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    SEMICONDUCTOR DEVICE, DISPLAY PANEL, AND METHOD FOR MANUFACTURING DISPLAY PANEL
    11.
    发明申请
    SEMICONDUCTOR DEVICE, DISPLAY PANEL, AND METHOD FOR MANUFACTURING DISPLAY PANEL 审中-公开

    公开(公告)号：US20190115328A1

    公开(公告)日：2019-04-18

    申请号：US16083134

    申请日：2017-03-07

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sang Youl LEE ,  Chung Song KIM ,  Ji Hyung MOON ,  Sun Woo PARK ,  June O SONG

    IPC: H01L25/13 ,  H01L33/54 ,  H01L33/20 ,  H01L33/62 ,  H01L33/00

    Abstract: The semiconductor element according to an embodiment comprises: a light-emitting structure comprising a p-type semiconductor layer, an active layer disposed under the p-type semiconductor layer, and an n-type semiconductor layer disposed under the active layer; a protective layer disposed on the side surface and upper surface of the light-emitting structure; a p-type contact layer disposed over the p-type semiconductor layer; and an n-type contact layer disposed under the n-type semiconductor layer, wherein: the width of the lower surface of the n-type semiconductor layer is provided greater than that of the lower surface of the p-type semiconductor layer; the width of the upper surface of the n-type contact layer is provided greater than that of the upper surface of the n-type semiconductor layer; and the angle between the lower surface of the n-type semiconductor layer and the side surface of the light-emitting structure may be 30-80 degrees.

    LIGHT EMITTING DEVICE PACKAGE
    12.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开

    公开(公告)号：US20190027641A1

    公开(公告)日：2019-01-24

    申请号：US16041081

    申请日：2018-07-20

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Tae Sung LEE ,  June O SONG ,  Ki Seok KIM ,  Young Shin KIM ,  Chang Man LIM

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.

    SEMICONDUCTOR DEVICE HAVING PLURALITY OF BONDING LAYERS AND METHOD OF MANUFACTURING THE SAME
    14.
    发明申请
    SEMICONDUCTOR DEVICE HAVING PLURALITY OF BONDING LAYERS AND METHOD OF MANUFACTURING THE SAME 有权
    具有多层结合层的半导体器件及其制造方法

    公开(公告)号：US20130307123A1

    公开(公告)日：2013-11-21

    申请号：US13923745

    申请日：2013-06-21

    Applicant: LG INNOTEK CO., LTD.

    Inventor： June O SONG

    IPC: H01L29/06

    CPC classification number: H01L29/0657 ,  H01L33/0079 ,  H01L33/405 ,  H01L33/44

    Abstract: Provided is a semiconductor device. The semiconductor device comprises a support substrate; a bonding layer on the support substrate; and a plurality of semiconductor layers on the bonding layer, wherein the bonding layer includes a first bonding layer between the support substrate and the plurality of semiconductor layers and a second bonding layer between the first bonding layer and the plurality of semiconductor layers, wherein an at least one of the first and second bonding layers includes a multi layers, wherein the first and second bonding layers include a same material from each other, wherein the first and second bonding layers includes a different material from the plurality of semiconductor layers.

    Abstract translation: 提供一种半导体器件。 半导体器件包括支撑衬底; 在支撑基板上的结合层; 以及所述接合层上的多个半导体层，其中所述接合层包括在所述支撑基板和所述多个半导体层之间的第一接合层和所述第一接合层与所述多个半导体层之间的第二接合层，其中， 第一和第二结合层中的至少一个包括多层，其中第一和第二结合层包括彼此相同的材料，其中第一和第二结合层包括与多个半导体层不同的材料。

    LIGHT EMITTING DEVICE PACKAGE
    15.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 有权

    公开(公告)号：US20210193877A1

    公开(公告)日：2021-06-24

    申请号：US16756952

    申请日：2018-10-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： June O SONG ,  Ki Seok KIM ,  Won Jung KIM

    IPC: H01L33/48 ,  H01L33/62

    Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively. According to an embodiment, the first and second frames may include first and second metal layers having third and fourth openings passing through upper and lower surfaces around the first and second openings, respectively, and widths of the first and second bonding parts in a horizontal direction may be greater than widths of upper surfaces of the first and second openings in the horizontal direction.

