公开(公告)号：US10230084B2

公开(公告)日：2019-03-12

申请号：US14042187

申请日：2013-09-30

Applicant: LG CHEM, LTD.

Inventor： Se Ra Kim ,  Suk Ky Chang ,  Hyo Sook Joo ,  Yoon Tae Hwang ,  Se Woo Yang ,  Joon Hyung Kim ,  Sung Jong Kim

IPC: H01M2/14 ,  H01M10/04 ,  H01M2/10 ,  H01M2/34 ,  H01M2/16 ,  C09J7/22

Abstract: A swelling tape for filling a gap, a method of manufacturing the swelling tape for filling a gap, a method of filling a gap, an electrode assembly and a secondary battery are provided. For example, the swelling tape can be applied inside a gap in which a fluid exists so as to fill the gap by becoming a 3D form, and can be useful at anchoring a subject in which the gap is formed, as necessary.

公开(公告)号：US10103352B2

公开(公告)日：2018-10-16

申请号：US14892929

申请日：2014-05-21

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Seung Min Lee ,  Hyun Suk Kim ,  Suk Ky Chang ,  Jung Ok Moon

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

公开(公告)号：US10050204B2

公开(公告)日：2018-08-14

申请号：US14762399

申请日：2014-07-21

Applicant: LG CHEM, LTD.

Inventor： Seung Min Lee ,  Suk Ky Chang ,  Min Soo Park ,  Hyun Jee Yoo ,  Jung Sup Shim ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Suk Kim ,  Jung Ok Moon

IPC: C08L23/22 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  C09J133/06 ,  C09J123/22 ,  C08L101/00 ,  C08F220/18

Abstract: An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.

公开(公告)号：US10023772B2

公开(公告)日：2018-07-17

申请号：US15664002

申请日：2017-07-31

Applicant: LG Chem, Ltd.

Inventor： Yong Su Park ,  Se Woo Yang ,  Suk Ky Chang ,  Min Soo Park ,  Eun Suk Park

IPC: C09J133/06 ,  C09J4/00 ,  C09J175/04 ,  G02B1/04 ,  G02F1/1335 ,  C09J7/38 ,  G02B5/30

Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive optical laminate, a pressure-sensitive adhesive polarizing plate and a display device. The pressure-sensitive adhesive composition offers a pressure-sensitive adhesive that has excellent durability and processability in manufacturing due to increased hardness even when the pressure-sensitive adhesive layer is formed thinner than a typical adhesive composition, and that can prevent a pressure mark and leakage of the pressure-sensitive adhesive, as well as a bending problem generated when applied on an optical member such as a polarizing plate, etc.

公开(公告)号：US09765232B2

公开(公告)日：2017-09-19

申请号：US13966796

申请日：2013-08-14

Applicant: LG CHEM, LTD.

Inventor： Hyo Sook Joo ,  Jung Sup Shim ,  Se-Ra Kim ,  Suk Ky Chang

IPC: C09D133/08 ,  C09J7/00 ,  C09J133/08 ,  C08F20/10 ,  C08F20/18 ,  C09D4/00 ,  C08F220/18 ,  C09J7/02 ,  C09J133/10 ,  C08F220/32

CPC classification number: C09D133/08 ,  C08F20/10 ,  C08F20/18 ,  C08F220/18 ,  C08F2220/325 ,  C09D4/00 ,  C09D4/06 ,  C09J7/24 ,  C09J7/385 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/606 ,  C09J2433/006 ,  Y10T428/2809 ,  C08F265/06

Abstract: Provided are a solventless composition and a method of preparing the same. Here, the solventless composition may effectively manufacture a film that is uniform without substantial deviation in thickness and has a large but uniform thickness or an excellent physical property such as thermal resistance during manufacture of a film. In addition, the composition of the present invention does not induce contamination during the manufacture of the film. Furthermore, by preventing gelation or phase separation of components of the composition, the composition capable of manufacturing a substrate film having an excellent physical property such as optical transparency, thermal resistance and dimension stability may be provided.

公开(公告)号：US09638952B2

公开(公告)日：2017-05-02

申请号：US14073620

申请日：2013-11-06

Applicant: LG CHEM, LTD.

Inventor： Ki Seok Jang ,  Suk Ky Chang ,  Min Soo Park ,  Se Woo Yang

IPC: G02F1/1335 ,  C09J133/06 ,  C09J133/02 ,  C09J133/08

CPC classification number: G02F1/133528 ,  C08L2312/00 ,  C09J133/02 ,  C09J133/08 ,  G02F2202/28 ,  Y10T428/1068 ,  Y10T428/1073 ,  Y10T428/1077

Abstract: The present invention relates to a pressure sensitive adhesive composition, a polarizer and a liquid crystal display device. The present invention may provide a pressure sensitive adhesive which can have excellent stress relaxation characteristic to effectively inhibit light leakage by dimension change of optical films such as polarizing plates. In addition, a pressure sensitive adhesive having excellent physical properties such as adhesion durability and workability may be provided.

公开(公告)号：US09562173B2

公开(公告)日：2017-02-07

申请号：US13893933

申请日：2013-08-16

Applicant: LG CHEM, LTD.

