-
11.发明授权Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip 有权包括模塑复合层的半导体器件与半导体芯片的表面形成公共平面公开(公告)号：US08330273B2
公开(公告)日：2012-12-11
申请号：US12904628
申请日：2010-10-14
申请人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
发明人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2224/04105 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/12105 , H01L2224/16 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/05099
摘要： A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.
摘要翻译： 公开了半导体器件和方法。 在一个实施例中，该方法包括将第一半导体放置在导电载体上。 第一半导体被模塑料覆盖。 在模塑料中形成通孔。 第一种材料沉积在通孔中。
-
公开(公告)号：US20110024915A1
公开(公告)日：2011-02-03
申请号：US12904628
申请日：2010-10-14
申请人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
发明人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
IPC分类号： H01L23/498
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2224/04105 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/12105 , H01L2224/16 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/05099
摘要： A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.
摘要翻译： 公开了半导体器件和方法。 在一个实施例中，该方法包括将第一半导体放置在导电载体上。 第一半导体被模塑料覆盖。 在模塑料中形成通孔。 第一种材料沉积在通孔中。
-
13.发明授权Semiconductor component with plastic housing, and process for producing the same 有权具有塑料外壳的半导体元件及其制造方法公开(公告)号：US07327023B2
公开(公告)日：2008-02-05
申请号：US11246545
申请日：2005-10-11
申请人： Ulrich Bachmaier , Michael Bauer , Robert-Christian Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人： Ulrich Bachmaier , Michael Bauer , Robert-Christian Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
CPC分类号： H01L25/50 , H01L23/3128 , H01L23/49811 , H01L24/48 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.
摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。
-
公开(公告)号：US20070278639A1
公开(公告)日：2007-12-06
申请号：US11572873
申请日：2005-07-21
申请人： Michael Bauer , Ulrich Bachmaier , Robert-Christian Hagen , Jens Pohl , Rainer Steiner , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人： Michael Bauer , Ulrich Bachmaier , Robert-Christian Hagen , Jens Pohl , Rainer Steiner , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
CPC分类号： H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/0102 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/3011 , H05K1/181 , H05K2201/10515 , H05K2201/1053 , H05K2201/10734 , H05K2201/10924 , Y02P70/611 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.
摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，该布线基板一方面通过布线基板与布线基板的下侧的外部触点电连接，另一方面与布线基板 布线基板的边缘区域的区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。
-
公开(公告)号：US20080284035A1
公开(公告)日：2008-11-20
申请号：US11749293
申请日：2007-05-16
申请人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
发明人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2224/04105 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/12105 , H01L2224/16 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/05099
摘要： A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.
摘要翻译： 公开了半导体器件和方法。 在一个实施例中，该方法包括将第一半导体放置在导电载体上。 第一半导体被模塑料覆盖。 在模塑料中形成通孔。 第一种材料沉积在通孔中。
-
16.发明申请Semiconductor Component with Plastic Housing, and Process for Producing the Same 有权具有塑料外壳的半导体元件及其制造方法公开(公告)号：US20080050907A1
公开(公告)日：2008-02-28
申请号：US11925117
申请日：2007-10-26
申请人： Ulrich Bachmaier , Michael Bauer , Robert Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人： Ulrich Bachmaier , Michael Bauer , Robert Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
IPC分类号： H01L21/44
CPC分类号： H01L25/50 , H01L23/3128 , H01L23/49811 , H01L24/48 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.
摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。
-
17.发明申请Semiconductor component with plastic housing, and process for producing the same 有权具有塑料外壳的半导体元件及其制造方法公开(公告)号：US20060076667A1
公开(公告)日：2006-04-13
申请号：US11246545
申请日：2005-10-11
申请人： Ulrich Bachmaier , Michael Bauer , Robert-Christian Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
发明人： Ulrich Bachmaier , Michael Bauer , Robert-Christian Hagen , Jens Pohl , Rainer Steiner , Peter Strobel , Hermann Vilsmeier , Holger Woerner , Bernhard Zuhr
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L23/3128 , H01L23/49811 , H01L24/48 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.
摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。
-
公开(公告)号：US20090160053A1
公开(公告)日：2009-06-25
申请号：US11959995
申请日：2007-12-19
申请人： Thorsten Meyer , Gerald Ofner , Rainer Steiner
发明人： Thorsten Meyer , Gerald Ofner , Rainer Steiner
CPC分类号： H01L24/11 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05647 , H01L2224/1134 , H01L2224/12105 , H01L2224/131 , H01L2224/16 , H01L2224/20 , H01L2224/92 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/18162 , H01L2224/96 , H01L2224/82 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： A method of manufacturing a semiconductor device is disclosed. One embodiment provides a carrier. Semiconductor chips are placed over the carrier. The semiconductor chips include contact elements. A polymer material is applied over the semiconductor chips and the carrier. The polymer material is removed until the contact elements are exposed. The carrier is removed from the semiconductor chips.
摘要翻译： 公开了制造半导体器件的方法。 一个实施例提供一种载体。 半导体芯片放置在载体上。 半导体芯片包括接触元件。 将聚合物材料涂覆在半导体芯片和载体上。 去除聚合物材料直到接触元件露出。 载体从半导体芯片上去除。
-
公开(公告)号：US20070018308A1
公开(公告)日：2007-01-25
申请号：US11374419
申请日：2006-03-14
申请人： Albert Schott , Bernd Rakow , Bernd Waidhas , Juergen Walter , Christian Birzer , Rainer Steiner , Bernhard Schaetzler , Thomas Ort , Gerald Bock
发明人： Albert Schott , Bernd Rakow , Bernd Waidhas , Juergen Walter , Christian Birzer , Rainer Steiner , Bernhard Schaetzler , Thomas Ort , Gerald Bock
IPC分类号： H01L23/12
CPC分类号： B23K3/0623 , B23K2101/40 , H01L23/49816 , H01L23/49866 , H01L24/48 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/3436 , H05K3/3463 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component includes a substrate with outer contact areas including copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.
摘要翻译： 电子部件包括具有包括铜的外部接触区域的基板。 无铅焊料凸点设置在电子部件的外部接触区域上。 电子配置包括电子部件和印刷电路板。 电子元件通过无铅焊接电气连接安装在印刷电路板上。
-
公开(公告)号：US20110291274A1
公开(公告)日：2011-12-01
申请号：US13205356
申请日：2011-08-08
申请人： Thorsten Meyer , Gerald Ofner , Rainer Steiner
发明人： Thorsten Meyer , Gerald Ofner , Rainer Steiner
IPC分类号： H01L23/488 , H01L23/48
CPC分类号： H01L24/11 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05647 , H01L2224/1134 , H01L2224/12105 , H01L2224/131 , H01L2224/16 , H01L2224/20 , H01L2224/92 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/18162 , H01L2224/96 , H01L2224/82 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： A method of manufacturing a semiconductor device is disclosed. One embodiment provides a carrier. Semiconductor chips are placed over the carrier. The semiconductor chips include contact elements. A polymer material is applied over the semiconductor chips and the carrier. The polymer material is removed until the contact elements are exposed. The carrier is removed from the semiconductor chips.
摘要翻译： 公开了制造半导体器件的方法。 一个实施例提供一种载体。 半导体芯片放置在载体上。 半导体芯片包括接触元件。 将聚合物材料涂覆在半导体芯片和载体上。 去除聚合物材料直到接触元件露出。 载体从半导体芯片上去除。
-
-
-
-
-
-
-
-
-
搜索结果
26 条记录 (耗时 0.025 秒)
