Patent search ap:("Micron Technology Page Inc.") AND inv:"Tongbi Jiang"

11.

发明申请
METHODS OF FORMING A PORUOUS INSULATOR, AND RELATED METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES 审中-公开
Title translation: 形成多孔绝缘体的方法和形成半导体器件结构的相关方法

公开(公告)号：US20140206203A1

公开(公告)日：2014-07-24

申请号：US14222281

申请日：2014-03-21

Applicant: Micron Technology, Inc.

Inventor： Warren M. Farnworth , Tongbi Jiang

IPC: H01L21/02

CPC classification number: H01L21/02203 , H01L21/02126 , H01L21/02282 , H01L21/02345 , H01L21/02354 , H01L21/31695 , H01L21/7682 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00

Abstract: Semiconductor devices with porous insulative materials are disclosed. The porous insulative materials may include a consolidated material with voids dispersed therethrough. The voids may be defined by shells of microcapsules. The voids impart the dielectric materials with reduced dielectric constants and, thus, increased electrical insulation properties.

Abstract translation: 公开了具有多孔绝缘材料的半导体器件。多孔绝缘材料可以包括具有分散在其中的空隙的固结材料。空隙可以由微胶囊的壳定义。空隙赋予介电材料具有降低的介电常数，从而提高电绝缘性能。

12.

发明公开
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS 审中-公开

公开(公告)号：US20240145305A1

公开(公告)日：2024-05-02

申请号：US18405365

申请日：2024-01-05

Applicant: Micron Technology, Inc.

Inventor： Jin Li , Tongbi Jiang

IPC: H01L21/768 , H01L23/00 , H01L25/00 , H01L25/065

CPC classification number: H01L21/76898 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L21/6836 , H01L2221/68359 , H01L2221/68372 , H01L2224/27416 , H01L2224/83102 , H01L2224/92125 , H01L2225/06527 , H01L2225/06541 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311

Abstract: A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

13.

发明授权
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices 有权
Title translation: 用于制造封装的微电子器件的封装的微电子器件和方法

公开(公告)号：US09240385B2

公开(公告)日：2016-01-19

申请号：US14583984

申请日：2014-12-29

Applicant: Micron Technology, Inc.

Inventor： Young Do Kweon , Tongbi Jiang

IPC: H01L21/00 , H01L21/44 , H01L23/00 , H01L21/48 , H01L23/31 , H01L23/498 , H01L23/544 , H01L21/78 , H01L21/56

CPC classification number: H01L24/742 , H01L21/4853 , H01L21/563 , H01L21/566 , H01L21/78 , H01L23/3114 , H01L23/49816 , H01L23/544 , H01L24/11 , H01L24/12 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2223/54426 , H01L2223/54453 , H01L2223/54486 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05569 , H01L2224/0557 , H01L2224/05571 , H01L2224/11013 , H01L2224/11015 , H01L2224/1183 , H01L2224/1184 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/7598 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/384 , H01L2924/00 , H01L2224/05599

Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.

Abstract translation: 本文公开了在半导体工件上形成多个微电子器件的微电子器件和方法。一种这样的方法包括将多个第一互连元件放置在半导体工件的一侧上，在工件侧面上形成层，通过加热第一互连元件来重塑第一互连元件，以及将多个第一互连元件的第一部分单独的第二互连元件到相应的第一互连元件，其中所述单个第二互连元件的第二部分被暴露。

14.

发明申请
MULTI-LENS SOLID STATE LIGHTING DEVICES 有权
Title translation: 多镜头固态照明设备

公开(公告)号：US20140175468A1

公开(公告)日：2014-06-26

申请号：US14047831

申请日：2013-10-07

Applicant: Micron Technology, Inc.

Inventor： Jin Li , Tongbi Jiang

IPC: H01L33/58 , H01L33/50 , H01L33/08

CPC classification number: H01L33/58 , H01L25/0753 , H01L33/08 , H01L33/50 , H01L33/505 , H01L2924/0002 , Y10T29/49117 , H01L2924/00

Abstract: Solid state lighting (SSL) devices including a plurality of SSL emitters and methods for manufacturing SSL devices are disclosed. Several embodiments of SSL devices in accordance with the technology include a support having a first lead and a second lead, a plurality of individual SSL emitters attached to the support, and a plurality of lenses. Each SSL emitter has a first contact electrically coupled to the first lead of the support and a second contact electrically coupled to the second lead of the support such that the SSL emitters are commonly connected. Each lens has a curved surface and is aligned with a single corresponding SSL emitter.

Abstract translation: 公开了包括多个SSL发射器的固态照明（SSL）设备和用于制造SSL设备的方法。根据该技术的SSL设备的几个实施例包括具有第一引线和第二引线，附接到支撑件的多个单独的SSL发射器和多个透镜的支撑件。每个SSL发射器具有电耦合到支撑件的第一引线的第一触点和电耦合到支撑件的第二引线的第二触点，使得SSL发射器被共同连接。每个镜头都有一个曲面，并与一个对应的SSL发射器对齐。

15.

发明申请
SOLID STATE LIGHTING DEVICES HAVING SIDE REFLECTIVITY AND ASSOCIATED METHODS OF MANUFACTURE 有权
Title translation: 具有侧面反射性的固态照明装置及相关的制造方法

公开(公告)号：US20130240939A1

公开(公告)日：2013-09-19

申请号：US13870740

申请日：2013-04-25

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Jaspreet S. Gandhi , Tongbi Jiang

IPC: H01L33/10

CPC classification number: H01L33/10 , H01L33/0079 , H01L33/0095 , H01L33/46

Abstract: Solid state lighting devices having side reflectivity and associated methods of manufacturing are disclosed herein. In one embodiment, a method of forming a solid state lighting device includes attaching a solid state emitter to a support substrate, mounting the solid state emitter and support substrate to a temporary carrier, and cutting kerfs through the solid state emitter and the substrate to separate individual dies. The solid state emitter can have a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The individual dies can have sidewalls that expose the first semiconductor material, active region and second semiconductor material. The method can further include applying a reflective material into the kerfs and along the sidewalls of the individual dies.

Abstract translation: 本文公开了具有侧反射率和相关制造方法的固态照明装置。在一个实施例中，形成固态照明装置的方法包括将固态发射器附接到支撑衬底，将固态发射器和支撑衬底安装到临时载体上，以及通过固态发射器和衬底切割缝隙以分离个人死亡固态发射器可以具有第一半导体材料，第二半导体材料和第一和第二半导体材料之间的有源区。各个管芯可以具有露出第一半导体材料，有源区和第二半导体材料的侧壁。该方法还可以包括将反射材料施加到切口中并且沿着各个模具的侧壁。

16.

发明授权
Packaged integrated circuit devices with through-body conductive vias, and methods of making same 有权

公开(公告)号：US10593653B2

公开(公告)日：2020-03-17

申请号：US14802941

申请日：2015-07-17

Applicant: Micron Technology, Inc.

Inventor： Tongbi Jiang , Yong Poo Chia

IPC: H01L25/07 , H01L25/00 , H01L23/31 , H01L23/48 , H01L21/768 , H01L21/82 , H01L23/00 , H01L21/56 , H01L23/538 , H01L25/10

Abstract: A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.