Inventor： Jong Rok Jeon ,  Se Woo Yang ,  Suk Ky Chang

IPC: B24D11/02 ,  C09J7/02 ,  B24B37/22 ,  C09J11/08

CPC classification number: C09J7/0207 ,  B24B37/22 ,  B24D11/02 ,  C09J7/385 ,  C09J11/08 ,  Y10T428/249983

Abstract: There is provided a preparation method for a porous pressure sensitive adhesive article, a porous pressure sensitive adhesive article, and an abrasive pad. According to an example of the present application, as a porous pressure sensitive adhesive article including a pressure sensitive adhesive layer formed on a porous article, an article having excellent resistance to an external shear strength and to peeling can be provided. Further, according to the above method, the porous article can be attached firmly to a large-area adherent. In an example, the porous article may be an abrasive pad.

Abstract translation: 提供了一种用于多孔压敏粘合剂制品，多孔压敏粘合剂制品和研磨垫的制备方法。 根据本申请的一个实施例，作为多孔压敏粘合剂制品，包括在多孔制品上形成的压敏粘合剂层，可以提供具有优异的抗外部剪切强度和剥离性的制品。 此外，根据上述方法，多孔制品可以牢固地附着在大面积粘附剂上。 在一个实例中，多孔制品可以是研磨垫。

公开(公告)号：US09236303B2

公开(公告)日：2016-01-12

申请号：US13967060

申请日：2013-08-14

Applicant: LG CHEM, LTD.

Inventor： Hyo Sook Joo ,  Se-Ra Kim ,  Jung Sup Shim ,  Suk Ky Chang

IPC: H01L21/00 ,  H01L21/78 ,  C08F8/10 ,  C09J133/06 ,  C08F20/18 ,  H01L21/683 ,  C09J7/02 ,  B29C39/00 ,  C08G18/62 ,  C08G18/81 ,  C09J175/16

CPC classification number: H01L21/78 ,  B29C39/006 ,  C08F8/10 ,  C08F20/18 ,  C08G18/6229 ,  C08G18/8116 ,  C09J7/24 ,  C09J133/066 ,  C09J175/16 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2809 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F220/20 ,  C08F220/36

Abstract: Provided are a substrate film and a method of manufacturing the substrate film. The substrate film may have excellent thermal resistance and dimensional stability, has excellent stress relaxation to prevent damage of a wafer caused by remaining stress, inhibits damage to or flying-off of the wafer caused by application of a non-uniform pressure during the processing of the wafer, and has excellent cuttability. Accordingly, the substrate film of the present invention can be effectively used as a processing sheet in a process of processing various kinds of wafers including dicing, back-grinding or picking-up.

Abstract translation: 本发明提供一种基板膜及其制造方法。 基板膜可以具有优异的耐热性和尺寸稳定性，具有优异的应力松弛，以防止由于剩余应力而导致的晶片损坏，抑制在加工期间施加不均匀压力导致的晶片的损坏或飞落 晶片，并且具有优异的可切割性。 因此，本发明的基板薄膜可以在加工各种晶片的工序中有效地用作加工薄板，其中包括切割，后研磨或拾取。

公开(公告)号：US20150270524A1

公开(公告)日：2015-09-24

申请号：US14435779

申请日：2013-11-18

Applicant: LG CHEM, LTD.

Inventor： Ji Young Hwang ,  Byung Kyu Jung ,  Yoon Tae Hwang ,  Se Woo Yang ,  Suk Ky Chang ,  Sung Jong Kim ,  Min Soo Park ,  Cha Hun Ku

IPC: H01M2/16 ,  H01M6/02 ,  H01M2/14 ,  H01M10/0587 ,  H01M10/04 ,  H01M6/16 ,  H01M10/0569

CPC classification number: H01M2/1686 ,  C09J7/22 ,  C09J7/38 ,  C09J7/401 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/33 ,  C09J2433/00 ,  H01M2/14 ,  H01M2/145 ,  H01M2/1653 ,  H01M6/02 ,  H01M6/164 ,  H01M10/0431 ,  H01M10/0569 ,  H01M10/0587 ,  H01M2300/0028

Abstract: The present application relates to a swelling tape and a method of filling a gap. The swelling tape is, for example, applied in gaps in which a fluid is present and deformed into a three-dimensional shape to fill the gaps and fix in place objects separated by gaps as needed.

Abstract translation: 本申请涉及膨胀带和填充间隙的方法。 膨胀带例如应用在存在流体的间隙中，并且变形为三维形状以填充间隙，并且根据需要将由间隙分离的物体固定在适当位置。

公开(公告)号：US09105648B2

公开(公告)日：2015-08-11

申请号：US14289212

申请日：2014-05-28

Applicant: LG Chem, Ltd.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L23/00 ,  H01L51/52 ,  H05B33/04 ,  H01L51/56 ,  C09J7/00 ,  C09J7/02 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C09J163/00 ,  C08K3/16

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract translation: 提供了一种粘合剂，以及使用其的封装产品和封装有机电子器件（OED）的方法。 粘合膜用于包封OED并且包括可固化树脂和吸湿剂，并且粘合剂包括在封装OED时与OED接触的第一区域和不与OED接触的第二区域。 此外，基于粘合剂中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。