公开(公告)号：US06245595B1

公开(公告)日：2001-06-12

申请号：US09359074

申请日：1999-07-22

申请人： Luu Nguyen ,  Hem P. Takiar ,  Ethan Warner ,  Shahram Mostafazadeh ,  Joseph O. Smith

发明人： Luu Nguyen ,  Hem P. Takiar ,  Ethan Warner ,  Shahram Mostafazadeh ,  Joseph O. Smith

IPC分类号： H01L2144

CPC分类号： H01L21/67126 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/94 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method and apparatus for forming a layer of underfill encapsulant on an integrated circuit located on a wafer are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. Most of the solder balls have been flattened in order to provide an enlarged solder wetting area. A layer of underfill encapsulant is injected onto the integrated circuit under pressure to form a layer of underfill encapsulant that is then pre-cured. The integrated circuit is mounted to a substrate and the substrate and the integrated circuit are electrically coupled by a solder reflow operation which also finally cures the underfill encapsulant.

摘要翻译： 描述了在位于晶片上的集成电路上形成底层密封剂层的方法和装置。 作为倒装芯片，集成电路具有导电焊盘，其中大部分具有附着于其上的焊球。 大多数焊球已经被平坦化，以便提供扩大的焊料润湿区域。 将一层底层填料密封剂在压力下注入到集成电路上，以形成一层底层填料密封剂，然后将其预固化。 集成电路安装到基板上，并且基板和集成电路通过回流焊接操作电耦合，焊接回流操作也最终固化底部填充密封剂。

公开(公告)号：US06238949B1

公开(公告)日：2001-05-29

申请号：US09336037

申请日：1999-06-18

申请人： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

发明人： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

IPC分类号： H01L2144

CPC分类号： H01L24/17 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92127 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.

摘要翻译： 公开了一种用于形成芯片上的塑料芯片模块的方法和装置。 通过将堆叠的芯片组放置在适当地布置成接收密封剂的模制室中来形成芯片上的塑料芯片模块。 堆叠的芯片组包括电子和机械耦合到母芯片的子芯片，其中子芯片通过间隙与母芯片直接对准并与母芯片分离。 然后将封装剂填充到填充间隙的模制室中，同时围绕芯片组以形成芯片上的塑料芯片模块。

公开(公告)号：US20120217610A1

公开(公告)日：2012-08-30

申请号：US13037281

申请日：2011-02-28

申请人： Peter J. Hopper ,  Peter Johnson ,  Luu Nguyen ,  Peter Smeys

发明人： Peter J. Hopper ,  Peter Johnson ,  Luu Nguyen ,  Peter Smeys

IPC分类号： H01L29/02 ,  H01L21/762

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13105 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/13647 ,  H01L2224/13686 ,  H01L2224/16145 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1461 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A bonded semiconductor structure is formed in a method that first forms a female semiconductor structure with pyramid-shaped openings and a male semiconductor structure with pyramid-shaped projections, and then inserts the projections into the openings to align the male semiconductor structure to the female semiconductor structure for bonding.

摘要翻译： 键合半导体结构体是以首先形成金字塔状的开口的阴半导体结构体和具有金字塔形突起的阳半导体结构体的方式形成的，然后将凸部插入到开口中，以使阳半导体结构与阴半导体 结合结构。

公开(公告)号：US20070282627A1

公开(公告)日：2007-12-06

申请号：US11841153

申请日：2007-08-20

申请人： Paul Greenstein ,  Galina Grunin ,  Luu Nguyen

发明人： Paul Greenstein ,  Galina Grunin ,  Luu Nguyen

IPC分类号： G06Q50/00

CPC分类号： G06Q30/02

摘要： A service element is defined and represented by a data structure. It includes one or more components and/or one or more other service elements. A service element providing a complete function is a service offering. Management of service elements and/or service offerings is facilitated by a Service Development Tool. In different aspects, the management includes various tasks associated with creating, modifying and deleting service elements, establishing relationships, error checking and optimization. In a further aspect, service elements are packaged and distributed to enable customers to deliver the service elements. Additionally, the hosting of software packages is facilitated.

摘要翻译： 服务元素由数据结构定义和表示。 它包括一个或多个组件和/或一个或多个其他服务元素。 提供完整功能的服务元素是服务提供。 服务开发工具便于管理服务元素和/或服务。 在不同方面，管理包括与创建，修改和删除服务元素，建立关系，错误检查和优化相关的各种任务。 在另一方面，服务元件被打包和分发以使客户能够传递服务元素。 此外，还促进了软件包的托管。

公开(公告)号：US07098540B1

公开(公告)日：2006-08-29

申请号：US10729389

申请日：2003-12-04

申请人： Jitendra Mohan ,  Luu Nguyen ,  Alan Segervall ,  Stephen Gee

发明人： Jitendra Mohan ,  Luu Nguyen ,  Alan Segervall ,  Stephen Gee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/30107

摘要： The invention discloses an electrical interconnect with minimal parasitic capacitance. In one embodiment, an apparatus comprises a semiconductor substrate, and first and second support structures formed on the substrate, where the second support structure at least partially surrounds the first support structure on the substrate. The first and second support structures are each configured to support an electrical connector to be formed over the first and second support structures on the substrate.

