Capacitor for semiconductor device, manufacturing method thereof, and electronic device employing the same
    12.
    发明授权
    Capacitor for semiconductor device, manufacturing method thereof, and electronic device employing the same 失效
    半导体装置用电容器及其制造方法以及使用该半导体装置的电子装置

    公开(公告)号:US07105401B2

    公开(公告)日:2006-09-12

    申请号:US10930953

    申请日:2004-09-01

    IPC分类号: H01L21/8242

    摘要: A capacitor for use in a semiconductor device, a method of fabricating the capacitor, and an electronic device adopting the capacitor, wherein the capacitor includes upper and lower electrodes, each formed of a platinum group metal; a thin dielectric layer disposed between the upper and lower electrodes; and a buffer layer disposed between the lower electrode and the thin dielectric layer, the buffer layer including a metal oxide of Group 3, 4, or 13. In an embodiment, the method of fabricating includes absorbing CO on a surface of a lower electrode of a platinum group metal, placing the lower electrode under a reducing atmosphere to produce a lattice oxygen, using the lattice oxygen to form a thin dielectric layer by performing an ALD process using a precursor for the thin dielectric layer, and forming an upper electrode of a platinum group metal on the thin dielectric layer.

    摘要翻译: 一种用于半导体器件的电容器,制造该电容器的方法以及采用该电容器的电子器件,其中该电容器包括由铂族金属形成的上下电极; 设置在上电极和下电极之间的薄介电层; 以及设置在下电极和薄电介质层之间的缓冲层,缓冲层包括第3,4或13族的金属氧化物。在一个实施方案中,制造方法包括在下电极的表面上吸收CO 铂族金属,将下电极置于还原气氛下以产生晶格氧,使用晶格氧通过使用用于薄介电层的前体进行ALD工艺形成薄介电层,并形成上电极 铂族金属在薄介电层上。

    Amorphous high-k thin film and manufacturing method thereof
    20.
    发明申请
    Amorphous high-k thin film and manufacturing method thereof 失效
    非晶高k薄膜及其制造方法

    公开(公告)号:US20060180838A1

    公开(公告)日:2006-08-17

    申请号:US11354013

    申请日:2006-02-15

    IPC分类号: H01L29/94

    摘要: An amorphous high-k thin film for a semiconductor device and a manufacturing method thereof are provided. The amorphous high-k thin film includes Bi, Ti, Al, and O. Since a BTAO based amorphous dielectric thin film is used as a dielectric material of a DRAM capacitor, a dielectric constant is more than 25, and an increase of a leakage current caused in reducing a physical thickness of the dielectric thin film can be prevented. Accordingly, it is very useful for the integration of the semiconductor device.

    摘要翻译: 提供了一种用于半导体器件的非晶高k薄膜及其制造方法。 无定形高k薄膜包括Bi,Ti,Al和O.由于使用基于BTAO的非晶介质薄膜作为DRAM电容器的介电材料,介电常数大于25,并且泄漏增加 可以防止在减小电介质薄膜的物理厚度时引起的电流。 因此,对于半导体器件的集成是非常有用的。