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING SAME
    16.
    发明申请
    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING SAME 有权

    公开(公告)号：US20210098649A1

    公开(公告)日：2021-04-01

    申请号：US16500216

    申请日：2018-04-03

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Nam PARK ,  June O SONG ,  Myeong Soo KIM ,  Seong Jun PARK

    IPC: H01L33/08 ,  H01L33/14 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62

    Abstract: Disclosed in an embodiment are a semiconductor device and a semiconductor device package including the same, the semiconductor device comprising: a semiconductor structure including a first light emitting unit and a second light emitting unit; a first electrode for electrically connecting a first conductive type semiconductor layer of the first light emitting unit with a first conductive type semiconductor layer of the second light emitting unit; and a second electrode for electrically connecting a second conductive type semiconductor layer of the first light emitting unit with a second conductive type semiconductor layer of the second light emitting unit, wherein: the first electrode includes a first pad arranged on the first light emitting unit, a first branch electrode arranged on the first light emitting unit, and a first extension electrode arranged on the second light emitting unit; the second electrode includes a second pad arranged on the second light emitting unit, a second branch electrode arranged on the second light emitting unit, and a second extension electrode arranged on the first light emitting unit; the semiconductor structure includes a first spacing section which extends in a first direction and comparts the first light emitting unit and the second light emitting unit; and the first pad and the second pad are not overlapped in the first direction and a second direction which is perpendicular to the first direction.

    SEMICONDUCTOR DEVICE PACKAGE
    17.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE 审中-公开

    公开(公告)号：US20200013932A1

    公开(公告)日：2020-01-09

    申请号：US16480485

    申请日：2018-01-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ji Hyung MOON ,  Kyoung Un KIM ,  Sun Woo PARK ,  June O SONG ,  Sun Woo OH ,  Sang Jun LEE ,  Hwan Hee JEONG ,  Myung Ho HAN

    IPC: H01L33/50 ,  H01L33/56 ,  H01L33/32 ,  H01L33/10 ,  H01L33/60 ,  H01L33/62 ,  H01L27/15

    Abstract: A semiconductor device package according to the present invention comprises: a semiconductor device including a substrate, a light-emitting structure, and a first pad and second pad electrically connected to the light-emitting structure; a wavelength converting unit disposed to surround the upper surface and side surfaces of the semiconductor device; and a light control unit disposed on the wavelength converting unit, wherein the wavelength converting unit may include an upper surface spaced a first spacing interval apart in a vertical direction from the semiconductor device, and a side surface spaced a second spacing interval apart in a horizontal direction from the semiconductor device. The present invention relates to a semiconductor device package and a light source module. A semiconductor device package according to the present invention may include a semiconductor device for emitting light, a wavelength converting unit, and a light control unit and may emit white light in directions of four side surfaces surrounding the wavelength converting unit and in an upward direction of the light control unit. A wavelength converting unit according to the present invention may be disposed at the upper surface of a semiconductor device and four side surfaces surrounding the semiconductor device, receive light emitted from the semiconductor device and incident thereto and diffuse the received light, convert the wavelength of light incident thereto and provide the converted light, and emit white light in four side surface directions and in an upward direction. A light control unit according to the present invention may be disposed on the upper surface of a wavelength converting unit, reflect a part of white light incident thereon from the wavelength converting unit, and transmit a part of the white light.

    LIGHT EMITTING DEVICE PACKAGE
    18.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开

    公开(公告)号：US20190334066A1

    公开(公告)日：2019-10-31

    申请号：US16068042

    申请日：2017-09-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Chang Man LIM ,  Ki Seok KIM ,  June O SONG

    IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L23/00

    Abstract: A light emitting device package including a first frame having first and second through holes; a light emitting device including first and second electrode pads; a first resin disposed between the first frame and the light emitting device; and a conductive material disposed in the first through hole and the second through hole. Further, the first electrode pad of the light emitting device overlaps with the first through hole and the second electrode pad of the light emitting device overlaps with the second through hole; the first electrode pad and the second electrode pad are spaced apart from each other; and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface contact the first resin.

    LIGHT EMITTING DEVICE PACKAGE
    19.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开

    公开(公告)号：US20190074410A1

    公开(公告)日：2019-03-07

    申请号：US15766717

    申请日：2017-09-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Chang Man LIM ,  Ki Seok KIM ,  Won Jung KIM ,  June O SONG

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/52

    Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.

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