摘要翻译： 本发明公开了一种具有最小寄生电容的电互连。 在一个实施例中，一种装置包括半导体衬底，以及形成在衬底上的第一和第二支撑结构，其中第二支撑结构至少部分地围绕衬底上的第一支撑结构。 第一和第二支撑结构各自被配置为支撑要形成在基板上的第一和第二支撑结构上的电连接器。

公开(公告)号：US20060130140A1

公开(公告)日：2006-06-15

申请号：US11011654

申请日：2004-12-14

申请人： Dmitrii Andreev ,  Luu Nguyen ,  Gregory Vilshansky

发明人： Dmitrii Andreev ,  Luu Nguyen ,  Gregory Vilshansky

IPC分类号： G06F12/14

CPC分类号： H04L63/1458 ,  H04L63/08 ,  H04L2463/141

摘要： A client application server includes a client server, a proxy authentication server, and an authentication server. The proxy authentication server maintains a set of one or more authentication rules and an authentication request table. The client server is responsive to an authentication request from a user including a user identifier for directing the authentication request to the proxy authentication server for searching the authentication request table for entries for the client; responsive to finding one or more entries, applying the filter rules; responsive failing a filter rule, rejecting the authentication request in a response message to the client server; and responsive to passing all relevant filter rules, directing the authentication request to the authentication server for authenticating the user.

摘要翻译： 客户机应用服务器包括客户端服务器，代理认证服务器和认证服务器。 代理认证服务器维护一组一个或多个认证规则和认证请求表。 客户端服务器响应于来自用户的认证请求，包括用于将认证请求引导到代理认证服务器的用户标识符，用于向认证请求表搜索客户端的条目; 响应于找到一个或多个条目，应用过滤器规则; 响应失败过滤规则，拒绝在客户端服务器的响应消息中的认证请求; 并且响应于通过所有相关的过滤规则，将认证请求引导到认证服务器以认证用户。

公开(公告)号：US20050278276A1

公开(公告)日：2005-12-15

申请号：US10855677

申请日：2004-05-27

申请人： Dmitrii Andreev ,  Jagadish Dasari ,  Luu Nguyen ,  Gregory Vilshansky

发明人： Dmitrii Andreev ,  Jagadish Dasari ,  Luu Nguyen ,  Gregory Vilshansky

IPC分类号： G06F7/00 ,  G06F17/30

CPC分类号： G06F17/30528 ,  G06F17/30483

摘要： A method, system, and computer program product for processing a database query by a proxy server that is adapted to communicate with at least one database server. The database servers are respectively coupled to corresponding databases having tables that include a data isolation field pertaining to a group having subgroups. The data isolation field identifies a subgroup. The proxy server receives the query from an application server. The query is a request for data stored one of the databases. The proxy server determines whether the query has a data isolation problem. If the query does not have a data isolation problem, then the proxy server obtains a response to the query from one of the database servers and forwards the response to the application server. Otherwise, the proxy server records that a query error has occurred and returns an error code and/or empty dataset to the application server.

摘要翻译： 一种用于处理适于与至少一个数据库服务器进行通信的代理服务器进行数据库查询的方法，系统和计算机程序产品。 数据库服务器分别耦合到具有包括与具有子组的组有关的数据隔离字段的表的相应数据库。 数据隔离字段标识一个子组。 代理服务器从应用程序服务器接收查询。 查询是存储数据库之一的数据请求。 代理服务器确定查询是否具有数据隔离问题。 如果查询没有数据隔离问题，则代理服务器从其中一个数据库服务器获取对查询的响应，并将响应转发给应用程序服务器。 否则，代理服务器记录发生查询错误，并将错误代码和/或空数据集返回给应用程序服务器。

公开(公告)号：US06384397B1

公开(公告)日：2002-05-07

申请号：US09634138

申请日：2000-08-08

申请人： Hem Takiar ,  Ashok Prabhu ,  Luu Nguyen

发明人： Hem Takiar ,  Ashok Prabhu ,  Luu Nguyen

IPC分类号： H01L2700

CPC分类号： H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An imaging sensor module assembly adapted to be mounted to a substrate for use in electronic imaging devices. The imaging sensor includes an optical lens, and a sensor package having a sensor surface containing an optical detector portion. The sensor further includes a plurality of sensor contacts in electrical communication with the optical detector portion. A flex circuit includes a plurality of circuits terminating at respective terminals electrically coupled to a corresponding sensor contact. The module assembly further includes a lens housing assembly configured to support the optical lens, and a barrel portion adapted to fixedly couple to the sensor package. This coupling orients the lens a predetermined focal length from the sensor package such that light waves passing through the lens are focused onto the optical detector portion.

