公开(公告)号：US07214563B2

公开(公告)日：2007-05-08

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/44

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

摘要翻译： 一种将两个或更多个IC芯片安装在基座上的IC芯片安装方法，包括：通过在其表面上安装带子，准备晶片，该晶片具有安装在基座上的安装表面，并且通过 在离开胶带的同时通过切割将晶片分成IC芯片; 将晶片定位成使得与基座相对的安装表面面向基座的方向面对基座; 在晶片沿着晶片沿指定的一维方向进给的同时沿着基座二维移动的同时，将晶片上的IC芯片依次按压在基板上并临时固定IC芯片; 并且通过间歇加热和加压将临时固定在基座上的IC芯片固定在基座上。

公开(公告)号：US20060161787A1

公开(公告)日：2006-07-20

申请号：US11117751

申请日：2005-04-29

申请人： Shunichi Kikuchi

发明人： Shunichi Kikuchi

IPC分类号： H04K1/00

CPC分类号： G07C9/00111

摘要： An article that is worn or carried by a living being includes an authentication key for identifying the living being or acquiring information about the living being. The authentication key is formed on a surface of the article by processing the article. An authenticating apparatus performs authentication whether an authority to make access to information is present, and includes an authentication key information reading unit and authenticating unit. The authentication key information reading unit reads authentication key information stored in the authentication key. The authenticating unit performs the authentication to check whether an authority to make access to the information about the living being is present based on the read authentication key information.

摘要翻译： 由生活穿着或携带的物品包括用于识别生活的认证密钥或获得有关生活的信息。 认证密钥通过处理物品形成在物品的表面上。 验证装置执行认证是否存在访问信息的权限，并且包括认证密钥信息读取单元和认证单元。 认证密钥信息读取单元读取认证密钥中存储的认证密钥信息。 认证单元基于读取的认证密钥信息来执行认证以检查是否存在访问有关生活的信息的权限。

公开(公告)号：US06891247B2

公开(公告)日：2005-05-10

申请号：US10177672

申请日：2002-06-24

申请人： Shunichi Kikuchi ,  Misao Umematsu

发明人： Shunichi Kikuchi ,  Misao Umematsu

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L23/64 ,  H01L29/00

CPC分类号： H01L23/642 ,  H01L23/481 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  Y10S257/924 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.

摘要翻译： 半导体器件包括半导体裸芯片和具有薄膜结构电容器的电绝缘板部件。 半导体裸芯片的背面具有电源端子和接地端子。 半导体裸芯片通过倒装芯片接合安装在电路板上。 板构件包括板和设置在板上的薄膜结构电容器。 电容器具有对应于其上的半导体裸芯片的电源端子和接地端子的端子。 提供电容器的电路板部件的一侧与半导体裸芯片的背面接合。 电容器的端子电连接到半导体裸芯片的电源端子和接地端子。

公开(公告)号：US5126919A

公开(公告)日：1992-06-30

申请号：US261904

申请日：1988-10-25

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G11B11/10586 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属 用于在转印板和电路部件之间建立热接触。

公开(公告)号：US4712158A

公开(公告)日：1987-12-08

申请号：US843947

申请日：1986-03-26

申请人： Shunichi Kikuchi ,  Haruyuki Matsunaga ,  Hideo Katsumi ,  Koji Katsuyama

发明人： Shunichi Kikuchi ,  Haruyuki Matsunaga ,  Hideo Katsumi ,  Koji Katsuyama

IPC分类号： H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  F28F3/12 ,  H01L23/4332 ,  H01L23/473 ,  F28F2250/04 ,  H01L2924/0002

摘要： A cooling system for electronic circuit components mounted on a printed circuit board, includes a cooling plate having a coolant passage, thermal contacts arranged on the cooling plate to be in resilient contact with the surfaces of the electronic components, which are cooled via the thermal contacts by liquid coolant flowing through the coolant passage. The cooling plate has one or more shortcut passages, the cross-sectional area of which is smaller than that of the coolant passage, to mutually connect predetermined portions of the coolant passage. The liquid coolant can be discharged from the cooling plate via the shortcut passage.

摘要翻译： 安装在印刷电路板上的用于电子电路部件的冷却系统包括具有冷却剂通道的冷却板，布置在冷却板上的热接触件，以与电子部件的表面弹性接触，冷却板通过热触头 液体冷却剂流过冷却剂通道。 冷却板具有一个或多个快速通道，其横截面积小于冷却剂通道的快速通道，以相互连接冷却剂通道的预定部分。 液体冷却剂可以通过快捷通道从冷却板排出。

公开(公告)号：US20070139206A1

公开(公告)日：2007-06-21

申请号：US11704321

申请日：2007-02-09

申请人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

发明人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

IPC分类号： G08B13/14 ,  B31B1/60 ,  H01R43/00

CPC分类号： G06K19/0773 ,  B31D1/028 ,  G06K19/07749 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1062 ,  H01L2224/0401

摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。

公开(公告)号：US20070020800A1

公开(公告)日：2007-01-25

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/00

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

公开(公告)号：US20060145867A1

公开(公告)日：2006-07-06

申请号：US11085491

申请日：2005-03-22

申请人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

发明人： Shunichi Kikuchi ,  Masumi Suzuki ,  Michimasa Aoki

IPC分类号： G08B13/14 ,  G06K19/06

CPC分类号： G06K19/0773 ,  B31D1/028 ,  G06K19/07749 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1062 ,  H01L2224/0401

摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。

公开(公告)号：US5586006A

公开(公告)日：1996-12-17

申请号：US573577

申请日：1995-12-15

申请人： Kiyotaka Seyama ,  Shunichi Kikuchi ,  Makoto Sumiyoshi ,  Naoki Yasuda ,  Minoru Hirano ,  Hitoshi Nori

发明人： Kiyotaka Seyama ,  Shunichi Kikuchi ,  Makoto Sumiyoshi ,  Naoki Yasuda ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/065 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H05K7/20

CPC分类号： H01L25/0657 ,  H01L23/49811 ,  H05K1/141 ,  H01L2224/16 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K2201/0317 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/467 ,  Y02P70/611

摘要： A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

摘要翻译： 多芯片模块包括基板，薄膜多层电路板，其设置在基板的第一表面上，并且具有层叠绝缘层和布线导体的多层结构，安装有电路元件 在薄膜多层电路板的主表面上，以及端子，其安装在薄膜多层电路板的主表面上，并将布线导体电连接到形成在其上的电路板上的电路 安装了多芯片模块。

公开(公告)号：US4920574A

公开(公告)日：1990-04-24

申请号：US79876

申请日：1987-07-30

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  H01L23/4332 ,  H01L2924/0002

摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.

摘要翻译： 一种冷却系统，包括冷却模块，该冷却模块具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏压，以将由部件散发的热量传递给冷却剂。 在传热板上提供一系列突起，用于在冷却剂流中产生湍流。 或者，圆柱形管板安装在传热板上，用于增加与冷却剂流接触的表面积。