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公开(公告)号：US20070170559A1
公开(公告)日：2007-07-26
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
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公开(公告)号：US08633578B2
公开(公告)日：2014-01-21
申请号：US13196279
申请日：2011-08-02
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.
摘要翻译： 一种具有层压基座的集成电路封装系统，包括：基座封装，包括：叠层基板条，叠层基板条上的集成电路，集成电路上的模制盖和叠层基板条，以及基板封装 ; 在基础包上裸露的裸片; 所述裸模与所述层叠基板条电连接; 并封装了裸芯片和基底封装。
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公开(公告)号：US07563647B2
公开(公告)日：2009-07-21
申请号：US11456532
申请日：2006-07-10
IPC分类号： H01L21/00 , H01R43/00 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07400049B2
公开(公告)日：2008-07-15
申请号：US11307683
申请日：2006-02-16
IPC分类号： H01L23/28
CPC分类号： H01L23/4334 , H01L21/568 , H01L23/3135 , H01L23/49568 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.
摘要翻译： 提供一种集成电路封装系统，其形成来自无引脚引线框架的外部互连，封装散热器和外部互连，将集成电路管芯安装在散热器上，以及封装集成电路管芯，散热器和外部 互连。
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公开(公告)号：US20080017960A1
公开(公告)日：2008-01-24
申请号：US11459325
申请日：2006-07-21
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and the laminate substrate strip, and performing a strip test of the base package; attaching a bare die to the base package; connecting electrically the bare die to the laminate substrate strip; and encapsulating the bare die and the base package.
摘要翻译： 提供了一种具有层叠基底的集成电路封装系统，包括形成基底封装，包括形成层压衬底条，将集成电路安装在层叠衬底条上，在集成电路和叠层衬底条上形成模制盖， 基础包装的剥离试验; 将裸模附接到基底包装; 将裸模电连接到层压基板条上; 并封装裸芯片和基底封装。
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公开(公告)号：US07274089B2
公开(公告)日：2007-09-25
申请号：US11162682
申请日：2005-09-19
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L21/4828 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/29007 , H01L2224/29191 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/2939 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2224/8385 , H01L2924/00014 , H01L2924/01047 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/0715 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad.
摘要翻译： 一种集成电路封装系统，包括集成电路管芯和具有沟槽管芯焊盘的引线框架。 集成电路管芯安装到沟槽焊盘上。
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公开(公告)号：US07977579B2
公开(公告)日：2011-07-12
申请号：US11278070
申请日：2006-03-30
IPC分类号： H05K1/16
CPC分类号： H05K1/183 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L23/49822 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06589 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/141 , H05K3/3436 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , H05K2201/10689 , Y10T29/4913 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
摘要翻译： 一种集成电路封装系统，包括形成多层衬底，以及在多层衬底上附着多个集成电路。
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18.发明授权Integrated circuit package system with lead structures including a dummy tie bar 有权具有引线结构的集成电路封装系统，包括虚拟连接条公开(公告)号：US07936053B2
公开(公告)日：2011-05-03
申请号：US11558387
申请日：2006-11-09
IPC分类号： H01L23/495
CPC分类号： H01L23/562 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures.
摘要翻译： 集成电路封装系统包括形成引线结构，该引线结构包括具有与集成电路封装系统的外边缘交叉的虚拟连接杆，并将集成电路管芯连接到引线结构。
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公开(公告)号：US07541221B2
公开(公告)日：2009-06-02
申请号：US11307386
申请日：2006-02-04
CPC分类号： H01L23/49548 , H01L23/49579 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/1601 , H01L2224/81141 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15151
摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。
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公开(公告)号：US07365417B2
公开(公告)日：2008-04-29
申请号：US11306693
申请日：2006-01-06
IPC分类号： H01L23/02
CPC分类号： H01L23/3107 , H01L23/49513 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27013 , H01L2224/2919 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83194 , H01L2224/83385 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the die paddle.
摘要翻译： 提供了一种集成电路封装系统，其将膜连接到管芯焊盘，向膜施加粘合剂，以及将集成电路管芯粘合到粘合剂和膜上并附接到管芯焊盘。
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