摘要翻译： 一种适于安装到用于电子成像装置的基板上的成像传感器模块组件。 成像传感器包括光学透镜和具有包含光学检测器部分的传感器表面的传感器封装。 传感器还包括与光学检测器部分电连通的多个传感器触点。 柔性电路包括多个电路，其端接在与相应的传感器触点电耦合的各个端子处。 模块组件还包括被配置为支撑光学透镜的镜头壳体组件和适于固定地联接到传感器封装的镜筒部分。 这种耦合将透镜从传感器封装定向到预定的焦距，使得通过透镜的光波聚焦到光学检测器部分上。

公开(公告)号：US06352881B1

公开(公告)日：2002-03-05

申请号：US09359214

申请日：1999-07-22

申请人： Luu Nguyen ,  Nikhil Kelkar ,  Christopher Quentin ,  Ashok Prabhu ,  Hem P. Takiar

发明人： Luu Nguyen ,  Nikhil Kelkar ,  Christopher Quentin ,  Ashok Prabhu ,  Hem P. Takiar

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/27 ,  H01L24/73 ,  H01L24/92 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/1131 ,  H01L2224/1141 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2732 ,  H01L2224/274 ,  H01L2224/2747 ,  H01L2224/27515 ,  H01L2224/27849 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/05552 ,  H01L2224/27 ,  H01L2224/11

摘要： A method and apparatus for forming a layer of underfill adhesive on an integrated circuit located on a wafer surface are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. A layer of underfill adhesive is then formed on the wafer surface such that at least some portion of most of the solder balls remain uncovered. The layer of underfill adhesive is partially cured and the flip chip is then mounted onto a substrate. A solder reflow operation electrically couples the flip chip and the substrate as well as fully cures the underfill adhesive.

摘要翻译： 描述了在位于晶片表面上的集成电路上形成底层填料层的方法和装置。 作为倒装芯片，集成电路具有导电焊盘，其中大部分具有附着于其上的焊球。 然后在晶片表面上形成一层底部填充粘合剂，使得大部分焊球的至少一部分保持未被覆盖。 底层粘合剂层被部分固化，然后将倒装芯片安装到基底上。 焊料回流操作电连接倒装芯片和基板，并且完全固化底部填充粘合剂。

公开(公告)号：US07703993B1

公开(公告)日：2010-04-27

申请号：US12337533

申请日：2008-12-17

申请人： Artur Darbinyan ,  Luu Nguyen ,  Anindya Poddar

发明人： Artur Darbinyan ,  Luu Nguyen ,  Anindya Poddar

IPC分类号： G02B6/36

CPC分类号： G02B6/4214 ,  G02B6/4232

摘要： Optoelectronic packages and wafer level techniques for forming optoelectronic packages are described. In accordance with one apparatus aspect of the invention, a pair of substrates are bonded together to form an optical coupler. A first one of the substrates has a recess that faces the second substrate to at least in part define a channel suitable for receiving an optical transmission medium. A photonic device is mounted on a mounting surface of the second substrate that is opposite its bonded surface. The photonic device faces the reflective surface and an optical path is formed between the channel and the photonic element that both reflects off of the reflective surface and passes through the second substrate. In some embodiments an integrated circuit device and/or solder bumps are also attached to the mounting surface and the second substrate has conductive traces thereon that electrically couple the various electrical components as appropriate (e.g., the photonic device, the integrated circuit device, the solder bumps and/or other components). The substrates may be formed from a wide variety of materials including, glass, plastic and silicon. In some embodiments, at least the second substrate is formed from an optically transparent material and the optical path passes directly though the optically transparent material. In a method aspect of the invention, a variety of wafer level methods for forming such devices are described.

摘要翻译： 描述了用于形成光电封装的光电封装和晶片级技术。 根据本发明的一个装置方面，一对基板结合在一起以形成光耦合器。 基板中的第一个具有面向第二基板的至少部分地限定适于接收光传输介质的通道的凹槽。 光子器件安装在第二衬底的与其接合表面相对的安装表面上。 光子器件面向反射表面，并且在通道和光子元件之间形成光路，两者都从反射表面反射并穿过第二衬底。 在一些实施例中，集成电路器件和/或焊料凸块也附接到安装表面，并且第二衬底在其上具有导电迹线，其上适当地电耦合各种电气部件（例如，光子器件，集成电路器件，焊料 凸块和/或其他部件）。 基板可以由各种各样的材料形成，包括玻璃，塑料和硅。 在一些实施例中，至少第二衬底由光学透明材料形成，并且光路直接通过光学透明材料。 在本发明的方法方面，描述了用于形成这种装置的各种晶片级方法。