at least partially remove the residue. The gas-phase reactive halide composition is chosen to react selectively with the residue, while not reacting with the components of the ion source region or the vacuum chamber.

摘要翻译： 一种用于清洁用于制造微电子器件的离子注入机的离子源区域的组分的残留物的方法和装置。 为了有效地除去残留物，将组分与气相反应性卤化物组合物接触足够的时间并在足够的条件下至少部分地除去残余物。 选择气相反应性卤化物组合物与残余物选择性反应，而不与离子源区域或真空室的组分反应。

公开(公告)号：US20100180955A1

公开(公告)日：2010-07-22

申请号：US12749633

申请日：2010-03-30

申请人： Michael J. Wodjenski ,  James Dietz

发明人： Michael J. Wodjenski ,  James Dietz

IPC分类号： F15D1/00

CPC分类号： F17C13/04 ,  F17C2205/0142 ,  F17C2205/0146 ,  F17C2205/0326 ,  F17C2205/0329 ,  F17C2205/0335 ,  F17C2205/0338 ,  F17C2223/033 ,  F17C2223/035 ,  F17C2223/036 ,  F17C2223/038 ,  F17C2227/0114 ,  F17C2227/044 ,  F17C2270/0518 ,  Y10T137/0396 ,  Y10T137/0419 ,  Y10T137/4259 ,  Y10T137/7043 ,  Y10T137/87877

摘要： A gas cabinet including an enclosure containing at least one gas supply vessel and flow circuitry coupled to the gas supply vessel(s). The flow circuitry is constructed and arranged to flow dispensed gas from an on-stream gas supply vessel to multiple sticks of the flow circuitry, with each of the multiple sticks being joined in gas flow communication to a respective gas-utilizing process unit. The flow circuitry is valved to enable sections of the flow circuitry associated with respective ones of the multiple sticks to be isolated from other sections of the flow circuitry, so that process gas can be flowed to one or more of the sticks, while other sticks are being evacuated and purged, or otherwise are closed to dispensed gas flow therethrough.

摘要翻译： 一种气柜，包括包含至少一个气体供应容器和耦合到气体供应容器的流动回路的外壳。 流动电路被构造和布置成将分配的气体从流动气体供应容器流动到流动电路的多个棒，其中每个多个棒以气体流动连通的方式连接到相应的气体利用处理单元。 流动电路是阀门，以使得与多个棒中的相应的一个杆相关联的流动回路的部分与流动回路的其它部分隔离，使得处理气体可以流到一个或多个棒，而其他棒是 被排空和吹扫，或以其他方式关闭以分配气体流过其中。

公开(公告)号：US20090095713A1

公开(公告)日：2009-04-16

申请号：US11577852

申请日：2005-10-21

申请人： Frank Dimeo, Jr. ,  James Dietz ,  W. Karl Olander ,  Robert Kaim ,  Steven E. Bishop ,  Jeffrey W. Neuner ,  Jose I. Arno

发明人： Frank Dimeo, Jr. ,  James Dietz ,  W. Karl Olander ,  Robert Kaim ,  Steven E. Bishop ,  Jeffrey W. Neuner ,  Jose I. Arno

IPC分类号： C03C25/68 ,  H01L21/306

CPC分类号： C23G5/00 ,  C23C14/564 ,  H01J37/08 ,  H01J37/32862 ,  H01J2237/022 ,  H01J2237/31701

摘要： A method and apparatus for cleaning residue from components of an ion source region of an ion implanter used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive halide composition for sufficient time and under sufficient conditions to at least partially remove the residue. The gas-phase reactive halide composition is chosen to react selectively with the residue, while not reacting with the components of the ion source region or the vacuum chamber.

摘要翻译： 一种用于清洁用于制造微电子器件的离子注入机的离子源区域的组分的残留物的方法和装置。 为了有效地除去残留物，将组分与气相反应性卤化物组合物接触足够的时间并在足够的条件下至少部分地除去残余物。 选择气相反应性卤化物组合物与残余物选择性反应，而不与离子源区域或真空室的组分反应。

公开(公告)号：US07518231B2

公开(公告)日：2009-04-14

申请号：US11203861

申请日：2005-08-15

申请人： James Dietz ,  Petros Negussu ,  Thoai Thai Le

发明人： James Dietz ,  Petros Negussu ,  Thoai Thai Le

IPC分类号： H01L23/12

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package comprising at least a first die and a second die, wherein each die comprises an integrated circuit (IC) disposed thereon. Each of the first die and the second die comprise a plurality of contact pads coupled with the respective IC. The contact pads on the first IC comprise a first mode pad coupled to a first device formed on the first die, and the contact pads on the second IC comprise a second mode pad coupled to a second device formed on the second die. The first mode pad is coupled to a first potential and causes the first device to operate in a first mode. The second mode pad is coupled to a second potential and causes the second device to operate in a second mode. The first and second mode are selected based on the relative position of the first and second die.

摘要翻译： 一种包括至少第一管芯和第二管芯的多芯片封装，其中每个管芯包括设置在其上的集成电路（IC）。 第一管芯和第二管芯中的每一个包括与相应的IC耦合的多个接触焊盘。 第一IC上的接触焊盘包括耦合到形成在第一裸片上的第一器件的第一模式焊盘，并且第二IC上的接触焊盘包括耦合到形成在第二裸片上的第二器件的第二模式焊盘。 第一模式焊盘耦合到第一电位并使第一器件以第一模式工作。 第二模式焊盘耦合到第二电位并使第二装置在第二模式下操作。 基于第一和第二管芯的相对位置来选择第一和第二模式。

公开(公告)号：US20080280380A1

公开(公告)日：2008-11-13

申请号：US11577864

申请日：2005-10-24

申请人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank Dimeo, JR.

