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11.发明申请公开(公告)号：US20140231263A1
公开(公告)日：2014-08-21
申请号：US14191061
申请日：2014-02-26
Applicant: MICROFABRICA INC.
Inventor： Uri Frodis , Adam L. Cohen , Michael S. Lockard
IPC: C25D5/48
CPC classification number: C25D5/48 , B33Y10/00 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885 , Y10T156/1052
Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。
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公开(公告)号：US20240097390A1
公开(公告)日：2024-03-21
申请号：US17680211
申请日：2022-02-24
Applicant: Microfabrica Inc.
Inventor： Uri Frodis
Abstract: Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g. probe structures for making contact between two electronic components for example in semiconductor wafer and chip and electronic component test applications). Some embodiments of the invention provide structures that include a core and shell on at least one layer where the layer including the shell is formed from at least one core material and at least one shell material wherein the shell material is different from a shell material or a single structural material on at least one of an immediately preceding layer or an immediately succeeding layer and wherein the core material is different from any core material on at least one of an immediately preceding layer or an immediately succeeding layer.
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公开(公告)号：US20240019463A1
公开(公告)日：2024-01-18
申请号：US18469046
申请日：2023-09-18
Applicant: MICROFABRICA INC.
Inventor： MIchael S. Lockard , Stefano Felici , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/06744 , G01R1/06761 , G01R1/07357
Abstract: Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed. Probes can be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement can occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Arrays can include probes and a substrate to which the probes are bonded with one or more guide plates. Final arrays can include probes held by guide plates with aligned or laterally shifted hole patterns.
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公开(公告)号：US20230201968A1
公开(公告)日：2023-06-29
申请号：US17723348
申请日：2022-04-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/38 , C25D5/02 , B23K26/382
CPC classification number: B23K26/38 , C25D5/028 , B23K26/382
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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15.发明授权公开(公告)号：US10961967B1
公开(公告)日：2021-03-30
申请号：US16551652
申请日：2019-08-26
Applicant: Microfabrica Inc.
Inventor： Gregory P. Schmitz , Ming Ting Wu , Uri Frodis , Eli Baldwin , Gabriel Jacobsohn
Abstract: Embodiments are directed to fuel injectors for internal combustion engines (e.g. engines with reciprocating pistons and with compression-ignition or spark-ignition, Wankel engines, turbines, jets, rockets, and the like) and more particularly to improved nozzle configurations for use as part of such fuel injectors. Other embodiments are directed to enabling fabrication technology that can provide for formation of nozzles with complex configurations and particularly for technologies that form structures via multiple layers of selectively deposited material or in combination with fabrication from a plurality of layers where critical layers are planarized before attaching additional layers thereto or forming additional layers thereon. Other embodiments are directed to methods and apparatus for integrating such nozzles with injector bodies.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20170247807A1
公开(公告)日：2017-08-31
申请号：US15358027
申请日：2016-11-21
Applicant: Microfabrica Inc.
Inventor： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
CPC classification number: C25D5/022 , B81C1/00126 , B81C2201/0109 , B81C2201/019 , C23C18/1605 , C23C18/1651 , C25D1/003 , Y10T156/11 , Y10T156/19
Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
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17.发明授权Methods of forming three-dimensional structures having reduced stress and/or curvature 有权形成具有减小的应力和/或曲率的三维结构的方法公开(公告)号：US09540233B2
公开(公告)日：2017-01-10
申请号：US14194564
申请日：2014-02-28
Applicant: Microfabrica Inc.
Inventor： Ananda H. Kumar , Jorge S. Albarran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC classification number: B81C1/00666 , C25D5/022
Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。
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公开(公告)号：US12000865B2
公开(公告)日：2024-06-04
申请号：US17488176
申请日：2021-09-28
Applicant: Microfabrica Inc.
Inventor： Uri Frodis
CPC classification number: G01R1/06761 , G01R1/06744 , G01R1/07314 , G01R3/00
Abstract: Vertical probes, formed of at least one layer that longitudinally includes a first and a second end and a central portion, with the central portion including at least three compliant arms wherein each of the two outer arms include a material having a yield strength greater than a first amount and the at least one intermediate arm is formed of a material having a yield strength less than the first yield strength amount wherein a yield strength of the material of the intermediate arm has a ratio to that of an outer arm of less than 1, more preferably less than 0.8, even more preferably less than 0.6, and most preferably less than 0.4.
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公开(公告)号：US11999016B2
公开(公告)日：2024-06-04
申请号：US17723348
申请日：2022-04-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/38 , B23K26/382 , C25D5/02 , C25D5/48 , C25D7/00 , G01R1/067 , G01R3/00 , B23K103/00
CPC classification number: B23K26/38 , B23K26/382 , C25D5/028 , C25D5/48 , C25D7/00 , G01R1/06744 , G01R3/00 , B23K2103/56
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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20.发明公开公开(公告)号：US20240094261A1
公开(公告)日：2024-03-21
申请号：US17401252
申请日：2021-08-12
Applicant: Microfabrica Inc.
Inventor： Michael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R3/00 , G01R1/06722 , G01R1/06761
Abstract: Probes for testing (e.g. wafer level testing or socket level testing) of electronic devices (e.g. semiconductor devices) and more particularly, arrays of such probes are provided. Probes are formed by initially fabricating probe preforms in batch with bases and/or ends located in array patterns, directly or indirectly on one or more build substrates with the arrayed preforms being in a longitudinally compressed state and whereafter the preforms are longitudinally plastically deformed to yield probes or partially formed probes with extended longitudinal lengths. Probes may be formed with deformable spring elements formed from one or more single layers which are joined by vertical elements located on other layers or they may be formed by spring elements that are formed as multi-layer structures. Arrays may include probe preforms with laterally overlapping or interlaced structures (but longitudinally displaced) which may remain laterally overlapping or become laterally displaced upon plastic deformation.
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