Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures
    11.
    发明申请
    Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures 有权
    在电化学制造结构期间维持层的平行化和/或实现层的期望厚度的方法和装置

    公开(公告)号:US20140231263A1

    公开(公告)日:2014-08-21

    申请号:US14191061

    申请日:2014-02-26

    Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

    Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构(例如中尺度或微结构)的方法和装置,其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料(例如层)的并行维护。 一些方法涉及在平坦化期间使用夹具,其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具,其相对于第一沉积层或相对于在制造过程期间形成的一些其它层,相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中,平面化可以通过研磨发生,而其他实施例可以使用金刚石切片机。

    Methods of forming three-dimensional structures having reduced stress and/or curvature
    17.
    发明授权
    Methods of forming three-dimensional structures having reduced stress and/or curvature 有权
    形成具有减小的应力和/或曲率的三维结构的方法

    公开(公告)号:US09540233B2

    公开(公告)日:2017-01-10

    申请号:US14194564

    申请日:2014-02-28

    CPC classification number: B81C1/00666 C25D5/022

    Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

    Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置,其中每个层包括至少两种材料的沉积,并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料,其在形成期间包围它,并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组,它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真,而另一些实施例试图平衡应力以最小化失真。

    Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms

    公开(公告)号:US20240094261A1

    公开(公告)日:2024-03-21

    申请号:US17401252

    申请日:2021-08-12

    CPC classification number: G01R3/00 G01R1/06722 G01R1/06761

    Abstract: Probes for testing (e.g. wafer level testing or socket level testing) of electronic devices (e.g. semiconductor devices) and more particularly, arrays of such probes are provided. Probes are formed by initially fabricating probe preforms in batch with bases and/or ends located in array patterns, directly or indirectly on one or more build substrates with the arrayed preforms being in a longitudinally compressed state and whereafter the preforms are longitudinally plastically deformed to yield probes or partially formed probes with extended longitudinal lengths. Probes may be formed with deformable spring elements formed from one or more single layers which are joined by vertical elements located on other layers or they may be formed by spring elements that are formed as multi-layer structures. Arrays may include probe preforms with laterally overlapping or interlaced structures (but longitudinally displaced) which may remain laterally overlapping or become laterally displaced upon plastic deformation.

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