发明人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank Dimeo, JR.

IPC分类号： H01L21/66 ,  B67D5/06 ,  G01L9/04 ,  B67D5/00

CPC分类号： G01N33/00 ,  F17C11/00 ,  G01F15/063 ,  G01F22/02 ,  G01F23/0076 ,  G01M3/32 ,  G01M3/3236 ,  G06Q10/087 ,  G06Q30/04 ,  G06Q50/04 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/10 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K1/185 ,  H05K3/4602 ,  H05K2203/0165 ,  H05K2203/085 ,  H05K2203/1469 ,  Y02P90/30 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/53183 ,  H01L2224/45099

摘要： A monitoring system (100) for monitoring fluid in a fluid supply vessel (22, 24, 26, 28, 108) during operation including dispensing of fluid from the fluid supply vessel. The monitoring system includes (i) one or more sensors (114, 126) for monitoring a characteristic of the fluid supply vessel or the fluid dispensed therefrom, (ii) a data acquisition module (40, 132, 146) operatively coupled to the one or more sensors to receive monitoring data therefrom and responsively generate an output correlative to the characteristic monitored by the one or more sensors, and (iii) a processor (50, 150) and display (52, 150) operatively coupled with the data acquisition module and arranged to process the output from the data acquisition module and responsively output a graphical representation of fluid in the fluid supply vessel, billing documents, usage reports, and/or resupply requests.

摘要翻译： 一种用于在操作期间监测流体供应容器（22,24,26,28,108）中的流体的监测系统（100），包括从所述流体供应容器分配流体。 监测系统包括（i）用于监测流体供应容器或从其分配的流体的特性的一个或多个传感器（114,126），（ii）可操作地耦合到一个的数据采集模块（40,132,146） 或多个传感器以从其接收监测数据并且响应地产生与由所述一个或多个传感器监测的特性相关的输出，以及（iii）处理器（50,150）和显示器（52,150），其与所述数据采集模块 并且被布置成处理来自数据采集模块的输出并且响应地输出流体供应容器中的流体的图形表示，计费凭证，使用报告和/或再供应请求。

公开(公告)号：US20070152700A1

公开(公告)日：2007-07-05

申请号：US11707408

申请日：2007-02-16

申请人： David Ma ,  Tao Wang ,  James Dietz ,  Bing Ren

发明人： David Ma ,  Tao Wang ,  James Dietz ,  Bing Ren

IPC分类号： G01R31/26

CPC分类号： G01R31/3193 ,  G01R31/31707 ,  G01R31/31718 ,  G01R31/318511 ,  G11C29/006 ,  G11C29/40 ,  G11C2029/1206 ,  G11C2029/2602

摘要： A testing system or method compares read data from one or more dies in a semiconductor wafer with the original data written onto the one or more dies The testing system includes one or more write registers connected to one or more dies on the semiconductor wafer. One or more comparators are connected to the dies and the write registers. The comparator generates a result in response to the original data and the read data.

摘要翻译： 测试系统或方法将半导体晶片中的一个或多个管芯的读取数据与写入一个或多个管芯的原始数据进行比较。测试系统包括连接到半导体晶片上的一个或多个管芯的一个或多个写入寄存器。 一个或多个比较器连接到管芯和写入寄存器。 比较器响应原始数据和读取数据产生结果。

公开(公告)号：US20060266413A1

公开(公告)日：2006-11-30

申请号：US11443380

申请日：2006-05-30

申请人： Michael Wodjenski ,  James Dietz

发明人： Michael Wodjenski ,  James Dietz

IPC分类号： G05D7/00

CPC分类号： F17C13/04 ,  F17C2205/0142 ,  F17C2205/0146 ,  F17C2205/0326 ,  F17C2205/0329 ,  F17C2205/0335 ,  F17C2205/0338 ,  F17C2223/033 ,  F17C2223/035 ,  F17C2223/036 ,  F17C2223/038 ,  F17C2227/0114 ,  F17C2227/044 ,  F17C2270/0518 ,  Y10T137/0396 ,  Y10T137/0419 ,  Y10T137/4259 ,  Y10T137/7043 ,  Y10T137/87877

摘要： A gas cabinet including an enclosure containing at least one gas supply vessel and flow circuitry coupled to the gas supply vessel(s). The flow circuitry is constructed and arranged to flow dispensed gas from an on-stream gas supply vessel to multiple sticks of the flow circuitry, with each of the multiple sticks being joined in gas flow communication to a respective gas-utilizing process unit. The flow circuitry is valved to enable sections of the flow circuitry associated with respective ones of the multiple sticks to be isolated from other sections of the flow circuitry, so that process gas can be flowed to one or more of the sticks, while other sticks are being evacuated and purged, or otherwise are closed to dispensed gas flow therethrough.

公开(公告)号：US20060158209A1

公开(公告)日：2006-07-20

申请号：US11386512

申请日：2006-03-22

申请人： David Ma ,  Tao Wang ,  James Dietz ,  Bing Ren

发明人： David Ma ,  Tao Wang ,  James Dietz ,  Bing Ren

IPC分类号： G01R31/02

CPC分类号： G01R31/3193 ,  G01R31/31707 ,  G01R31/31718 ,  G01R31/318511 ,  G11C29/006 ,  G11C29/40 ,  G11C2029/1206 ,  G11C2029/2602

摘要： A testing system or method compares read data from one or more dies in a semiconductor wafer with the original data written onto the one or more dies The testing system includes one or more write registers connected to one or more dies on the semiconductor wafer. One or more comparators are connected to the dies and the write registers. The comparator generates a result in response to the original data and the read data.